Full-Color RGB SMD LED 2.8x2.7x3.0mm - Forward Voltage 1.7-3.4V - Power 60-68mW - Technical Datasheet

1. Product Overview

1.1 General Description

This full-color SMD LED package integrates red, green, and blue chips in a single compact form factor measuring 2.8mm x 2.7mm x 3.0mm. It features a matte surface finish to reduce glare and enhance contrast, making it ideal for high-quality display applications. The product is designed for outdoor full-color video screens, indoor and outdoor decorative lighting, amusement equipment, and general lighting use.

1.2 Features

• Non-reflective matte surface for improved visual contrast.
• High luminous intensity with low power dissipation.
• Good reliability and long operational life.
• Water-resistant to IPX6 standard.
• Moisture sensitivity level: 5a.
• RoHS compliant and lead-free reflow soldering compatible.

1.3 Applications

• Outdoor full-color video screens.
• Indoor and outdoor decorative lighting.
• Amusement and entertainment lighting.
• General purpose illumination.

2. Technical Parameters

2.1 Electrical and Optical Characteristics at Ts=25°C

The following table summarizes key parameters. Red forward voltage is 1.7V to 2.4V; green and blue are 2.7V to 3.4V at 20mA. Dominant wavelengths: Red 617-628nm, Green 520-545nm, Blue 460-475nm. Luminous intensity: Red 800-1800 mcd, Green 2000-4500 mcd, Blue 400-900 mcd. Viewing angle: Red 70-80°, Green 60-70°, Blue 75-85°.

2.2 Absolute Maximum Ratings

Maximum forward current: Red 25mA, Green/Blue 20mA. Peak forward current (1/10 duty, 0.1ms): 80mA for all colors. Reverse voltage: 5V. Operating temperature: -30°C to +85°C. Storage temperature: -40°C to +100°C. Power dissipation: Red 60mW, Green 68mW, Blue 68mW. ESD rating (HBM): 1000V.

3. Optical Characteristics Curves

Figure 1-6 shows forward voltage versus forward current for each color channel, demonstrating typical diode behavior. Figure 1-7 illustrates relative intensity as a function of forward current, indicating a near-linear relationship within the operating range. Figure 1-8 depicts the variation of luminous intensity with ambient temperature; intensity decreases at elevated temperatures. Figure 1-9 provides a derating curve of forward current relative to solder point temperature to ensure safe operation. Figure 1-10 presents the spectral distribution, with peaks corresponding to the dominant wavelengths of each chip. Figures 1-11 and 1-12 show the radiation patterns along X-X and Y-Y axes, confirming wide viewing angles suitable for display applications.

4. Package Dimensions and Mechanical Information

Package dimensions: 2.8mm (L) x 2.7mm (W) x 3.0mm (H). Pin configuration: 1R+ (Red anode), 2R- (Red cathode), 3G+ (Green anode), 4G- (Green cathode), 5B+ (Blue anode), 6B- (Blue cathode). Polarity is marked on the bottom view of the package. A recommended soldering pad pattern is shown in Figure 1-5. All dimensions are in millimeters with a tolerance of ±0.1mm unless otherwise noted.

5. Binning System

Each LED is binned according to luminous intensity (IV), forward voltage (VF), and dominant wavelength (Wd) to ensure consistency within production lots. The bin code is printed on the reel label along with part number, lot number, quantity, and date. This allows customers to select LEDs with matched characteristics for uniform color and brightness in large displays.

6. Packaging and Ordering Information

Standard packaging quantity is 2000 pieces per reel. Carrier tape and reel dimensions are specified in section 2.1. Moisture-resistant packing includes desiccant and a humidity indicator card inside an anti-static aluminum foil bag, followed by cardboard boxes for shipping multiple reels. The label contains all necessary ordering and binning information.

7. Reliability Testing

Reliability tests are conducted per industry standards: resistance to soldering heat (260°C, 3 times), thermal shock (-40°C to +100°C, 500 cycles), high temperature storage (100°C, 1000h), low temperature storage (-40°C, 1000h), room temperature operating life (25°C, 20mA, 1000h), high temperature high humidity life (85°C/85% RH, 10mA, 500h), temperature humidity storage (85°C/85%, 1000h), and low temperature operating life (-40°C, 20mA, 1000h). Acceptance criteria: forward voltage shift ≤10%, reverse current ≤10μA, average luminous intensity degradation ≤30%, and no physical damage.

8. SMT Reflow Soldering Instructions

Recommended reflow profile: ramp-up ≤4°C/s, preheat at 150-200°C for 60-120s, time above 217°C ≤60s, peak temperature 250°C for ≤10s, cooling ≤6°C/s, total time from 25°C to peak ≤8 minutes. Only one reflow pass is allowed. Use middle-temperature solder paste. For hand soldering: iron temperature <300°C, contact time <3 seconds, one time only. For repair, use a double-head soldering iron. Cleaning: if needed, use isopropyl alcohol (IPA); do not use ultrasonic cleaning.

9. Handling Precautions and Storage

Storage before opening: ≤30°C, ≤60% RH, shelf life 1 year. After opening, solder within 24 hours or store at ≤30°C and ≤10% RH. If moisture indicator shows ≥30% or storage time has exceeded, bake at 65±5°C for 24-48 hours depending on duration. Anti-static measures: maintain workstation potential ≤150V, wear grounded wrist straps. Reverse voltage should be kept below 10V to prevent damage. For reliable operation, ensure LED surface temperature ≤55°C and lead temperature ≤75°C. Do not touch the epoxy surface; handle by the sides using tweezers or appropriate tools.

10. Application Notes

For outdoor full-color screens, ensure proper heat sinking and use constant-current drivers to maintain consistent brightness. The matte surface improves contrast under high ambient light. Use PWM dimming for effective color mixing. Provide ESD protection on the PCB, such as TVS diodes. The IPX6 rating allows the LED to be used in wet or dusty environments. System-level thermal management is critical to keep junction temperatures within safe limits, ensuring long life and color stability.