Table of Contents
- 1. Product Overview
- 2. Technical Parameter Analysis
- 2.1 Electrical and Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 2.3 Binning System Explanation
- 3. Performance Curve Analysis
- 3.1 Forward Voltage vs. Forward Current (I-V Curve)
- 3.2 Forward Current vs. Relative Intensity
- 3.3 Luminous Intensity vs. Ambient Temperature
- 3.4 Spectrum Distribution
- 3.5 Radiation Angle
- 4. Mechanical and Packaging Information
- 4.1 Package Dimensions and Polarity
- 4.2 Carrier Tape and Reel Dimensions
- 4.3 Label and Moisture Barrier Bag
- 5. Soldering and Assembly Guidelines
- 5.1 Reflow Soldering Profile
- 5.2 Hand Soldering and Repair
- 5.3 Cleaning
- 6. Packaging and Ordering Information
- 7. Application Guidance
- 7.1 Typical Applications
- 7.2 Design Considerations
- 8. Technical Comparison with Competing Solutions
- 9. Frequently Asked Questions
- 10. Practical Application Examples
- 11. Operating Principle Explanation
- 12. Technology Trends and Future Outlook
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This full-color LED device is a common anode RGB SMD (Surface Mount Device) designed for high contrast applications with an all-black surface. The product measures 1.6mm x 1.7mm x 1.6mm, making it suitable for dense pixel pitches in outdoor and indoor full-color video screens. Its extremely wide viewing angle of 110° ensures uniform light distribution across large displays. The LED features high luminous intensity, low power dissipation, good reliability, and long operational life. It is rated IPX6 water-resistant and meets Moisture Sensitivity Level 5a (MSL5a), requiring careful handling before soldering. The component is RoHS compliant and compatible with lead-free reflow soldering processes. The matte surface reduces glare and improves visual contrast in direct sunlight.
2. Technical Parameter Analysis
2.1 Electrical and Optical Characteristics
At a test temperature of 25°C (Ts=25°C), the electrical and optical parameters are specified for each color chip (R, G, B). The reverse current (IR) at VR=5V is limited to 6 μA maximum for all channels, ensuring low leakage. Forward voltage (VF) ranges are: Red: 1.7V min to 2.4V max; Green: 2.5V min to 3.3V max; Blue: 2.5V min to 3.3V max. The dominant wavelength (λD) bins are: Red 617–628 nm (5nm per bin), Green 520–545 nm (3nm per bin), Blue 460–475 nm (3nm per bin). The spectrum radiation bandwidth (Δλ) for Red is 24 nm, Green 38 nm, Blue 30 nm. Luminous intensity (IV) at test currents (Red 10mA, Green 10mA, Blue 5mA) shows minimum, average, and maximum values: Red: min 120 mcd, avg 195 mcd, max 310 mcd; Green: min 290 mcd, avg 470 mcd, max 750 mcd; Blue: min 20 mcd, avg 35 mcd, max 55 mcd. Binning ratio for each color is 1:1.3. The viewing angle (2θ1/2) is 110° symmetrical.
2.2 Absolute Maximum Ratings
The absolute maximum ratings at Ts=25°C define the safe operating limits. Forward current (IF) maximum: Red 20 mA, Green 15 mA, Blue 15 mA. Reverse voltage (VR) maximum: 5 V per channel. Operating temperature range: -30°C to +85°C. Storage temperature range: -40°C to +100°C. Power dissipation (PD) maximum: Red 48 mW, Green 49.5 mW, Blue 49.5 mW. Total junction temperature (TJ) maximum: 100°C for all chips. Electrostatic discharge (ESD) protection (HBM) is rated at 1000V, requiring standard anti-static measures during handling.
2.3 Binning System Explanation
The LED is sorted by dominant wavelength and luminous intensity into bins. Wavelength bins for Red are 5 nm per bin, for Green and Blue 3 nm per bin. Intensity bins follow a 1:1.3 ratio, meaning each intensity rank covers a range where the upper limit is 1.3 times the lower limit. This binning system ensures consistent color and brightness uniformity across multiple LEDs in a display. The specific bin codes are printed on the product label. Customers must select appropriate bins for their application to achieve uniform visual performance.
3. Performance Curve Analysis
3.1 Forward Voltage vs. Forward Current (I-V Curve)
The typical I-V curves show a nonlinear relationship typical of LEDs. At low forward voltage, current is minimal; above the threshold voltage (approximately 1.8V for Red, 2.6V for Green/Blue), current rises rapidly. The curves are provided for Red, Green, and Blue chips, demonstrating that forward voltage varies with color. Designers must account for these differences when driving LEDs in series or parallel configurations.
3.2 Forward Current vs. Relative Intensity
The relative intensity increases with forward current but exhibits saturation at higher currents. For Red chip, relative intensity at 60 mA is about 500% compared to 10 mA. Green and Blue show similar trends but with different slopes. This nonlinearity must be considered when designing PWM dimming or constant current drive schemes.
3.3 Luminous Intensity vs. Ambient Temperature
As ambient temperature rises, luminous intensity decreases. At 85°C, relative intensity drops to approximately 60–70% of the 25°C value, depending on the color. Red shows the least degradation, while Green and Blue degrade more. Thermal management is critical to maintain brightness stability over temperature range.
3.4 Spectrum Distribution
The spectral distribution curves show the relative emission intensity versus wavelength. Red has a peak around 620–625 nm, Green around 530 nm, Blue around 465 nm. The spectral widths (half-power bandwidth) are consistent with the stated Δλ values. This spectral purity ensures good color gamut for display applications.
3.5 Radiation Angle
The directivity curves (X-X and Y-Y axes) show the relative intensity as a function of angle. The viewing angle of 110° (half-angle) corresponds to the angle where intensity drops to 50% of the on-axis value. The radiation pattern is nearly Lambertian, providing wide and uniform light distribution suitable for outdoor screens.
4. Mechanical and Packaging Information
4.1 Package Dimensions and Polarity
The package dimensions: top view shows a 1.6 mm x 1.7 mm body with a 1.15 mm height. The side view indicates a total height of 1.6 mm. Bottom view includes four pads labeled 1+ (anode common), 2R- (Red cathode), 3G- (Green cathode), 4B- (Blue cathode). The polarity marking (PIN-MARK) is clearly indicated. Soldering patterns (recommended PCB footprint) are provided with dimensions: 0.7 mm x 0.5 mm pads with specific spacing. Glue filling recommendation: filling height must be ≥ 0.65 mm. All tolerances are ±0.1 mm unless otherwise noted.
4.2 Carrier Tape and Reel Dimensions
The LEDs are packaged in carrier tape compatible with standard pick-and-place equipment. The reel dimensions: A=400±2 mm, B=100.0±0.4 mm, C=14.3±0.3 mm, D=2.6±0.2 mm, E=12.4±0.3 mm, F=8.6+0.2/-0.3 mm, T=1.9±0.2 mm. Each reel contains 15,500 pieces. The tape pocket design ensures proper orientation and protection during transportation.
4.3 Label and Moisture Barrier Bag
Each reel is labeled with part number, lot number, luminous intensity bin, forward voltage bin, wavelength bin, forward current, quantity, and date. The packaging includes desiccant and a humidity indicator card (HIC) inside a moisture-proof anti-static aluminum foil bag. The bag is vacuum-sealed to maintain low humidity (<10% RH) during storage. Storage conditions: temperature ≤30°C, humidity ≤60% RH before opening; after opening, use within 12 hours and store at ≤30°C / ≤10% RH with baking required before next use.
5. Soldering and Assembly Guidelines
5.1 Reflow Soldering Profile
The recommended reflow profile is based on lead-free soldering with a peak temperature (TP) of 245°C (max 10 seconds). Preheating from 150°C to 200°C over 60-120 seconds. Ramp-up rate ≤4°C/s to TP, and cooling rate ≤6°C/s. The time above 217°C (TL) must not exceed 60 seconds. Total time from 25°C to peak ≤8 minutes. Only one reflow cycle is allowed. Use of nitrogen atmosphere is recommended to prevent oxidation and optical degradation.
5.2 Hand Soldering and Repair
If hand soldering is necessary, use a soldering iron at <300°C for less than 3 seconds, and perform only once. For repair, a double-head soldering iron should be used, and the effect on LED characteristics must be verified beforehand. Repair after reflow is discouraged.
5.3 Cleaning
Do not use water, benzene, or thinner. Recommended cleaning solvent is isopropyl alcohol (IPA). Avoid solvents containing chlorine (Cl) or sulfur (S) elements. Ensure cleaning does not damage the LED surface or package.
6. Packaging and Ordering Information
Standard packaging: 15,500 pieces per reel. Each reel is placed in a moisture barrier bag with desiccant and HIC. The bag is sealed and then packed into a cardboard box (specified dimensions available in the datasheet). The label format includes all necessary tracking codes. For ordering, the full part number includes bin codes. Customers should specify required wavelength and intensity bins for their application. The product is classified as MSL5a, therefore strict moisture control is mandatory.
7. Application Guidance
7.1 Typical Applications
Outdoor full-color video screens (fine pitch), indoor and outdoor decorative lighting, amusement equipment, and general signage. The high contrast black surface improves perceived contrast in outdoor environments. IPX6 water resistance allows use in exposed locations with rain or water jets.
7.2 Design Considerations
Each LED chip must be driven by a constant current source, and the forward current must never exceed absolute maximum ratings. In matrix drive, ensure reverse voltage does not exceed 5V. Thermal management: keep LED surface temperature below 55°C and solder joint temperature below 75°C for long-term reliability. Use proper heat sinking and PCB layout with adequate copper area. Avoid series connection of different color LEDs due to different forward voltages; use independent constant-current drivers per color. For large displays, consider binning and aging to ensure uniformity. In humid or corrosive environments (coastal, hot springs), additional conformal coating may be required.
8. Technical Comparison with Competing Solutions
Compared to standard RGB SMD LEDs without black surface, this product offers higher contrast ratio in sunlight due to the all-black package. The IPX6 rating is superior to typical IPX4 or non-waterproof LEDs. The wide viewing angle (110°) matches industry standards for outdoor displays. However, the MSL5a sensitivity is more demanding than common MSL3, requiring strict moisture control. The binning granularity (5nm for Red, 3nm for Green/Blue, 1:1.3 intensity ratio) is comparable to high-quality display LEDs.
9. Frequently Asked Questions
Q: What is the recommended storage life before opening?
A: Up to 6 months at ≤30°C and ≤60% RH.
Q: Can I use this LED in a matrix driving scheme with multiplexing?
A: Yes, but ensure reverse voltage does not exceed 5V, and use appropriate current limiting.
Q: What is the lumen maintenance over lifetime?
A: Typical L70 lifetime depends on drive current and thermal conditions; refer to reliability data (1000 hours at 85°C/85%RH showed no failures).
Q: Is this product suitable for outdoor use?
A: Yes, with IPX6 rating and wide temperature range, it is designed for outdoor screens.
Q: Can I reflow solder this LED twice?
A: No, only one reflow cycle is allowed.
10. Practical Application Examples
Case 1: Fine-pitch outdoor LED display (P4-P8)
A manufacturer designed a 320x160mm module using 64x32 pixels (RGB per pixel). Using this LED, they achieved brightness of 5000 nits at 20% duty cycle. The black surface provided high contrast even in direct sunlight. Proper binning ensured color uniformity across the entire screen.
Case 2: Decorative linear lighting for building facades
An architectural lighting company used the LED on flexible PCBs to create RGB strips. With IPX6 protection, the strips were installed on building exteriors without additional potting. The wide viewing angle (110°) ensured uniform illumination along the facade.
11. Operating Principle Explanation
This LED contains three independent semiconductor dies (Red, Green, Blue) inside a single package with a common anode. Each die is a p-n junction that emits light when forward biased. The emitted wavelength is determined by the semiconductor material: Red uses AlInGaP, Green and Blue use InGaN. The black epoxy encapsulation absorbs ambient light to improve on/off contrast. The leads are silver-plated for solderability and the package is designed for surface mount assembly. The common anode configuration simplifies drive circuitry by using one positive supply and three negative channels for RGB control.
12. Technology Trends and Future Outlook
Full-color SMD LEDs continue to shrink in size while increasing brightness and contrast. This 1.6x1.7mm package represents a typical current-generation product for outdoor fine-pitch displays. Future trends include further miniaturization (e.g., 1.0x1.0mm), higher efficacy, and improved thermal management. The adoption of common cathode architectures (to reduce forward voltage) is emerging. However, common anode remains popular for multiplexed displays. IPX6 and higher waterproof ratings (IPX8) are becoming standard for outdoor applications. The development of microLED technology may eventually challenge SMD LEDs for ultra-fine pitch, but SMD remains dominant for most medium-to-large format displays due to cost and reliability.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |