Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Application
- 2. Technical Parameters
- 2.1 Electrical and Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 3. Binning System
- 3.1 Forward Voltage Bins
- 3.2 Wavelength Bins
- 3.3 Luminous Intensity Bins
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs. Forward Current (Fig. 1-6)
- 4.2 Forward Current vs. Relative Intensity (Fig. 1-7)
- 4.3 Temperature Dependence (Fig. 1-8 & 1-9)
- 4.4 Spectral Distribution (Fig. 1-11)
- 4.5 Radiation Pattern (Fig. 1-12)
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Carrier Tape and Reel
- 6. Soldering and Assembly Guide
- 6.1 Reflow Soldering Profile
- 6.2 Soldering Iron Manual Soldering
- 6.3 Cautions
- 7. Packaging and Ordering Information
- 7.1 Packaging Specification
- 7.2 Moisture Resistant Packaging
- 7.3 Cardboard Box
- 8. Application Suggestions
- 9. Technical Comparison
- 10. Frequently Asked Questions
- 10.1 What is the recommended drive current?
- 10.2 How to handle ESD sensitivity?
- 10.3 Can the LED be cleaned after soldering?
- 11. Practical Case Examples
- 12. Principle Introduction
- 13. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
This surface-mount LED is fabricated using a green chip and packaged in a compact 2.0mm x 1.25mm x 0.7mm form factor. It emits green light with dominant wavelengths ranging from 510nm to 525nm. The package features a wide viewing angle of 140 degrees, making it suitable for applications requiring broad light distribution.
1.2 Features
- Extremely wide viewing angle (140° typical)
- Suitable for all SMT assembly and solder processes
- Moisture sensitivity level: Level 3 (MSL 3)
- RoHS compliant
1.3 Application
Typical applications include optical indicators, switches and symbols, displays, and general lighting uses.
2. Technical Parameters
2.1 Electrical and Optical Characteristics
The LED is tested at IF=20mA and Ts=25°C. Key parameters include:
- Forward Voltage (VF): Ranges from 2.8V to 3.5V depending on bin (G1 through J2 bins)
- Dominant Wavelength (λD): 510nm to 525nm (bins C10 through E20)
- Luminous Intensity (IV): 260 mcd to 1000 mcd (bins 1AU through LB0)
- Spectral Half Bandwidth: 15nm typical
- Viewing Angle: 140° typical
- Reverse Current: Max 10μA at VR=5V
- Thermal Resistance: Max 450°C/W
2.2 Absolute Maximum Ratings
The maximum ratings must not be exceeded under any operating condition:
- Power Dissipation: 105 mW
- Forward Current: 30 mA
- Peak Forward Current (Pulse): 60 mA (1/10 duty, 0.1ms pulse width)
- ESD (HBM): 1000 V
- Operating Temperature: -40°C to +85°C
- Storage Temperature: -40°C to +85°C
- Junction Temperature: 95°C
3. Binning System
The LED is classified into several bins based on forward voltage, dominant wavelength, and luminous intensity to ensure consistent performance.
3.1 Forward Voltage Bins
At IF=20mA, the forward voltage is sorted into bins from G1 (2.8-2.9V) to J2 (3.3-3.4V). Each bin has a 0.1V window.
3.2 Wavelength Bins
Dominant wavelength bins cover the green spectrum: C10 (510-512.5nm), C20 (512.5-515nm), D10 (515-517.5nm), D20 (517.5-520nm), E10 (520-522.5nm), E20 (522.5-525nm).
3.3 Luminous Intensity Bins
Intensity bins range from 1AU (260-330 mcd) up to LB0 (900-1000 mcd). Each bin has a defined min/max range.
4. Performance Curves Analysis
The specification includes several typical optical characteristic curves to aid in design.
4.1 Forward Voltage vs. Forward Current (Fig. 1-6)
The IV curve shows a typical exponential relationship. At 20mA forward current, the forward voltage is within the bin range. The curve helps determine the required drive voltage for a given current.
4.2 Forward Current vs. Relative Intensity (Fig. 1-7)
Relative optical output increases with forward current but not linearly. At low currents, efficiency is higher; at higher currents, thermal effects reduce the rate of increase.
4.3 Temperature Dependence (Fig. 1-8 & 1-9)
Relative intensity decreases with increasing ambient temperature. The maximum allowable forward current must be derated as pin temperature rises. At 100°C pin temperature, the recommended forward current is significantly lower than at 25°C.
4.4 Spectral Distribution (Fig. 1-11)
The relative intensity vs. wavelength curve shows a narrow peak around 520nm, typical for green LEDs. The spectral half bandwidth is about 15nm, indicating good color purity.
4.5 Radiation Pattern (Fig. 1-12)
The radiation diagram shows a wide beam angle of approximately 140°, with uniform intensity distribution across the viewing angle.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED package measures 2.0mm x 1.25mm x 0.7mm (length x width x height). The top view shows a rectangular outline with two pads. The bottom view indicates pad dimensions: 1.00mm x 1.20mm for pad 1 and similar for pad 2. Polarity is marked with a dot or notch. The recommended soldering pattern provides a 3.20mm x 1.20mm pad with 0.80mm spacing.
5.2 Carrier Tape and Reel
LEDs are supplied on carrier tape with a pitch of 4.0mm and width of 8.0mm. Tape features polarity marks and top cover tape. The reel has a diameter of 178mm (standard 7-inch) with a hub diameter of 60mm and tape width of 8.0mm. Each reel contains 4000 pieces.
6. Soldering and Assembly Guide
6.1 Reflow Soldering Profile
The recommended reflow profile has a ramp-up rate of max 3°C/s, preheat from 150°C to 200°C for 60-120 seconds, followed by a ramp to peak temperature of 260°C for max 10 seconds. Cooling rate should be max 6°C/s. Total time from 25°C to peak should not exceed 8 minutes.
6.2 Soldering Iron Manual Soldering
If manual soldering is required, the iron temperature must be below 300°C and contact time less than 3 seconds. Only one manual solder operation is allowed.
6.3 Cautions
The LED encapsulation is soft silicone; avoid pressure on the lens surface during pick-and-place. Do not mount on warped PCB or apply mechanical stress after soldering. Rapid cooling after reflow is not recommended.
7. Packaging and Ordering Information
7.1 Packaging Specification
Standard packaging: 4000 pieces per reel. The carrier tape and reel dimensions are detailed in the specification. A label is attached to the reel containing Part Number, Spec Number, Lot Number, Bin Code, Luminous Flux, Chromaticity Bin, Forward Voltage, Wavelength, Quantity, and Date.
7.2 Moisture Resistant Packaging
The reel is placed in a moisture barrier bag along with desiccant and a humidity indicator card. The bag is vacuum-sealed and labeled with ESD warning. Maximum storage before opening: 1 year at ≤30°C and ≤75% RH. After opening, the components must be used within 168 hours (≤30°C, ≤60% RH) or baked at 60±5°C for >24 hours if exceeded.
7.3 Cardboard Box
The sealed bags are packed in cardboard boxes for shipment. Each box is labeled with handling instructions.
8. Application Suggestions
This green LED is ideal for optical indicators, switch backlighting, and display panels due to its wide viewing angle and high brightness. Designers should ensure adequate heat sinking to maintain junction temperature below 95°C. A current-limiting resistor must be used in series to prevent overcurrent. For pulse operation, duty cycle and peak current must respect the absolute maximum ratings.
9. Technical Comparison
Compared to standard green LEDs, this component offers an extremely wide viewing angle of 140°, which is advantageous for applications requiring uniform light distribution. The compact 2.0x1.25mm footprint allows high-density mounting. The multiple bin options provide flexibility for color and brightness matching in arrays.
10. Frequently Asked Questions
10.1 What is the recommended drive current?
The typical test current is 20mA, but the maximum continuous forward current is 30mA. For best efficiency and reliability, 20mA is recommended. If higher brightness is needed, pulse drive at 60mA with 10% duty cycle can be used.
10.2 How to handle ESD sensitivity?
The LED is rated for ESD of 1000V (HBM). Standard ESD precautions (grounded workstations, wrist straps, conductive packaging) should be followed during handling and assembly.
10.3 Can the LED be cleaned after soldering?
Yes, but only approved solvents such as isopropyl alcohol should be used. Ultrasonic cleaning is not recommended as it may damage the LED. The silicone encapsulant is soft and may attract dust; cleaning should be done carefully.
11. Practical Case Examples
- Automotive interior indicators: Wide angle ensures visibility from multiple seats.
- Consumer electronics: Used for power-on indicators in portable devices.
- Industrial control panels: High brightness allows readability in high ambient light.
12. Principle Introduction
The LED emits green light through electroluminescence in a gallium-based semiconductor (likely GaN or InGaN). When forward biased, electrons and holes recombine in the active layer, releasing photons with energy corresponding to the green wavelength (510-525nm). The wavelength is determined by the bandgap of the material.
13. Development Trends
Green LEDs continue to improve in efficacy and color stability. Trends include smaller packages (e.g., 0603, 0402), higher brightness for outdoor readability, and better thermal management. This 2.0x1.25mm package is already compact and suitable for miniaturized designs.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |