Dual-Color LED 1.6x1.6x0.7mm 1.8V-2.4V 48mW Yellow/Yellow-Green RF-P1S196TS-B51 Technical Specifications

1. Product Overview

1.1 General Description

The RF-P1S196TS-B51 is a compact dual-color surface-mount LED fabricated using a yellow chip and a yellow-green chip. It comes in a 1.6mm x 1.6mm x 0.7mm package, making it suitable for space-constrained applications. This LED is designed for general-purpose optical indication, switches, symbols, and displays. It supports all standard SMT assembly and soldering processes and is RoHS compliant. The moisture sensitivity level is rated at Level 3 per JEDEC standards.

1.2 Features

• Extremely wide viewing angle (140° typical).
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3.
• RoHS compliant.
• Small footprint: 1.6mm x 1.6mm.
• Low height: 0.7mm.

1.3 Application

Optical indicators, switch and symbol illumination, display backlighting, and general-purpose signal indication in consumer electronics, automotive interiors, and industrial control panels.

2. Technical Parameter Interpretation

2.1 Electrical and Optical Characteristics (at T_s=25°C, I_F=20mA)

The LED provides two color channels: yellow (Y) and yellow-green (YG). Key parameters are specified under test conditions of 20mA forward current and 25°C ambient temperature.

2.2 Absolute Maximum Ratings

Exceeding these values may cause permanent damage. Operating beyond recommended conditions is not advised.

3. Binning System

The LED is binned for dominant wavelength, luminous intensity, and forward voltage to ensure consistency. The yellow channel is binned into D00 (585-590nm) and E00 (590-595nm). The yellow-green channel is binned into B10 (565-567.5nm), B20 (567.5-570nm), C10 (570-572.5nm), and C20 (572.5-575nm). Luminous intensity bins for yellow range from 70 to 200 mcd (bins 1DW, 1AP, G20, 1AW), while yellow-green ranges from 18 to 100 mcd (bins C00, D00, E00, F00, F20). Forward voltage is binned into one code (1L) with typical range 1.8-2.4V. Binning information is encoded on the reel label as "BIN CODE" and separate codes for wavelength (WLD) and forward voltage (VF).

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

At low currents (0-5mA), forward voltage increases rapidly; above 5mA, the slope reduces. The curve is typical for GaP-based LEDs. At 20mA, forward voltage is approximately 2.0V for both chips.

4.2 Forward Current vs. Relative Intensity

Relative intensity increases linearly with forward current up to 20mA, with no saturation observed within the recommended range. Higher current yields higher light output but must remain within absolute maximum ratings.

4.3 Temperature Dependence

Relative intensity decreases as ambient temperature rises. At 100°C, output drops to about 80% of room-temperature value. Forward current derating is necessary above 60°C to avoid exceeding junction temperature limit (95°C). The pin temperature vs. forward current curve shows linear derating from 20mA at 25°C to zero at approximately 115°C.

4.4 Wavelength Shift vs. Current

Dominant wavelength increases slightly with forward current for both colors. For yellow, the shift is from ~589nm at 0mA to ~596.5nm at 30mA. For yellow-green, it shifts from ~567nm to ~575nm over the same current range. This effect is due to junction heating and bandgap narrowing.

4.5 Spectral Distribution and Radiation Pattern

The yellow chip peaks near 590-595nm, the yellow-green chip near 565-575nm. Both have a spectral half bandwidth of about 15nm, providing relatively pure color. The radiation pattern is Lambertian-like with a wide half-angle of 140°, ensuring uniform illumination over a broad area.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 1.6mm (length) × 1.6mm (width) × 0.7mm (height). The top view shows a 1.1mm×0.9mm light-emitting area. The side view shows a 0.3mm substrate thickness. The bottom view indicates four solder pads: pads 1 (cathode for yellow? polarity mark), 2 (anode for yellow), 3 (anode for yellow-green), 4 (cathode for yellow-green). The recommended soldering pattern uses a 0.8mm pad pitch and 0.6mm pad spacing. Polarity is indicated by a corner mark (pin 1 identification).

5.2 Carrier Tape and Reel

Tape dimensions: width 8.0mm, pitch 4.0mm, pocket size 1.83×1.83mm, depth 0.95mm. Reel diameter: 178mm (7 inches), width 8.0±0.1mm, hub diameter 60±1mm, arbor hole 13.0±0.5mm. Each reel contains 4000 pieces. The reel label includes part number, spec number, lot number, bin code, quantity, and date.

5.3 Moisture Barrier Packaging

The reel is sealed in a moisture barrier bag with desiccant and a humidity indicator card. The outer box is a standard cardboard carton for mechanical protection. Storage conditions: before opening, ≤30°C and ≤75% RH for up to 1 year from date of production; after opening, ≤30°C and ≤60% RH for 168 hours. If storage conditions are exceeded, baking at 60±5°C for >24 hours is required.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering

Lead-free reflow profile: preheat from 150°C to 200°C for 60-120 seconds; ramp-up to 217°C (TL) at max 3°C/s; maintain above 217°C for 60-150 seconds; peak temperature 260°C with time above 260°C (tp) max 10 seconds; cooling rate max 6°C/s. Total time from 25°C to peak temperature should not exceed 8 minutes. Do not perform reflow more than twice. If interval exceeds 24 hours between reflows, baking is required.

6.2 Hand Soldering and Repair

Hand soldering: iron tip temperature ≤300°C, duration ≤3 seconds, one time only. Repair after reflow should be avoided; if necessary, use a double-head soldering iron and verify LED functionality.

6.3 General Precautions

• Do not mount LEDs on warped PCBs or bend the board after soldering.
• Avoid mechanical stress or vibration during cooling after soldering.
• Do not rapidly cool the device after soldering.
• Use appropriate cleaning agents (isopropyl alcohol recommended); avoid ultrasonic cleaning.
• The operating environment should limit sulfur compounds to <100 ppm, bromine to <900 ppm, chlorine to <900 ppm, and total halogens to <1500 ppm to prevent LED damage.
• Use proper ESD control measures; the LED is rated for 2kV HBM.

7. Packaging and Ordering Information

Standard packaging: 4000 pieces per reel in tape and reel format. The outer box contains multiple reels (quantity may vary). Each reel is labeled with part number, spec number, lot number, bin codes (for wavelength and intensity), quantity, and date code. The moisture barrier bag includes a desiccant pack and a humidity indicator to monitor exposure. Ordering should specify the desired bin combination for wavelength and intensity if tight tolerance is required.

8. Application Recommendations

8.1 Typical Uses

Ideal for status indicators, pushbutton backlighting, small displays, and any application requiring two colors in a tiny footprint. The wide viewing angle makes it suitable for edge-lit or diffused panels.

8.2 Design Considerations

• Heat dissipation: Given thermal resistance of 450°C/W, adequate PCB copper area and vias are recommended to maintain junction temperature below 95°C. Derate forward current if ambient temperature exceeds 60°C.
• Current limiting: Always use series resistors to prevent thermal runaway. A small change in voltage (e.g., 0.1V) can cause significant current variation due to the steep IV curve.
• Reverse voltage protection: Ensure the driving circuit does not apply reverse bias, as it may damage the LED.
• Compatibility with adhesives: Avoid adhesives that outgas organic vapors, which can discolor the silicone encapsulation.
• Cleaning: If cleaning is required, isopropyl alcohol is safe; avoid solvents that attack the package.

9. Technical Comparison with Competing Products

Compared to other dual-color 1.6×1.6mm LEDs, the RF-P1S196TS-B51 offers a very wide viewing angle (140° vs typical 120°) and a low thermal resistance (450°C/W is competitive for this package size). The binning options provide 2 wavelength bins for yellow and 4 for yellow-green, allowing customers to select narrow color ranges. The absolute maximum ESD rating of 2kV is standard for chip LEDs. The inclusion of explicit halogen and sulfur handling guidelines indicates robust reliability engineering. Some competing products may offer higher intensity bins but often at the cost of narrower viewing angle or higher voltage. Overall, this LED balances performance, size, and reliability well for general indication.

10. Frequently Asked Questions

Q: Can I drive both chips simultaneously? Yes, both yellow and yellow-green chips can be operated independently or together. Total drive current should not exceed the absolute maximum rating for each chip.

Q: What is the recommended current for best lifetime? Operating at 15-20mA ensures good brightness and long life. Derating is needed at high ambient temperatures.

Q: How should I handle the silicone encapsulation? Avoid touching the lens surface directly; use tweezers on the side of the package. Silicone is soft and can attract dust.

Q: What if the moisture barrier bag is flatulent? If the bag is swollen, the desiccant may be exhausted. Bake the LEDs at 60±5°C for >24 hours before use.

Q: Can I use this LED in outdoor applications? The operating temperature range (-40 to +85°C) allows outdoor use, but direct exposure to UV, high humidity, or corrosive gases should be avoided. Proper conformal coating may be needed.

11. Practical Application Case

Two-Color Status Indicator in a Smart Home Thermostat: A compact thermostat uses the dual-color LED to indicate system status: yellow for heating, yellow-green for cooling. The wide 140° viewing angle ensures visibility from across the room. The small 1.6mm footprint fits into a slim bezel. The thermostat uses an MCU to control each channel via separate GPIO pins with current-limiting resistors. To manage heat, the PCB includes a small copper pad under each LED with thermal vias. The LED is reflow-soldered along with other surface-mount components using the standard profile. The moisture sensitivity is managed by using fresh, unopened reels. Over 1000 hours of life testing at 20mA showed no degradation, confirming reliability.

12. Operating Principle

This dual-color LED integrates two separate LED chips: one yellow (AlGaInP/GaP, wavelength ~590nm) and one yellow-green (GaP, wavelength ~570nm) in a single epoxy or silicone package. Each chip has its own anode and cathode connections. When forward current flows through a chip, electrons and holes recombine in the p-n junction, emitting photons with energy corresponding to the bandgap of the semiconductor material. The light is extracted through the transparent encapsulant. By controlling the current to each chip independently, either color can be produced, or both can be operated simultaneously to create a blended color (e.g., orangeish). The wide beam angle is achieved through a diffusing encapsulant or lens design.

13. Development Trends

The market for dual-color SMD LEDs continues to evolve toward smaller packages (e.g., 1.0×1.0mm) and higher efficacy. Newer materials like InGaN on silicon are being developed for green and blue, but for yellow and yellow-green, AlGaInP remains dominant due to high efficiency. Integration of multiple chips in one package with finer binning and tighter tolerance is expected. Additionally, enhanced reliability against sulfur and halogen exposure is becoming standard, as seen in this datasheet's explicit limits. The trend toward automotive and industrial applications demands wider operating temperature ranges and improved thermal management, which this product partially addresses with its 95°C junction temperature. Future designs may incorporate thermal pads directly underneath the chip to reduce thermal resistance below 300°C/W.