Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Features
- 1.3 Applications
- 2. Technical Parameters
- 2.1 Electrical and Optical Characteristics (Ts=25°C, IF=20mA)
- 2.2 Absolute Maximum Ratings
- 3. Bin Range and Sorting
- 3.1 Forward Voltage Bins (IF=20mA)
- 3.2 Luminous Intensity Bins
- 3.3 Wavelength Bins
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs Forward Current
- 4.2 Forward Current vs Relative Intensity
- 4.3 Temperature Effects
- 4.4 Radiation Pattern
- 4.5 Wavelength Stability
- 4.6 Spectrum
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Soldering Pad Layout
- 5.3 Polarity
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Cleaning and Handling
- 7. Packaging and Ordering Information
- 7.1 Packaging Details
- 7.2 Label Specification
- 7.3 Moisture Protection
- 8. Reliability Test Conditions
- 9. Failure Criteria
- 10. Handling Precautions
- 10.1 Environmental Restrictions
- 10.2 Mechanical Handling
- 10.3 Electrical Design
- 10.4 ESD Protection
- 11. Application Notes
- 12. Technical Comparison
- 13. Frequently Asked Questions
- 14. Practical Application Case
- 15. Basic Operating Principle
- 16. Development Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
1.1 General Description
The RF-GNRA30TS-CF-Z is a high-performance green LED based on InGaN technology, packaged in a standard PLCC2 format measuring 3.50mm x 2.80mm x 1.84mm. This device is designed for automotive and general lighting applications requiring high brightness and wide viewing angle.
1.2 Features
- PLCC2 package for easy SMT assembly
- Extremely wide viewing angle of 120°
- Suitable for all SMT assembly and reflow soldering processes
- Available on tape and reel (2000pcs/reel)
- Moisture sensitivity level: Level 2
- Compliant with RoHS and REACH
- Qualified according to AEC-Q101 guidelines for automotive applications
- High ESD tolerance up to 8000V (HBM)
1.3 Applications
- Automotive interior lighting (dashboard, switches, etc.)
- Indicator lamps and switches
- General indication and backlighting
2. Technical Parameters
2.1 Electrical and Optical Characteristics (Ts=25°C, IF=20mA)
The following table summarizes the key parameters:
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Forward Voltage | VF | 2.8 | 3.2 | 3.4 | V |
| Reverse Current | IR | - | - | 10 | μA |
| Luminous Intensity | IV | 900 | 1200 | 1500 | mcd |
| Dominant Wavelength | Wd | 520 | 521 | 525 | nm |
| Viewing Angle | 2θ1/2 | - | 120 | - | deg |
| Thermal Resistance (Junction to Solder) | RTHJ-S | - | - | 180 | °C/W |
All measurements are taken under standardized conditions at 25°C. Forward voltage tolerance is ±0.1V, color coordinate tolerance ±0.005, and luminous intensity tolerance ±10%.
2.2 Absolute Maximum Ratings
| Parameter | Symbol | Value | Unit |
|---|---|---|---|
| Power Dissipation | PD | 102 | mW |
| Forward Current | IF | 30 | mA |
| Peak Forward Current (1/10 duty, 10ms) | IFP | 100 | mA |
| Reverse Voltage | VR | 5 | V |
| ESD (HBM) | ESD | 8000 | V |
| Operating Temperature | TOPR | -40 ~ +100 | °C |
| Storage Temperature | TSTG | -40 ~ +100 | °C |
| Junction Temperature | TJ | 120 | °C |
Care must be taken not to exceed these ratings. The maximum current should be determined based on actual thermal conditions.
3. Bin Range and Sorting
3.1 Forward Voltage Bins (IF=20mA)
The forward voltage is sorted into six bins: G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V).
3.2 Luminous Intensity Bins
Two intensity bins are defined: 1CN (900-1200mcd) and M1 (1200-1500mcd).
3.3 Wavelength Bins
The dominant wavelength is sorted into E1 (520-522.5nm) and E2 (522.5-525nm).
4. Performance Curves Analysis
The typical optical characteristics curves are provided to aid in design. Key observations:
4.1 Forward Voltage vs Forward Current
At 20mA, VF is around 3.2V. The curve shows typical exponential diode characteristic.
4.2 Forward Current vs Relative Intensity
Relative luminous intensity increases nearly linearly with forward current up to 30mA.
4.3 Temperature Effects
As solder temperature rises from 20°C to 100°C, relative intensity decreases by about 15%. Forward voltage also decreases slightly with temperature (approx. -0.1V over 100°C). The maximum forward current is derated at high temperatures.
4.4 Radiation Pattern
The device has a wide radiation angle of 120°, with uniform intensity distribution.
4.5 Wavelength Stability
Dominant wavelength shifts slightly with forward current, approximately 0.5nm over 30mA range.
4.6 Spectrum
The emission spectrum peaks around 521nm with a narrow FWHM typical of InGaN green LEDs.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED package measures 3.50mm (length) x 2.80mm (width) x 1.84mm (height). Tolerance is ±0.2mm unless otherwise noted.
5.2 Soldering Pad Layout
Recommended soldering pattern dimensions are provided in the datasheet, including a central pad for thermal management.
5.3 Polarity
The cathode is marked with a notch on the package. Ensure correct orientation during assembly.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The recommended reflow profile: preheat from 150°C to 200°C for 60-120 seconds, ramp-up to 217°C (max 3°C/s), peak temperature 260°C for max 10 seconds, cool down at max 6°C/s. Total time from 25°C to peak should not exceed 8 minutes. Do not reflow more than twice.
6.2 Hand Soldering
If manual soldering is necessary, use a soldering iron at ≤300°C for ≤3 seconds, and only one time.
6.3 Cleaning and Handling
Use isopropyl alcohol for cleaning; avoid ultrasonic cleaning. Do not apply pressure to the silicone lens surface.
7. Packaging and Ordering Information
7.1 Packaging Details
Standard reel contains 2000 pieces. Carrier tape dimensions: width 8.0mm, pitch according to EIA-481. Reel dimensions: 178mm diameter, 60mm hub, 13mm spindle hole.
7.2 Label Specification
Each reel includes a label with part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date.
7.3 Moisture Protection
Devices are shipped in moisture barrier bags with desiccant. Before opening, store ≤30°C / ≤75%RH for up to 1 year. After opening, use within 24 hours at ≤30°C / ≤60%RH; otherwise bake at 60±5°C for >24 hours.
8. Reliability Test Conditions
The product has undergone reliability tests including reflow (260°C, 2 times), moisture sensitivity level 2 (85°C/60%RH, 168h), thermal shock (-40°C to 125°C, 1000 cycles), life test (100°C, 1000h), and high temperature/humidity life test (85°C/85%RH, 1000h). All tests passed with zero failures.
9. Failure Criteria
Acceptance criteria: forward voltage not exceed 1.1x upper spec limit, reverse current not exceed 2x upper spec limit, luminous flux not below 0.7x lower spec limit.
10. Handling Precautions
10.1 Environmental Restrictions
The sulfur content in mating materials should be below 100ppm. Bromine and chlorine each below 900ppm, combined below 1500ppm. Avoid VOCs that may attack silicone.
10.2 Mechanical Handling
Use proper tools to handle along the sides. Do not touch the silicone lens with bare hands or sharp objects.
10.3 Electrical Design
Always use current-limiting resistors. Ensure reverse voltage is never applied. Design thermal management to keep junction temperature below 120°C.
10.4 ESD Protection
This LED is sensitive to ESD. Use grounded workstations, wrist straps, and conductive packaging.
11. Application Notes
The RF-GNRA30TS-CF-Z is ideal for automotive interior lighting such as dashboard indicators, button backlighting, and ambient lighting. Its wide viewing angle (120°) ensures uniform illumination. With AEC-Q101 qualification, it meets stringent automotive reliability standards. Designers should consider derating current at high ambient temperatures and ensure adequate heat sinking through PCB copper planes.
12. Technical Comparison
Compared to standard PLCC2 green LEDs, this device offers a wider viewing angle (120° vs typical 110°), higher ESD tolerance (8000V vs 2000V), and lower thermal resistance (180°C/W). The tight binning options for VF, IV, and wavelength enable better uniformity in production.
13. Frequently Asked Questions
Q: What is the recommended current for maximum efficiency? A: Around 20mA provides a good balance between brightness and efficacy. Higher current increases brightness but reduces efficiency and generates more heat.
Q: Can this LED be used in outdoor applications? A: The operating temperature range is -40°C to +100°C, suitable for many outdoor environments, but additional protection against moisture and UV may be needed.
Q: How to choose the correct resistor? A: Use R = (Vcc - VF) / IF, where VF is typical 3.2V at 20mA, IF is desired current. Ensure power rating of resistor.
14. Practical Application Case
In a automotive instrument cluster backlighting application, using an array of these green LEDs with pulse-width modulation (PWM) dimming achieves smooth brightness control while maintaining color consistency. A thermal design incorporating copper pours under the LED pads and vias to inner layers keeps junction temperature within limits.
15. Basic Operating Principle
This LED is based on gallium nitride (InGaN) semiconductor technology. When forward current flows through the p-n junction, electrons and holes recombine in the active region, emitting photons with energy corresponding to the green wavelength (around 521nm). The PLCC2 package provides mechanical protection and efficient light extraction.
16. Development Trends
LED technology continues to advance towards higher luminous efficacy, better color rendering, and smaller packages. The automotive sector demands increasing reliability and integration with ADAS. This product aligns with trends by offering high ESD protection, wide viewing angle, and AEC-Q101 qualification, suitable for next-generation vehicle lighting.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |