Green LED 1.6x0.8x0.7mm Specification - Forward Voltage 2.8-3.5V - Power 105mW - Wavelength 515-530nm

1. Product Overview

This is a surface-mount green LED fabricated using a green chip with a compact package dimension of 1.6mm x 0.8mm x 0.7mm (length x width x height). It is designed for general purpose optical indication, switches, symbols, and displays. The device offers an extremely wide viewing angle of 140 degrees, making it suitable for applications requiring large-area visibility. It is RoHS compliant and has a moisture sensitivity level of Level 3. The LED is compatible with all SMT assembly and solder processes, ensuring ease of integration into standard manufacturing workflows.

2. Technical Parameters Detailed Analysis

2.1 Electrical / Optical Characteristics (at Ts=25°C)

At a test condition of IF=20mA, the LED exhibits the following characteristics:

• Spectral Half Bandwidth (∆λ): Typical 15nm (no min/max specified).
• Forward Voltage (VF): Ranges from 2.8V to 3.5V depending on bin. The device is sorted into multiple voltage bins: G1 (2.8V-2.9V), G2 (2.9V-3.0V), H1 (3.0V-3.1V), H2 (3.1V-3.2V), I1 (3.2V-3.3V), I2 (3.3V-3.4V), J1 (3.4V-3.5V).
• Dominant Wavelength (λD): Sorted into six bins from 515nm to 530nm: D10 (515-517.5nm), D20 (517.5-520nm), E10 (520-522.5nm), E20 (522.5-525nm), F10 (525-527.5nm), F20 (527.5-530nm).
• Luminous Intensity (IV): Sorted into six bins from 260mcd to 900mcd: 1AU (260-330mcd), 1AV (330-430mcd), 1CG (430-560mcd), 1CL (560-700mcd), 1CM (700-900mcd).
• Viewing Angle (2θ1/2): Typical 140°.
• Reverse Current (IR): Maximum 10µA at VR=5V.
• Thermal Resistance (RTHJ-S): Maximum 450°C/W at IF=20mA.

2.2 Absolute Maximum Ratings (at Ts=25°C)

The device must not exceed the following maximum ratings to avoid permanent damage:

• Power Dissipation (Pd): 105mW
• Forward Current (IF): 30mA
• Peak Forward Current (IFP): 60mA (1/10 duty cycle, 0.1ms pulse width)
• Electrostatic Discharge (ESD, HBM): 1000V
• Operating Temperature (Topr): -40°C to +85°C
• Storage Temperature (Tstg): -40°C to +85°C
• Junction Temperature (Tj): 95°C

Care must be taken that power dissipation does not exceed the absolute maximum rating. The maximum current should be decided after measuring the package temperature to ensure the junction temperature does not exceed the maximum rate.

3. Binning System Explanation

The LED is supplied with binning codes for voltage (VF), dominant wavelength (WLD), and luminous intensity (IV). This allows designers to select components with precise characteristics for consistent performance in mass production. The bin codes are printed on the reel label. Note that the measurement allowance tolerance is ±0.1V for forward voltage, ±2nm for dominant wavelength, and ±10% for luminous intensity. All measurements are made under standard Refond test conditions.

4. Performance Curves Analysis

The typical optical characteristics curves provide valuable insights for circuit design:

• Forward Voltage vs. Forward Current (Fig 1-6): Shows the typical forward voltage rise with increasing current, essential for determining the required drive voltage.
• Forward Current vs. Relative Intensity (Fig 1-7): Illustrates that relative optical output increases almost linearly with forward current up to the maximum rating.
• Pin Temperature vs. Relative Intensity (Fig 1-8): Demonstrates that luminous intensity decreases as the pin (solder joint) temperature increases, highlighting the need for good thermal management.
• Pin Temperature vs. Forward Current (Fig 1-9): Shows the maximum allowable forward current at different pin temperatures to keep the junction temperature below 95°C.
• Forward Current vs. Dominant Wavelength (Fig 1-10): Indicates a slight shift in dominant wavelength with increasing current, typically towards longer wavelengths (red shift).
• Relative Intensity vs. Wavelength (Fig 1-11): Shows the spectral power distribution centered around 520-530nm with a half-bandwidth of ~15nm.
• Radiation Pattern (Fig 1-12): A polar plot confirms the wide 140° viewing angle with relatively uniform intensity distribution.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED comes in a 1.6mm x 0.8mm x 0.7mm package. Detailed drawings are provided for top, bottom, and side views. Polarity is indicated by a mark on the package. Recommended soldering patterns (PCB footprint) are provided for optimal assembly.

5.2 Carrier Tape and Reel Dimensions

The LEDs are packaged in carrier tape with a feeding direction shown. Key tape dimensions: width 8.0mm, pitch 4.0mm, cavity size 1.8mm x 0.92mm. Reel dimensions: outer diameter 178±1mm, inner diameter 60±1mm, hub diameter 13±0.5mm. Each reel contains 4000 pieces. Labels on the reel include part number, spec number, lot number, bin code (Φ, XY, VF, WLD), quantity, and date.

5.3 Moisture Protection and Box Packaging

The reels are vacuum-sealed in moisture barrier bags with desiccant and a humidity indicator card. The bag is then placed into a cardboard box for shipment. The box label contains handling precautions for electrostatic sensitive devices.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A standard lead-free reflow profile is recommended:

• Preheat: 150°C to 200°C for 60-120 seconds
• Time above 217°C (TL): maximum 60 seconds
• Peak temperature (TP): 260°C for maximum 10 seconds
• Cooling: maximum 6°C/s
• Total time from 25°C to peak: maximum 8 minutes

Reflow soldering must not be done more than twice. If more than 24 hours elapse between soldering processes, the LEDs may absorb moisture and become damaged. Do not apply mechanical stress during heating.

6.2 Hand Soldering and Repair

If manual soldering is used, keep temperature below 300°C for less than 3 seconds, and perform only once. Repair after soldering is not recommended; if unavoidable, use a double-head soldering iron and verify that LED characteristics are not affected. Do not mount LEDs on warped PCB or bend the board after soldering. Avoid rapid cooling.

6.3 Storage Conditions

Before opening the aluminum bag: store at ≤30°C, ≤75%RH for up to one year from date of packaging. After opening: store at ≤30°C, ≤60%RH and use within 168 hours. If storage conditions are exceeded, bake at 60±5°C for at least 24 hours before use.

7. Reliability Testing

The LED has undergone standard reliability tests per JEDEC standards:

• Reflow (260°C, 10s, 2 cycles): 0/1 failure
• Temperature Cycle (-40°C to 100°C, 100 cycles): 0/1 failure
• Thermal Shock (-40°C to 100°C, 300 cycles): 0/1 failure
• High Temperature Storage (100°C, 1000h): 0/1 failure
• Low Temperature Storage (-40°C, 1000h): 0/1 failure
• Life Test (25°C, IF=20mA, 1000h): 0/1 failure

Failure criteria: forward voltage increase >10%, reverse current >2x upper spec limit, or luminous intensity <70% of lower spec limit.

8. Application Considerations

This green LED is suitable for optical indicators, switches, symbols, and general display backlighting. Due to its wide viewing angle, it can be used in applications requiring uniform illumination over a large area. Designers should ensure proper current limiting using a resistor to avoid exceeding maximum ratings. Thermal management is critical: the high thermal resistance (450°C/W) means that heat sinking should be considered, especially if operating near maximum current. The LED should not be exposed to environments with high sulfur content (over 100ppm), bromine/chlorine compounds (single <900ppm, total <1500ppm), or volatile organic compounds that may outgas from fixture materials. Adhesives with organic vapor should be avoided. Electrostatic discharge protection is necessary during handling. The driving circuit must be designed to allow forward voltage only when on or off; reverse voltage can cause migration and damage.

9. Design Examples

A typical application: using four such green LEDs in a status indicator panel, each driven at 15mA. With a 5V supply, a series resistor of 120Ω (for VF≈3.0V) would be appropriate. The wide viewing angle ensures visibility from any direction. For backlighting a small symbol, the LED can be placed in a reflective cavity to optimize uniformity. The designer must account for bin variability: ordering a specific bin (e.g., VF=H1, WLD=E10, IV=1CG) ensures consistent brightness and color across units.

10. Technical Comparison

Compared to conventional through-hole green LEDs, this SMD package offers lower profile and better compatibility with automated assembly. Its wide viewing angle (140°) exceeds typical 120° options, making it advantageous for indicator applications where wide-angle visibility is required. The binning system allows tighter control of color and brightness than non-binned devices, improving end-product consistency.

11. Frequently Asked Questions

Q: Can I drive this LED at 30mA continuously? A: Yes, but you must ensure the junction temperature does not exceed 95°C. At maximum current, thermal resistance of 450°C/W will cause significant heating; adequate PCB copper area or heatsinking is recommended.

Q: What is the exact wavelength of this LED? A: It depends on the bin. Available bins range from 515nm to 530nm. The most common bin (E10) is 520-522.5nm.

Q: How many reflow cycles can it withstand? A: Maximum two cycles. If more than 24 hours between cycles, baking is required to avoid moisture damage.

Q: Is this LED suitable for outdoor use? A: The operating temperature range is -40°C to +85°C, but ensure the application environment does not exceed 85°C. Also avoid exposure to sulfur and high humidity without proper conformal coating.

12. Underlying Principles

Light emission in this LED is based on the electroluminescence of a green-emitting III-V semiconductor chip (likely based on InGaN/GaN material system). The chip emits photons when electrons recombine with holes in the active region. The peak wavelength is determined by the bandgap energy of the quantum wells. The wide viewing angle is achieved by the package design, typically using a clear epoxy lens with a flat top surface to scatter light in a Lambertian-like pattern. The low thermal resistance is critical for heat dissipation from the chip to the solder pads.

13. Industry Trends

The trend in SMD LEDs is toward smaller packages (e.g., 0603, 0402) with higher efficiency and better thermal performance. This 1.6x0.8mm package is a common footprint (similar to 0603 SMD size). Future developments may include further miniaturization, improved color consistency, and integrated ESD protection. The adoption of phosphor-converted green LEDs for white light generation is also growing, but this product is a direct green emitter, suitable for monochromatic applications.