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RGB Full-Color SMD LED 1.6x1.7x1.6mm - Voltage R:1.7-2.4V G/B:2.5-3.3V - Luminous Intensity Up to 320mcd - IPX6 Waterproof - English Technical Specification

Complete technical specification for 1.6x1.7x1.6mm common anode RGB SMD LED. Features high contrast, IPX6 waterproof, wide viewing angle 110°, RoHS compliant. Detailed electrical/optical parameters and reflow soldering guidelines.
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PDF Document Cover - RGB Full-Color SMD LED 1.6x1.7x1.6mm - Voltage R:1.7-2.4V G/B:2.5-3.3V - Luminous Intensity Up to 320mcd - IPX6 Waterproof - English Technical Specification

1. Product Overview

The REFOND RF-C1SA15HS-A56 is a compact full-color RGB SMD (Surface Mount Device) light-emitting diode designed for high-contrast and waterproof applications. It features a common anode configuration and is housed in a 1.6mm x 1.7mm x 1.6mm black-surface package that minimizes light reflection, ensuring superior contrast in displays. The LED is IPX6 rated, providing protection against powerful water jets, making it suitable for outdoor signage and decorative lighting. With an extremely wide viewing angle of 110 degrees, high luminous intensity, low power dissipation, and excellent reliability, this component is RoHS compliant and compatible with lead-free reflow soldering processes. The moisture sensitivity level (MSL) is 5a, requiring proper handling to avoid moisture absorption.

1.1 Key Features

1.2 Target Applications

2. Technical Parameter Interpretation

2.1 Electrical and Optical Characteristics (Ts=25°C)

The LED provides three independent color channels (Red, Green, Blue) with a common anode. The following table summarizes the key parameters measured under specified test currents.

ParameterSymbolRedGreenBlueUnitCondition
Reverse CurrentIR666µAVR=5V
Forward Voltage (min)VF(min)1.72.52.5VR:10mA, G:10mA, B:5mA
Forward Voltage (max)VF(max)2.43.33.3VR:10mA, G:10mA, B:5mA
Dominant WavelengthλD618-628518-530460-470nmSame currents
Spectrum Radiation BandwidthΔλ243830nm
Luminous Intensity (min)IV(min)14224527mcdSame currents
Luminous Intensity (avg)IV(avg)18532035mcdSame currents
Viewing Angle (50% IV)2θ1/2110110110deg

Note: Forward voltage tolerance ±0.05V, wavelength tolerance ±1nm, luminous intensity tolerance ±10%. All measurements are performed under Refond’s standardized environment.

2.2 Absolute Maximum Ratings

Care must be taken not to exceed the following limits to prevent permanent damage.

ParameterSymbolRedGreenBlueUnit
Forward CurrentIF201515mA
Peak Forward Current (1/10 duty, 0.1ms)IFP606060mA
Reverse VoltageVR555V
Operating TemperatureTOPR-30 ~ +85°C
Storage TemperatureTSTQ-40 ~ +100°C
Power DissipationPD485050mW
Electrostatic Discharge (HBM)ESD1000V

The forward current values are based on continuous operation; peak current is allowed only with low duty cycle. Power dissipation of each channel should not exceed the absolute maximum rating.

3. Binning System Explanation

The product is categorized into bins based on luminous intensity (IV), dominant wavelength (λD), and forward voltage (VF). The label on the reel includes a BIN CODE that specifies the exact grade for each color (R, G, B). For example, the bin code may indicate a specific intensity range (e.g., IV(mcd)), wavelength range (e.g., λD(nm)), and voltage range (VF(V)). This enables customers to select LEDs with consistent optical and electrical performance for uniform displays. The typical binning parameters are as follows:

Each reel is labeled with the part number, lot number, bin code, quantity, and date code. It is recommended to use LEDs from the same bin for critical color-matching applications.

4. Performance Curves Analysis

4.1 Forward Voltage vs. Forward Current

The characteristic curve (Fig 1-6) shows that the forward voltage increases monotonically with forward current for all three colors. At typical operating currents (R:10mA, G:10mA, B:5mA), the voltages are within the specified ranges. This information is crucial for designing current-limiting resistors or constant-current drivers.

4.2 Forward Current vs. Relative Intensity

As shown in Fig 1-7, the relative luminous intensity increases with forward current, exhibiting a near-linear relationship for low currents but saturating at higher currents. The red channel shows the highest relative intensity growth, while green and blue are slightly lower. Operating at higher currents improves brightness but must be balanced against thermal management.

4.3 Luminous Intensity vs. Ambient Temperature

Fig 1-8 illustrates that the relative intensity decreases as ambient temperature rises. At 85°C, the intensity drops to approximately 50-60% of the value at 25°C. This temperature dependency must be considered for outdoor applications where high ambient temperatures are common.

4.4 Solder Temperature vs. Forward Current (Derating Curve)

Fig 1-9 shows the maximum allowable forward current as a function of ambient temperature. At elevated temperatures (>70°C), the current must be reduced to avoid thermal runaway and damage. For example, at 85°C, the recommended forward current is about 10mA for red and 8mA for green/blue.

4.5 Spectrum Distribution

The spectral curves (Fig 1-10) show narrow peaks for red (centered ~625nm), green (~525nm), and blue (~465nm), with full-width at half-maximum (FWHM) of 24nm, 38nm, and 30nm respectively. The narrow bandwidth ensures good color purity for display applications.

4.6 Radiation Pattern (Directivity)

The angular distribution curves (Fig 1-11 and 1-12) indicate that the light intensity is symmetric in both X-X and Y-Y directions, with a half-intensity angle of approximately 55° off-axis, corresponding to a 110° viewing angle. This wide beam makes the LED suitable for large-area illumination and displays.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Polarity

The LED package measures 1.6mm × 1.7mm × 1.6mm (length × width × height). The top view shows a cathode mark (PIN-MARK) indicating pin 1 (common anode). The bottom view (Fig 1-4) shows pad assignments: 1+ (common anode), 2R- (red cathode), 3G- (green cathode), 4B- (blue cathode). Soldering patterns (Fig 1-5) provide recommended pad dimensions: 0.7mm × 0.5mm for each solder pad, with 0.4mm spacing. All dimensions have a tolerance of ±0.1mm unless noted.

5.2 Carrier Tape and Reel Dimensions

The LEDs are packaged in carrier tape per standard EIA-481. The tape dimensions include pitch and cavity size to accommodate the 1.6×1.7mm body. The reel has an outer diameter of 320.2mm (±2mm), hub diameter 79.5mm (±0.2mm), and width 14.3mm (±0.2mm). Each reel contains 10,500 pieces.

5.3 Moisture-Resistant Packaging

The product is shipped in a sealed anti-static and moisture-proof aluminum foil bag containing a desiccant and a humidity indicator card (CF-HIC). The bag protects against moisture absorption during storage and transport. After opening, the humidity card should be checked; if humidity is ≥30%, baking is required before soldering.

5.4 Cardboard Box and Label

The reels are packed in sturdy cardboard boxes for mechanical protection. Each box is labeled with the part number, lot number, bin code, quantity, and date code. The label also includes RoHS compliance mark.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile follows the lead-free standard with a peak temperature of 245°C (maximum 10 seconds above 217°C). The preheat zone is between 150°C and 200°C for 60-120 seconds. The cooling rate should not exceed 6°C/s. Only one reflow cycle is allowed. Use of middle-temperature solder paste is recommended to minimize thermal stress on the LED.

6.2 Hand Soldering and Repair

If hand soldering is necessary, use a soldering iron temperature below 300°C for less than 3 seconds per pad. Hand soldering should be performed only once. Repair is not recommended, but if unavoidable, a double-head soldering iron should be used to simultaneously heat both pads and remove the component. It is essential to verify that the LED characteristics are not degraded after repair.

6.3 Cleaning

It is preferred to use a “no-clean” solder paste to avoid post-soldering cleaning. If cleaning is required, use isopropyl alcohol (IPA). Do not use ultrasonic cleaning or solvents that may damage the LED package.

7. Handling and Storage Precautions

7.1 Storage Conditions

Unopened packages should be stored at ≤30°C and ≤60% RH. The shelf life is one year from the date of packaging. After opening, the LEDs must be soldered within 24 hours. If not used immediately, they should be stored at ≤30°C and <10% RH. If the humidity indicator card shows >30% RH or the storage time has expired, bake the LEDs at 65±5°C for 24 hours before use.

7.2 Static Electricity Protection

The LED is an ESD-sensitive device (HBM 1000V). To prevent ESD damage, all production machinery and test instruments must be properly grounded. Operators must wear anti-static wristbands and anti-static suits in work areas. Workstations handling ESD-sensitive components should maintain an electrostatic potential of 150V or less.

7.3 Reverse Voltage Protection

Although the reverse current is very small (≤6 µA), applying a reverse voltage exceeding the absolute maximum rating (5V) can damage the LED. In circuit design, it is recommended to keep the reverse voltage below 10V (suggested) by using series diodes or proper polarity protection.

7.4 Safe Operating Temperature

High temperatures significantly reduce luminous intensity and can shorten the LED’s lifespan. In dense arrays or enclosed fixtures, ensure that the LED surface temperature remains below 55°C and the solder leg temperature below 75°C. Adequate heat sinking and airflow should be provided.

8. Application Design Recommendations

8.1 Typical Application Circuits

For outdoor full-color video screens, each LED pixel is driven by a constant-current driver IC (e.g., 16-channel LED drivers) with separate PWM control for R, G, and B. The common anode is connected to the power supply (typically 2.5-5V for red, 3.3-5V for green/blue). Series resistors are often included to limit current and balance brightness.

8.2 Design Considerations

9. Comparative Advantages vs. Similar Products

Compared to standard RGB LEDs without IPX6 rating, this component offers enhanced durability in wet environments. The matte black surface reduces reflection, improving contrast by up to 30% compared to glossy packages. The wide viewing angle (110°) is broader than many compact RGB LEDs (typically 90-100°). Additionally, the MSL 5a rating requires careful handling but ensures lower moisture absorption during storage. The product also supports high-temperature reflow (245°C) without compromising reliability.

10. Frequently Asked Questions (FAQ)

Q1: What is the maximum current for continuous operation of green and blue channels?

A: The absolute maximum continuous forward current is 15mA for green and blue, and 20mA for red. However, for long life and thermal stability, it is recommended to operate at 10mA (red) and 5mA (green/blue) as per test conditions.

Q2: Can I use this LED in a 5V system without current limiting?

A: No. The forward voltage for green/blue is up to 3.3V; a series resistor or constant-current driver is required to limit the current to the desired level.

Q3: How should I store opened reels?

A: Place unused LEDs in a dry cabinet at <10% RH and use within 24 hours. If not possible, bake before soldering.

Q4: Is the LED suitable for automotive exterior lighting?

A: The operating temperature range (-30 to +85°C) and IPX6 rating make it suitable for some automotive applications, but it is not AEC-Q qualified. Check with the manufacturer for specific requirements.

11. Practical Application Examples

12. Working Principle Explanation

This device is a compound semiconductor light-emitting diode using InGaN (for blue and green) and AlInGaP (for red) technologies. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The wavelength (color) is determined by the bandgap energy of the semiconductor material. The common anode configuration means all three cathodes are independently controlled while the anode is shared, simplifying the driving circuit by reducing the number of connections to the power supply.

13. Industry Trends and Future Outlook

The demand for miniature, high-brightness RGB LEDs continues to grow in the signage and entertainment sectors. Trends include smaller packages (down to 1.0×1.0mm) with higher pixel densities, improved thermal management through advanced substrate materials, and enhanced environmental protection (IP67/IP68). This component represents a balance between size, performance, and ruggedness, positioning it well for mid-range to high-end applications. Future developments may include higher efficacy (lumens per watt) and tighter binning for even better color consistency.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.