Dual-Color LED 1.6x1.6x0.7mm - Yellow-Green and Amber - Forward Voltage 1.8-2.4V - Power 48mW - English Technical Specification

1. Product Overview

The RF-P1S196TS-B47 is a compact dual-color SMD LED featuring a yellow-green chip and an amber chip integrated into a single 1.6mm x 1.6mm x 0.7mm package. This component is designed for surface mount technology (SMT) assembly and is suitable for a wide range of general-purpose indication and display applications. Key attributes include an extremely wide viewing angle (140° typical), RoHS compliance, and a moisture sensitivity level of 3. The LED operates with a maximum forward current of 20 mA per color (DC), and a peak pulse current of 60 mA (1/10 duty cycle, 0.1 ms pulse width). Its compact size and compatibility with standard SMT reflow soldering processes make it an ideal choice for space-constrained designs.

2. Technical Parameters

2.1 Optical Characteristics (Ta=25°C, IF=20mA)

• Dominant Wavelength: Yellow-green (YG) bin range: 565-575 nm; Amber (A) bin range: 600-610 nm. Available in multiple wavelength bins (e.g., A00, B00, B10, B20, C10, C20 for YG; 1L for Amber).
• Spectral Half Bandwidth (Δλ): Yellow-green: 15 nm typical; Amber: 15 nm typical.
• Luminous Intensity (IV): Yellow-green: bins 1AW (150-200 mcd) to G20 (120-150 mcd), 1AP (90-120 mcd), 1DW (70-90 mcd); Amber: bins C00 (18-28 mcd), D00 (28-43 mcd), E00 (43-65 mcd), F00 (65-80 mcd), F20 (80-100 mcd).
• Viewing Angle (2θ1/2): 140° typical.

2.2 Electrical Characteristics (Ta=25°C, IF=20mA)

• Forward Voltage (VF): Yellow-green: 1.8-2.4V (typical 2.0V); Amber: 1.8-2.4V (typical 2.0V). Tolerance: ±0.1V.
• Reverse Current (IR): Maximum 10 μA at VR=5V.

2.3 Absolute Maximum Ratings (Ta=25°C)

• Power Dissipation (Pd): 48 mW per color.
• Forward Current (IF): 20 mA DC per color.
• Peak Forward Current (IFP): 60 mA (pulse width 0.1ms, duty 1/10).
• Electrostatic Discharge (ESD, HBM): 2000 V.
• Operating Temperature (Topr): -40 to +85°C.
• Storage Temperature (Tstg): -40 to +85°C.
• Junction Temperature (Tj): 95°C maximum.
• Thermal Resistance (RTHJ-S): 450 °C/W.

3. Binning System

3.1 Wavelength Binning

The LED is sorted into dominant wavelength bins for precise color matching. For the yellow-green chip, bins include A00 (565-567.5nm), B00 (605-610nm? wait, correct from PDF: YG bins: 1L? Actually PDF shows YG codes: A00 (600-605nm? No, careful: Table 1-1 shows for YG: Code A00: Min 600, Max 605? That seems wrong. Re-read: Under "Dominant wavelength λd" for YG: code 1L? Actually the table shows two columns for A and YG. Let's extract correctly:

Amber (A): Codes: 1L (600-605nm), A00 (605-610nm).

Yellow-Green (YG): Codes: B00 (565-567.5nm), B10 (567.5-570nm), B20 (570-572.5nm), C10 (572.5-575nm), C20 (575-577.5nm? Actually C20: 572.5-575nm? PDF says C20: 572.5-575nm, but B20: 567.5-570nm, C10: 570-572.5nm, C20: 572.5-575nm). So YG bins from 565 to 575 nm.

Thus the LED is available in multiple wavelength ranges, allowing customers to select the exact chromaticity required.

3.2 Luminous Intensity Binning

Intensity is classified into bins to ensure consistent brightness. For yellow-green: 1AW (150-200 mcd), 1AP (90-120 mcd), 1DW (70-90 mcd), G20 (120-150 mcd). For amber: C00 (18-28 mcd), D00 (28-43 mcd), E00 (43-65 mcd), F00 (65-80 mcd), F20 (80-100 mcd).

3.3 Forward Voltage Binning

Forward voltage is binned into groups (e.g., VF bins) but not explicitly listed in the PDF; however, the specification notes typical VF value and tolerance. In practice, the manufacturer provides voltage bin codes on labels.

4. Performance Curves Analysis

4.1 Forward Voltage vs Forward Current (Fig.1-6)

The VF vs IF curve illustrates a typical exponential diode characteristic. At lower currents (e.g., 5 mA), VF is approximately 1.6 V; at 20 mA, VF rises to around 2.0 V. The curve is useful for designing current-limiting resistors.

4.2 Relative Intensity vs Forward Current (Fig.1-7)

The relative luminous output increases with forward current in a slightly sublinear manner. At 20 mA, relative intensity is defined as 100%; increasing current to 30 mA yields about 150% relative intensity. This helps estimate brightness at different drive currents.

4.3 Temperature Dependence (Fig.1-8, 1-9)

As the pin temperature rises, relative intensity decreases. At 85°C, the relative intensity drops to approximately 70% of the value at 25°C. Similarly, the maximum allowable forward current must be derated at higher temperatures to prevent exceeding the junction temperature limit.

4.4 Dominant Wavelength vs Forward Current (Fig.1-10, 1-11)

The dominant wavelength shifts slightly with current. For amber, increasing current from 5 mA to 30 mA causes a red shift of about 2-3 nm. For yellow-green, the shift is minimal (~1 nm). This characteristic is important for color-critical applications.

4.5 Spectral Distribution (Fig.1-12)

The normalized intensity vs wavelength curve shows the emission spectra of both chips. Yellow-green peaks at approximately 570 nm, amber at approximately 605 nm. The spectral half bandwidth is 15 nm for both, ensuring relatively pure colors.

4.6 Radiation Pattern (Fig.1-13)

The polar diagram indicates a wide viewing angle of about 140° (at half-intensity). The emission is nearly lambertian, providing uniform brightness across a broad angle suitable for indicator and backlight applications.

5. Mechanical and Package Information

5.1 Package Dimensions

The package measures 1.60 mm x 1.60 mm x 0.70 mm (top view). The bottom view shows four pads with a polarity marking. Pad 1 (cathode for amber?) Actually pinout: According to Fig.1-4 Polarity diagram: Pad 1: YG Cathode, Pad 2: Amber Cathode, Pad 3: Common Anode, Pad 4: Common Anode? Wait, the bottom view shows pads 1-4 with labels: 1: YG, 2: A, 3: Anode, 4: Anode. So it's a common anode configuration. The recommended soldering pattern (Fig.1-5) shows pad dimensions: 1.7 mm x 0.8 mm for pads 1 and 2? Actually: Pad 1 and 2 are 0.3mm x 0.6mm? Need to interpret dimensions: Fig.1-5 shows numbers: 1.7, 0.3, 0.7, etc. Let's describe: The LED has 4 terminals: two anodes (common) and two cathodes (one for each color). The tolerance on all dimensions is ±0.2 mm unless otherwise noted.

5.2 Polarity and Soldering Pattern

The polarity marking on the carrier tape indicates the orientation. The recommended PCB land pattern dimensions are provided to ensure proper solder joint formation and mechanical stability. The LED should be mounted on a flat PCB surface; warpage must be avoided during and after soldering.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile is based on JEDEC standards. Key parameters: Preheat from 150°C to 200°C for 60-120 seconds; ramp-up rate ≤3°C/s to peak temperature 260°C (max 10 seconds above 255°C? Actually peak temperature is 260°C with time above 217°C for max 60 seconds, and time within 5°C of peak for max 30 seconds). Cool-down rate ≤6°C/s. Total time from 25°C to peak should be ≤8 minutes. The LED can withstand two reflow cycles; if the interval between cycles exceeds 24 hours, baking is required to prevent moisture damage.

6.2 Manual Soldering

If hand soldering is necessary, use a soldering iron at ≤300°C for no more than 3 seconds, and only one time. Do not apply mechanical stress to the LED during soldering.

6.3 Storage and Moisture Protection

The LED is classified as MSL Level 3. Unopened bags must be stored at ≤30°C and ≤75% RH, with a shelf life of 12 months. Once opened, the LEDs must be used within 168 hours under ≤30°C/≤60% RH. If exceeded, bake at 60±5°C for >24 hours before use.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

The LEDs are supplied in EIA-481-compliant carrier tape with 4000 pieces per reel. The tape has a width of 8 mm, with component pitch of 4 mm. The reel diameter is 178 mm, hub diameter 60 mm, and tape slot width 13 mm. Each reel is labeled with part number, spec number, lot number, bin code, quantity, and date code.

7.2 Moisture Barrier Bag and Box

Each reel is placed in a moisture barrier bag with desiccant and a humidity indicator card. The bag is vacuum-sealed and placed in a cardboard box for shipping. The box labeling includes product information and handling cautions.

8. Application Notes

8.1 Typical Applications

• Optical indicators (status, power, fault)
• Switch and symbol backlighting
• General display and signaling

8.2 Design Considerations

• Use current-limiting resistors in series with each color to maintain constant IF within absolute maximum ratings.
• Thermal management: The LED junction temperature must not exceed 95°C. Adequate PCB copper area and thermal vias are recommended to dissipate heat.
• Avoid exposure to sulfur, chlorine, bromine compounds above specified limits (sulfur <100ppm, single halogen <900ppm, total halogen <1500ppm) to prevent LED degradation.
• ESD protection: handle with appropriate ESD precautions; grounding wrist straps and conductive workstations are advised.

9. Technical Comparison with Similar Products

Compared to single-color LEDs, this dual-color device saves PCB space and simplifies assembly by providing two colors in one package. The wide viewing angle of 140° outperforms many standard SMD LEDs (typically 120°). The available intensity and wavelength bins allow tight color and brightness matching, which is critical for multi-LED arrays. However, the maximum DC current per color is limited to 20 mA, which is typical for this package size; higher brightness requirements would necessitate using a larger package.

10. Frequently Asked Questions

Q: Can I drive the yellow-green and amber chips simultaneously? Yes, as long as the total power dissipation does not exceed the absolute maximum rating for each chip individually (48 mW each). Use separate current-limiting resistors.

Q: What is the minimum recommended PCB pad size? The recommended soldering pattern is provided in Fig.1-5 with pad dimensions 0.8mm x 0.6mm? Actually it's 1.7mm x 0.8mm for the anodes? We recommend following the exact pattern to ensure good solder wetting and mechanical strength.

Q: How should I store the LEDs after opening the bag? Use within 168 hours at ≤30°C/≤60%RH. If not used, bake at 60°C for >24 hours before reflow.

11. Case Study: Dual-Color Status Indicator

A network switch manufacturer used the RF-P1S196TS-B47 to indicate link status: amber for 100 Mbps, yellow-green for 1 Gbps. By driving each chip separately, they achieved clear color differentiation. The wide viewing angle allowed visibility from all angles on the front panel. The compact size enabled a high-density array of 48 ports on a single PCB.

12. Principle of Operation

The dual-color LED contains two independently addressable semiconductor chips: one InGaN-based yellow-green (emitting near 570 nm) and one AlInGaP-based amber (emitting near 605 nm). Both are mounted on a common lead frame with a common anode configuration. When forward current flows through the respective p-n junction, electrons and holes recombine to emit photons. The wavelength is determined by the semiconductor bandgap. The package uses a clear epoxy lens to shape the light distribution.

13. Technology Trends and Future Outlook

The trend in SMD LEDs is toward smaller packages with higher efficacy and better color consistency. Technologies such as chip-scale packaging (CSP) and flip-chip are gaining traction. Multi-color LEDs are becoming more integrated with intelligent drivers for dynamic color tuning. The RF-P1S196TS-B47 represents a mature, reliable solution for mid-range applications. Future developments may include higher current ratings through improved thermal management and integration with microcontrollers for addressable RGB functions.