RGB SMD LED 2.05x2.15x1.9mm - Forward Voltage 1.7-3.3V - Power 49.5mW per Channel - Technical Datasheet

1. Product Overview

This product is a full-color RGB SMD LED with common anode configuration. It is designed for high-contrast applications featuring an all-black surface. The package size is 2.05mm × 2.15mm × 1.9mm, making it suitable for compact pixel pitches in full-color video screens.

1.1 General Description

The device integrates three LED chips (Red, Green, Blue) in a single package with a common anode pin. It offers extremely wide viewing angles, high luminous intensity, low power dissipation, good reliability, and long life. The LED is water-resistant to IPX6 and has a moisture sensitivity level of 5a. It is RoHS compliant and designed for Pb-free reflow soldering.

1.2 Key Features

• Extremely wide viewing angle: 110°
• High luminous intensity with low power consumption
• Water-resistant: IPX6
• Moisture sensitivity level: 5a
• RoHS compliant
• Matte surface for anti-glare
• Pb-free reflow soldering compatible

1.3 Target Applications

• Outdoor full-color video screens
• Indoor and outdoor decorative lighting
• Amusement and entertainment equipment
• General LED applications

1.4 Package Dimensions and Polarity

The package dimensions are 2.05mm (length) × 2.15mm (width) × 1.9mm (height). The common anode is pin 1 (+). The red, green, and blue cathodes are pins 2, 3, 4 respectively. A marking on the package indicates the cathode side. The recommended solder pad layout is provided for optimal thermal and mechanical performance. For glue filling applications, the filling height must be ≥ 0.75mm.

2. Technical Parameters In Depth

2.1 Electrical and Optical Characteristics (at 25°C)

Forward voltage ranges (at test current): Red: 1.7V – 2.4V (IF=15mA); Green: 2.5V – 3.3V (IF=15mA); Blue: 2.5V – 3.3V (IF=10mA). Dominant wavelength bins: Red: 617-628nm (5nm/bin), Green: 520-540nm (3nm/bin), Blue: 460-475nm (3nm/bin). Luminous intensity (mcd): Red: min 24, typ 330, max 525; Green: min 38, typ 685, max 1100; Blue: min 30, typ 68, max 110. Viewing angle: 110° for all colors. Reverse current: ≤6μA at VR=5V.

2.2 Absolute Maximum Ratings

Forward current: Red ≤20mA, Green ≤15mA, Blue ≤15mA. Reverse voltage ≤5V. Operating temperature: -30°C to +85°C. Storage temperature: -40°C to +100°C. Power dissipation per channel: Red 48mW, Green 49.5mW, Blue 49.5mW. Junction temperature ≤100°C. ESD withstand voltage (HBM) ≤1000V.

2.3 Binning Information

The product is sorted into bins for luminous intensity (ratio 1:1.3 for all colors) and dominant wavelength. Wavelength bin widths: Red 5nm, Green 3nm, Blue 3nm. Customers should use LEDs from the same intensity and wavelength bin for uniform display appearance.

2.4 Typical Performance Curves

The typical forward current vs. forward voltage curves show that the red chip has lower forward voltage than green and blue at the same current. Relative luminous intensity increases with forward current up to the maximum rating. Luminous intensity decreases with increasing ambient temperature; at 85°C the relative intensity drops to about 80% for red and 70% for green and blue. The solder point temperature vs. forward current derating curve indicates that at higher temperatures the allowable forward current must be reduced. Spectral distributions peak at approximately 625nm (red), 530nm (green), and 470nm (blue). The radiation patterns are symmetric with a half-angle of 55° in both X and Y axes.

3. Packaging and Ordering Information

3.1 Carrier Tape and Reel Dimensions

The LED is packaged in carrier tape with a pitch suitable for automated pick-and-place. Each reel contains 13,000 pieces. Reel dimensions: outer diameter 400±2mm, hub diameter 100±0.4mm, width 14.3±0.3mm, etc. The tape width and pocket design ensure secure transport.

3.2 Moisture Resistant Packing

The products are shipped in anti-static and moisture-proof aluminum foil bags with desiccant and a humidity indicator card. The moisture sensitivity level is 5a, meaning exposure to ambient air must be limited after opening.

3.3 Reliability Test Conditions

The LED has passed standard reliability tests including resistance to soldering heat (250°C, 3 times), thermal shock (-40°C to 100°C, 500 cycles), moisture resistance (85°C/85%RH + reflow), high temperature storage (100°C, 1000h), low temperature storage (-40°C, 1000h), room temperature operating life (IF=10mA, 1000h), high temperature high humidity life (85°C/85%RH, IF=5mA, 1000h), and low temperature life (-40°C, IF=10mA, 1000h). Acceptance criteria: no more than 1 failure out of 22 samples.

3.4 Failure Criteria

Failure is defined as: forward voltage shift >±10% from initial value, reverse current >10μA at VR=5V, average luminous intensity degradation >30%, or any visual abnormality such as cracks, delamination, or non-illumination.

4. SMT Reflow Soldering Guidelines

4.1 Reflow Profile

The recommended reflow profile uses a lead-free process with peak temperature of 245°C (max 10 seconds). Preheat from 150°C to 200°C in 60-120 seconds. Ramp-up rate ≤4°C/s, cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Only one reflow is allowed. Use middle-temperature solder paste for optimal results. Nitrogen reflow is recommended to prevent oxidation.

4.2 Hand Soldering, Repair, and Cleaning

Hand soldering: iron temperature ≤300°C, time ≤3 seconds, one time only. Repair is not recommended; if necessary, use a double-head soldering iron. Cleaning: use isopropyl alcohol only; avoid water, benzene, thinners, and ionic liquids containing chlorine or sulfur.

5. Handling Precautions and Storage

5.1 Storage Conditions

Before opening: store at ≤30°C and ≤60% RH. Shelf life in sealed bag is 6 months. After opening: use within 12 hours in controlled environment (≤30°C/≤60% RH). Unused material must be stored at ≤30°C/≤10% RH and baked before next use (65±5°C for 24-48h depending on age). If material is damp or older than 12 months, return to factory.

5.2 Electrostatic Discharge (ESD) Protection

ESD can damage the LED. Use grounded equipment, anti-static wrist straps, mats, and conductive containers. The LED is rated for HBM 1000V, but protection is still essential during handling.

5.3 Reverse Voltage Protection

Do not apply continuous reverse voltage exceeding 5V. In matrix driving, ensure reverse voltage does not exceed the limit to prevent current leakage and gray-scale issues.

5.4 Thermal Management

Proper heat dissipation is critical. Keep LED surface temperature below 55°C and lead temperature below 75°C during operation. Use adequate PCB copper area and spacing. Drive current must be derated based on ambient temperature.

5.5 Usage Recommendations

• Always drive each LED chip with constant current.
• Do not exceed absolute maximum ratings.
• For arrays, ensure total power dissipation is within package limits.
• When not in use, switch off power completely.
• Perform aging test to detect defects.
• In harsh environments (high humidity, salt, sulfide gases), take protective measures.
• For first power after installation, use 20% power initially to dry out moisture.

Additional care: Avoid touching the epoxy surface; use tweezers. Do not stack assembled PCBs. Refer to the manufacturer's full user manual for detailed instructions.