Dual Color LED 3.0x2.5x1.4mm - Forward Voltage 1.8-3.6V/1.8-2.4V - Power Dissipation 72mW/108mW - Orange/Blue English Technical Datasheet

1. Product Overview

This product is a dual-color Light Emitting Diode (LED) that integrates an orange chip and a blue chip within a single surface-mount package. The package dimensions are 3.0mm x 2.5mm x 1.4mm. It is designed for general-purpose indicator and display applications where two distinct colors are required. The device is compatible with standard SMT assembly processes and is RoHS compliant. Its moisture sensitivity level is classified as Level 3, requiring proper handling after opening. The narrow viewing angle of 60 degrees provides focused light output, making it suitable for applications requiring high directionality.

2. Technical Parameter Analysis

2.1 Electrical and Optical Characteristics

All characteristics are measured at Ts = 25°C unless otherwise noted. The LED exhibits a spectral half bandwidth of 15nm for both chips. The forward voltage (VF) is binned into multiple codes for each color to ensure tight electrical sorting. For the orange chip, VF ranges from 1.8V to 3.6V across bins B1 through J0. For the blue chip, VF ranges from 1.8V to 2.4V across bins B1 through D2. The dominant wavelength (λd) for orange is between 615nm and 630nm, while for blue it is between 460nm and 470nm, both measured at 20mA. Luminous intensity (IV) at 20mA ranges from 230mcd to 1200mcd for both colors, with multiple intensity bins (I00, J00, K00, L00) for fine sorting. The viewing angle (2θ1/2) is 60 degrees. Reverse current at VR=5V is limited to a maximum of 10μA. The thermal resistance from junction to solder point (RTHJ-S) is 450°C/W.

2.2 Absolute Maximum Ratings

The absolute maximum ratings define the limits beyond which the device may be damaged. Power dissipation (Pd) is 72mW for the orange chip and 108mW for the blue chip. Maximum forward current (IF) is 30mA per chip. Peak forward current (IFP) can reach 60mA at 1/10 duty cycle and 0.1ms pulse width. Electrostatic discharge tolerance (HBM) is 1000V. Operating temperature range (Topr) is -40°C to +85°C, and storage temperature (Tstg) is also -40°C to +85°C. The junction temperature (Tj) must not exceed 95°C. It is critical to ensure that power dissipation does not exceed these limits, and proper thermal management must be implemented.

3. Binning System

The LED is sorted into multiple bins to provide narrow distributions of key parameters. Forward voltage bins for both colors are defined as per the specification table. For orange: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V), G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V), J0 (3.4-3.6V). For blue: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V). Dominant wavelength bins: Orange – D00 (615-620nm), E00 (620-625nm), F00 (625-630nm); Blue – C00 (460-465nm), D00 (465-470nm). Luminous intensity bins for both colors: I00 (230-350mcd), J00 (350-530mcd), K00 (530-800mcd), L00 (800-1200mcd). The bin code on the label provides full information.

4. Performance Curves Analysis

The typical optical characteristics curves are provided for design reference. The forward voltage vs. forward current curve (Fig.1-6) shows the exponential relationship typical of LEDs. The forward current vs. relative intensity curve (Fig.1-7) demonstrates that the relative light output increases linearly with current up to 30mA. The pin temperature vs. relative intensity curve (Fig.1-8) indicates a gradual decrease in intensity as temperature rises, with approximately 10% reduction at 100°C. The pin temperature vs. forward current curve (Fig.1-9) shows the allowable forward current derating as pin temperature increases. The forward current vs. dominant wavelength curves (Fig.1-10, Fig.1-11) reveal a slight red-shift for the orange chip and a slight blue-shift for the blue chip as current increases. The relative intensity vs. wavelength spectrum (Fig.1-12) shows the spectral distribution of both chips with peak wavelengths around 623nm for orange and 467nm for blue. The radiation pattern (Fig.1-13) confirms a 60-degree viewing angle with a typical Lambertian-like distribution.

5. Mechanical and Packaging Information

The package outline dimensions are 3.00mm x 2.50mm x 1.40mm with tolerances of ±0.2mm. The top view shows two LED chips: one orange (O) and one blue (B), with a common anode and separate cathodes as per polarity marking in the bottom view. The soldering patterns (recommended pad layout) are provided for optimal thermal and electrical connection. The carrier tape dimensions are: width 8.00mm, pitch 4.00mm, with a component cavity depth of 1.6mm. The reel dimensions are: A=8.0±0.1mm, B=178±1mm, C=60±1mm, D=13.0±0.5mm. Each reel contains 2500 pcs. The label includes part number, spec number, lot number, bin code (including flux, chromaticity bin, forward voltage, wavelength), quantity, and date.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering

The recommended reflow profile is based on JEDEC standards. Average ramp-up rate from Tsmin to Tp should not exceed 3°C/s. Preheat: Tsmin=150°C, Tsmax=200°C, time 60-120s. Time above 217°C (TL) should be 60-150s. Peak temperature (Tp) is 260°C with a maximum time (tp) of 10s. Time within 5°C of actual peak temperature is limited to 30s. Cooling rate should not exceed 6°C/s. Total time from 25°C to Tp should be within 8 minutes. Reflow soldering must not be performed more than twice, with at least 24 hours between runs. Hand soldering: iron temperature below 300°C for less than 3 seconds, only once. Repairing after soldering is not recommended; if unavoidable, use a double-head soldering iron and verify that the LED characteristics are not affected.

6.2 Handling Precautions

Do not mount LEDs on warped PCB. After soldering, avoid mechanical stress or rapid cooling. The operating environment should limit sulfur compounds to below 100PPM. Halogen content (bromine and chlorine) must be controlled: single <900PPM, total <1500PPM. VOCs from fixture materials can penetrate the silicone encapsulant and cause discoloration; compatibility testing is recommended. Use isopropyl alcohol for cleaning; ultrasonic cleaning is not recommended. Storage conditions: before opening, ≤30°C and ≤75% RH, shelf life 1 year; after opening, ≤30°C and ≤60% RH, usage within 168 hours. If moisture has been absorbed, bake at 60±5°C for >24 hours.

7. Packaging and Ordering Information

The LEDs are delivered in tape and reel packaging with 2500 pieces per reel. The carrier tape is antistatic and the reel is standard EIA-481. A moisture barrier bag with desiccant and humidity indicator card ensures dry storage. The outer cardboard box contains multiple reels for bulk shipment. Ordering information should include the complete part number and bin code specification. Example part number: RF-P13025TS-B37 (note: internal reference, actual ordering should specify desired bins).

8. Application Suggestions

When designing a circuit, always include a current-limiting resistor to prevent excessive current due to voltage variations. The LED must never be driven beyond the absolute maximum ratings. Thermal management is critical: ensure proper heat sinking to keep junction temperature below 95°C. For dual-color operation, each chip can be controlled independently via separate cathodes. Avoid applying reverse voltage as it may cause damage. For high-reliability applications, consider derating forward current at elevated ambient temperatures. In environments with high sulfur or halogen content, select materials that comply with the recommended limits. Use appropriate ESD protection during handling and assembly.

9. Technical Comparison

Compared to using two separate single-color LEDs, this dual-chip package offers significant space savings on the PCB, reduced component count, and improved optical alignment. The narrow viewing angle provides higher on-axis intensity, beneficial for point indicators. The availability of fine bins allows designers to match LEDs precisely for consistent color and brightness. The thermal resistance is relatively higher (450°C/W) compared to some power LEDs, so for high-current applications, thermal management must be carefully considered.

10. Frequently Asked Questions

Q1: How do I choose the correct forward voltage bin?

Select a bin that matches your driver voltage and current. For a 5V supply with a resistor, choose a VF bin that allows enough headroom for the resistor voltage drop.

Q2: What is the effect of temperature on wavelength?

As junction temperature increases, the dominant wavelength shifts slightly: orange shifts toward longer wavelengths (red-shift), blue shifts toward shorter wavelengths (blue-shift). The exact shift can be derived from the typical curves.

Q3: How should I handle ESD sensitivity?

Use grounded workstations, antistatic wrist straps, and conductive packaging. The device is rated to 1000V HBM, but stronger ESD events may cause damage.

Q4: What is the storage life after opening the moisture barrier bag?

168 hours under ≤30°C and ≤60% RH. If not used within this time, bake before use.

11. Practical Application Examples

Typical applications include status indicators (e.g., orange for warning, blue for normal operation), backlighting for switches and symbols, and general-purpose display lighting. The dual-color capability allows for bi-color signaling without requiring additional PCB space. For example, a single indicator can show off (no light), standby (blue), and active (orange). The narrow beam angle is ideal for applications where light must be directed precisely, such as in front-panel indicators or small signs.

12. Working Principle

An LED is a semiconductor device that emits light through electroluminescence. When forward current flows across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The orange chip is typically based on AlGaInP (aluminum gallium indium phosphide) material system, while the blue chip is based on InGaN (indium gallium nitride). Both chips are encapsulated in a clear or diffused silicone lens to protect the wire bonds and provide the desired viewing angle.

13. Development Trends

The LED industry continues to pursue higher efficacy (lm/W), better color consistency, and smaller package sizes. Dual-color and multi-color LEDs are becoming more integrated with advanced packaging techniques such as chip-scale packaging (CSP) and system-in-package (SiP). Improved thermal interface materials and better die attachment methods help lower thermal resistance, allowing higher drive currents. Additionally, binning precision is improving with automated sorting, enabling tighter tolerance for demanding applications like automotive and medical lighting. Silicone lens materials are being developed to resist yellowing and improve reliability in harsh environments. Overall, the trend is toward more compact, efficient, and reliable multi-color LED solutions.