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LTD-2601JS LED Display Datasheet - 0.28-inch Digit Height - AlInGaP Yellow - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

Technical datasheet for the LTD-2601JS, a 0.28-inch dual-digit seven-segment AlInGaP yellow LED display with high brightness, wide viewing angle, and lead-free RoHS compliance.
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PDF Document Cover - LTD-2601JS LED Display Datasheet - 0.28-inch Digit Height - AlInGaP Yellow - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

1. Product Overview

The LTD-2601JS is a dual-digit, seven-segment alphanumeric display module designed for applications requiring clear, bright numeric readouts. Its primary function is to visually represent numbers and some limited characters through individually addressable segments. The core technology utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material, specifically engineered to emit light in the yellow wavelength spectrum. This material choice offers advantages in efficiency and color purity compared to older technologies. The device features a gray faceplate with white segment markings, providing high contrast for optimal legibility under various lighting conditions. It is categorized as a common anode configuration, which is a standard design simplifying multiplexing in multi-digit applications.

1.1 Core Advantages and Target Market

The display boasts several key advantages that define its market position. Its 0.28-inch (7 mm) digit height offers a compact yet readable format, suitable for panel meters, instrumentation, consumer appliances, and industrial control interfaces where space is at a premium. The use of AlInGaP technology delivers high luminous intensity and excellent character appearance, ensuring visibility even in brightly lit environments. A wide viewing angle is another critical feature, allowing the display to be read accurately from various positions, which is essential for panel-mounted equipment. The device is also categorized for luminous intensity, meaning units are binned for consistent brightness, and it is offered in a lead-free package compliant with RoHS (Restriction of Hazardous Substances) directives, making it suitable for global markets with strict environmental regulations. The target market includes designers of test and measurement equipment, point-of-sale terminals, automotive dashboards (secondary displays), and household appliances requiring reliable, low-maintenance numeric indicators.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the electrical and optical parameters is crucial for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. They are not for continuous operation.

2.2 Electrical & Optical Characteristics (at Ta=25°C)

These are the typical performance parameters under specified test conditions.

3. Binning System Explanation

The datasheet explicitly states the device is \"Categorized for Luminous Intensity.\" This implies a binning or sorting process post-manufacturing.

4. Performance Curve Analysis

While the provided PDF excerpt mentions \"TYPICAL ELECTRICAL / OPTICAL CHARACTERISTIC CURVES,\" the specific graphs are not included in the text. Based on standard LED behavior, these curves would typically include:

5. Mechanical & Package Information

5.1 Package Dimensions and Tolerances

The display conforms to a standard through-hole DIP (Dual In-line Package) format. Key dimensional notes from the datasheet include: all dimensions are in millimeters with a general tolerance of ±0.25 mm unless specified otherwise. The pin tip shift tolerance is ±0.4 mm, which is important for PCB hole placement. Specific quality controls are noted: foreign material on a segment must be ≤10 mils, ink contamination on the surface ≤20 mils, bending must be ≤1/100, and bubbles within the segment material must be ≤10 mils.

5.2 Pin Connection and Internal Circuit

The device has 10 pins in a single row. The internal circuit diagram shows it is a common anode type with two separate common anode pins (Pin 6 for Digit 2, Pin 9 for Digit 1). Each segment (A, B, C, D, E, F, G, and Decimal Point) has its own dedicated cathode pin. This configuration is standard for multiplexing: by sequentially enabling one common anode (digit) at a time and driving the appropriate cathode pins for that digit's segments, multiple digits can be controlled with a reduced number of I/O pins.

6. Soldering and Assembly Guidelines

The datasheet provides specific soldering conditions to prevent thermal damage during PCB assembly: \"Soldering Conditions: 1/16 inch below seating plane for 3 seconds at 260°C.\" This refers to wave soldering. The iron tip should be positioned 1.6mm (1/16\") below the plastic body of the display, and the contact time should not exceed 3 seconds at a maximum temperature of 260°C. This prevents the plastic housing from melting or the internal wire bonds from being damaged by excessive heat. For reflow soldering, the profile must not exceed the maximum temperature rating derived from the storage temperature (+105°C) plus a safety margin, though a specific reflow profile is not provided. Components should be stored in their original moisture-barrier bags in a controlled environment to prevent moisture absorption, which can cause \"popcorning\" during reflow.

7. Application Suggestions

7.1 Typical Application Circuits

The most common drive method is multiplexing. A microcontroller would use two I/O pins as digit selectors (sinking current for the common anodes via transistors) and 8 I/O pins (or a shift register) to sink current for the segment cathodes. A current-limiting resistor is required in series with each segment cathode or each common anode. The resistor value is calculated using R = (Vcc - Vf\_led) / I\_desired. Given Vf is typically 2.6V at 20mA, with a 5V supply, R = (5 - 2.6) / 0.02 = 120 Ohms. For multiplexed operation, the instantaneous current per segment can be higher (e.g., 20mA) but the average current, considering duty cycle, must stay within the continuous rating.

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to older red GaAsP (Gallium Arsenide Phosphide) LED displays, the AlInGaP technology in the LTD-2601JS offers significantly higher luminous efficiency, resulting in brighter displays at the same current, or equivalent brightness at lower power. The yellow color (587-588 nm) is in a region of high sensitivity for the human photopic (daylight) vision, making it appear subjectively brighter than red or green LEDs of similar radiant power. Compared to contemporary side-glow or dot-matrix displays, the seven-segment format is simpler to drive and decode, offering lower system cost for pure numeric applications. Its through-hole package provides robust mechanical attachment compared to surface-mount alternatives, which is beneficial in applications subject to vibration.

9. Frequently Asked Questions (Based on Technical Parameters)

10. Practical Design and Usage Case

Case: Designing a Simple Digital Voltmeter Readout. A designer needs a two-digit display to show voltages from 0.0 to 9.9V for a benchtop power supply. The LTD-2601JS is selected for its readability and simple interface. The microcontroller's ADC reads the voltage, converts it to a decimal number, and looks up the 7-segment codes for the tens digit, units digit, and decimal point. Two NPN transistors are used to switch the common anode pins (Digits 1 & 2) to ground. Eight microcontroller I/O pins, each with a 120-ohm series resistor, are connected to the segment cathodes (A-G and DP). The firmware multiplexes the digits at 100 Hz. The gray face/white segment provides excellent contrast against the black panel of the power supply. The high brightness ensures it is visible in a well-lit lab. The lead-free compliance meets the company's environmental standards for new products.

11. Operating Principle Introduction

The fundamental principle is electroluminescence in a semiconductor P-N junction. The AlInGaP material is a direct bandgap semiconductor. When a forward voltage exceeding the junction's built-in potential (roughly equal to Vf) is applied, electrons from the N-region are injected across the junction into the P-region, and holes from the P-region move into the N-region. These injected minority carriers (electrons in the P-side, holes in the N-side) recombine with the majority carriers. In a direct bandgap material like AlInGaP, a significant portion of these recombinations are radiative, meaning they release energy in the form of photons (light). The specific energy of the photon, and thus its wavelength (color), is determined by the bandgap energy of the semiconductor material, which is engineered by the precise ratios of Aluminum, Indium, Gallium, and Phosphorus. The non-transparent GaAs substrate helps reflect light upward, increasing the forward luminous intensity. Each segment is a separate LED chip, and the combination of segments lit forms the desired numeral or character.

12. Technology Trends and Developments

While through-hole seven-segment displays like the LTD-2601JS remain relevant for prototyping, educational kits, and applications requiring robust mechanical mounting, the broader industry trend is decisively towards surface-mount device (SMD) packages. SMD LEDs offer smaller footprint, lower profile, suitability for automated pick-and-place assembly, and often better thermal performance via direct attachment to the PCB. For displays, integrated driver ICs are becoming more common, combining the LED array with scanning logic and sometimes even serial communication interfaces (like I2C or SPI), drastically reducing the microcontroller I/O and software overhead. In terms of materials, while AlInGaP is excellent for red, orange, and yellow, InGaN (Indium Gallium Nitride) dominates the blue, green, and white LED markets due to its wider bandgap tunability. For future displays, micro-LED and mini-LED technologies promise even higher density, brightness, and efficiency, though these are currently targeted at high-resolution video screens rather than simple segment displays. The enduring principle of the seven-segment format, however, ensures its utility in cost-sensitive, legibility-critical numeric applications for the foreseeable future.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.