Component Lifecycle Specification - Revision 2 - Release Date 2014-12-12 - English Technical Document

1. Product Overview

This technical document provides the lifecycle and revision management information for a specific electronic component. The core information defines the component's current state within its development and release cycle, indicating it is a stable, released revision intended for long-term use. The document's primary function is to communicate version control and availability status to engineers, procurement specialists, and quality assurance personnel involved in the product's integration and lifecycle management.

The document establishes the component as being in the "Revision" phase. This typically signifies that the component design is finalized, has undergone initial testing and validation, and is now in a state of controlled release. Subsequent changes, if any, would be managed through formal revision control processes. The "Forever" expired period indicates no planned obsolescence or end-of-life date for this specific revision under normal circumstances, suggesting its design is mature and suitable for long-term projects.

2. Technical Parameter Deep Objective Interpretation

While the provided PDF excerpt focuses on administrative data, a complete technical document for an electronic component would contain several critical parameter sections. Based on standard industry practice, these are interpreted below.

2.1 Photometric and Electrical Parameters

For a typical component like an LED or integrated circuit, this section details performance metrics. Photometric characteristics might include luminous intensity, wavelength or color temperature, and viewing angle. Electrical parameters are fundamental and include forward voltage, reverse voltage, current rating, and power dissipation. These values define the operational boundaries and are essential for circuit design, ensuring the component operates within its safe operating area (SOA) to guarantee reliability and longevity.

2.2 Thermal Characteristics

Thermal management is crucial for electronic component reliability. Key parameters include the junction-to-ambient thermal resistance and the maximum junction temperature. These values determine how effectively heat can be dissipated from the active area of the component to the environment. Exceeding the maximum junction temperature can lead to accelerated aging, parameter drift, or catastrophic failure. Proper heatsinking and PCB layout are designed based on these figures.

3. Binning System Explanation

Manufacturing processes introduce natural variances. A binning system categorizes components based on measured performance after production.

3.1 Wavelength/Color Temperature Binning

For light-emitting or color-sensitive components, units are sorted into bins according to their peak wavelength or correlated color temperature (CCT). This ensures color consistency within a single production batch or across multiple batches for applications where uniform appearance is critical, such as in display backlights or architectural lighting.

3.2 Forward Voltage Binning

Components are also binned based on their forward voltage drop at a specified test current. Grouping components with similar Vf characteristics allows for more predictable performance in series or parallel configurations, improving current balance in multi-component arrays and simplifying driver design.

4. Performance Curve Analysis

Graphical data provides deeper insight than single-point parameters.

4.1 Current-Voltage (I-V) Characteristic Curve

The I-V curve illustrates the relationship between the current flowing through the component and the voltage across it. It shows the turn-on threshold, the dynamic resistance in the operating region, and the behavior under reverse bias. This curve is fundamental for simulating circuit behavior and selecting appropriate current-limiting components.

4.2 Temperature Dependency

Performance curves plotted against temperature reveal how key parameters like forward voltage, luminous output, or efficiency change with the junction temperature. This information is vital for designing systems that must operate reliably across a wide ambient temperature range, allowing engineers to derate performance or enhance cooling as needed.

5. Mechanical and Packaging Information

Physical specifications ensure proper integration into the final assembly.

5.1 Dimensional Outline Drawing

A detailed mechanical drawing provides exact dimensions, including length, width, height, and tolerances. It specifies the location and size of mounting features, optical elements, or connector interfaces. This drawing is used to create the PCB footprint and check for mechanical clearance within the end product.

5.2 Pad Layout and Polarity Identification

The recommended PCB land pattern (pad layout) is provided to ensure reliable solder joint formation. The document clearly indicates polarity markings (e.g., anode/cathode for diodes, pin 1 indicator for ICs) through diagrams and callouts. Incorrect polarity during assembly will render the component non-functional or cause immediate failure.

6. Soldering and Assembly Guidelines

These instructions preserve component integrity during the manufacturing process.

6.1 Reflow Soldering Profile

A time-temperature graph defines the ideal reflow profile, including preheat, soak, reflow, and cooling stages. It specifies maximum temperature limits and time-above-liquidus to prevent thermal damage to the component's package, internal die, or wire bonds. Adherence to this profile is critical for yield and long-term reliability.

6.2 Handling and Storage Conditions

Components are often moisture-sensitive. The document specifies the Moisture Sensitivity Level (MSL) and required storage conditions (e.g., temperature, humidity) and baking procedures before use to prevent "popcorning" or internal delamination during the high-temperature soldering process.

7. Packaging and Ordering Information

This section covers logistics and identification.

7.1 Packaging Specifications

Details are provided on how components are supplied, such as tape-and-reel dimensions, reel quantities, or tray configurations. This information is necessary for setting up automated pick-and-place assembly equipment.

7.2 Part Numbering and Labeling

The model naming convention is explained, showing how the part number encodes information like performance bin, packaging type, and revision code (e.g., the "Revision: 2" from the PDF). Labeling on the packaging or reel matches this part number for traceability.

8. Application Suggestions

8.1 Typical Application Circuits

The datasheet often includes schematic diagrams of common application circuits, such as a constant-current driver for an LED or a basic implementation circuit for an IC. These serve as a proven starting point for design.

8.2 Critical Design Considerations

Key advice is given, such as the importance of maintaining a low thermal impedance path to the PCB, avoiding voltage transients exceeding the maximum ratings, and implementing appropriate ESD protection measures during handling and in the circuit.

9. Technical Comparison and Differentiation

While a specific datasheet may not list competitors, the information within allows for objective comparison. Advantages might be derived from a lower forward voltage (leading to higher efficiency), a smaller package size (enabling miniaturization), a wider operating temperature range, or superior reliability metrics like a longer calculated lifetime (L70, L90). The "Forever" expiration for Revision 2 indirectly suggests a stable, well-characterized part suitable for applications requiring long-term supply consistency.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What does "LifecyclePhase: Revision" mean for my design?
A: It indicates the component design is stable and released for production. You can confidently design it into new products with the expectation that this specific revision will remain available and unchanged.

Q: How should I interpret "Expired Period: Forever"?
A> This suggests the manufacturer has no current plan to obsolete (EOL) this revision. However, "Forever" should be understood within the context of the electronics industry; long-term availability is promised, but it's always prudent to check for lifecycle status updates periodically, especially for very long-lifecycle products.

Q: The release date is 2014. Is this component outdated?
A> Not necessarily. A 2014 release date for a Revision 2 part indicates it is a mature, well-established component. Many fundamental electronic components have multi-decade lifecycles. Its suitability depends entirely on whether its technical parameters meet your application's requirements.

11. Practical Use Case

Scenario: Designing a Long-Life Industrial Indicator Light.
An engineer selects this component based on its documented parameters. The "Revision 2" and "Forever" expiration provide confidence in long-term sourcing for a product with a 10-year support expectation. The engineer uses the forward voltage and current rating from the full datasheet to design a simple resistor-based driver circuit. The thermal resistance data is used to verify that the maximum junction temperature will not be exceeded in the enclosed fixture at the highest ambient temperature of 85°C. The component is specified in the Bill of Materials (BOM) with the exact revision code to ensure manufacturing receives the correct, qualified part.

12. Principle Introduction

The core principle documented here is product lifecycle and revision control. In electronics manufacturing, every component version is meticulously tracked. A "Revision" change (from 1 to 2, etc.) typically signifies a formal engineering change order (ECO). This could be a minor process improvement, a material substitution, or a fixed bug that does not alter the component's form, fit, or function (FFF). The documentation ensures that all parties in the supply chain are aligned on the exact version being produced and used, which is critical for quality control, reliability tracking, and failure analysis.

13. Development Trends

The trend in component documentation is towards increased digitization and machine-readability. While the provided snippet is simple text, modern datasheets are often part of a digital thread. Trends include:
- Digital Datasheets: Parameters are provided in machine-readable formats (XML, JSON) for direct import into design and simulation software.
- Lifecycle Analytics: Manufacturers provide web-based portals where customers can check the real-time lifecycle status (Active, Not Recommended for New Design (NRND), End-of-Life (EOL)) of any part number.
- Supply Chain Transparency: Documentation increasingly includes detailed supply chain information, such as country of origin and compliance certificates (RoHS, REACH), directly linked to the part number and revision.
- Parametric Search Integration: The individual parameters within a datasheet are tagged to allow for powerful, precise parametric search engines on distributor and manufacturer websites, moving beyond simple keyword matching.

The presence of a clear revision and release date, as seen in the PDF, is a foundational element that enables these more advanced digital management practices.