LED Green 2.0x1.25x0.7mm Specification - Forward Voltage 2.8-3.5V - Power 105mW - Wavelength 515-530nm - English Technical Document

1. Product Overview

This specification describes the green SMD LED model RF-GNB170TS-CF, fabricated using a green chip with a compact package dimension of 2.0mm x 1.25mm x 0.7mm. It is designed for general optical indication, switch and symbol backlighting, and other common display applications. The LED offers an extremely wide viewing angle (140° typical) and is suitable for all SMT assembly and soldering processes. It meets moisture sensitivity level 3 and is RoHS compliant.

2. Optical & Electrical Characteristics

2.1 Forward Voltage (VF)

At a test current of 20mA, the forward voltage is binned into multiple groups: G1 (2.8-2.9V), G2 (2.9-3.0V), H1 (3.0-3.1V), H2 (3.1-3.2V), I1 (3.2-3.3V), I2 (3.3-3.4V), J1 (3.4-3.5V). The typical forward voltage is not specified but falls within these ranges. The measurement tolerance is ±0.1V.

2.2 Dominant Wavelength (λD)

The dominant wavelength at 20mA ranges from 515.0nm to 530nm, sorted into bins: D10 (515.0-517.5nm), D20 (517.5-520.0nm), E10 (520.0-522.5nm), E20 (522.5-525.0nm), F10 (525.0-527.5nm), F20 (527.5-530nm). This corresponds to a green emission color. Measurement tolerance is ±2nm.

2.3 Luminous Intensity (IV)

Luminous intensity at 20mA is binned as follows: 1AU (260-330 mcd), 1AV (330-430 mcd), 1CG (430-560 mcd), 1CL (560-700 mcd), 1CM (700-900 mcd). Typical half power angle is 140°. Measurement tolerance ±10%.

2.4 Other Optical Parameters

Spectral half bandwidth (Δλ) is typically 15nm. Reverse current (IR) at VR=5V is less than 10μA. Thermal resistance from junction to solder point (RthJ-S) at 20mA is 450°C/W.

3. Absolute Maximum Ratings

The maximum power dissipation is 105mW, forward current 30mA (DC), peak forward current 60mA (1/10 duty, 0.1ms pulse). Electrostatic discharge withstand (HBM) is 1000V. Operating temperature range -40°C to +85°C, storage temperature -40°C to +85°C, junction temperature maximum 95°C. Care must be taken that power dissipation does not exceed the absolute maximum rating.

4. Binning System

4.1 Wavelength Binning

Six dominant wavelength bins are available from 515nm to 530nm (D10, D20, E10, E20, F10, F20). Each bin covers a 2.5nm range, allowing selection of specific green tint.

4.2 Luminous Intensity Bins

Five intensity bins span from 260 mcd to 900 mcd (1AU, 1AV, 1CG, 1CL, 1CM). Higher bins indicate brighter parts.

4.3 Forward Voltage Bins

Seven voltage bins cover 2.8V to 3.5V (G1, G2, H1, H2, I1, I2, J1). This allows matching LEDs in series/parallel circuits for uniform brightness.

5. Typical Performance Curves

5.1 Forward Voltage vs. Forward Current

The curve shows forward voltage increasing from about 2.5V at 5mA to over 3.0V at 30mA, typical for InGaN green LEDs.

5.2 Forward Current vs. Relative Intensity

Relative intensity increases almost linearly with forward current up to 30mA, with slight saturation at higher currents.

5.3 Temperature Effects

Relative intensity decreases as ambient temperature rises; at 100°C it drops to about 70% of value at 25°C. Maximum allowable forward current also derates with increasing pin temperature, from 30mA at 25°C to near zero at 120°C.

5.4 Wavelength vs. Forward Current

Dominant wavelength shifts slightly (from ~521nm at 10mA to ~527nm at 30mA) due to band-filling effects. This blue-shift with increasing current is typical for InGaN LEDs.

5.5 Spectrum and Radiation Pattern

The spectral distribution has a peak around 520-530nm with a half bandwidth of ~15nm. The radiation diagram shows a wide viewing angle of 140°, with relative intensity dropping to 50% at ±70°.

6. Mechanical Package and Dimensional Details

The package is 2.00mm × 1.25mm × 0.70mm (tolerance ±0.2mm). Top view shows a rectangular shape with chamfered corners (R0.20). Bottom view indicates polarity (pad 1 is cathode, pad 2 is anode). The soldering pattern recommends a 3.2mm × 1.2mm pad with 0.8mm spacing. Recommended soldering pattern dimensions are provided in the datasheet.

7. Soldering and Handling Guidelines

7.1 Reflow Soldering Profile

Recommended reflow curve: preheat from 150°C to 200°C for 60-120 seconds; ramp-up rate ≤3°C/s; time above 217°C (TL) 60-120 seconds; peak temperature 260°C for maximum 10 seconds; cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Maximum two reflow cycles. Do not apply mechanical stress during heating.

7.2 Hand Soldering and Rework

Hand soldering iron temperature should be below 300°C for less than 3 seconds, only once. If rework is necessary, use a double-head soldering iron. Avoid rapid cooling after soldering.

7.3 Precautions

Do not mount LEDs on warped PCB portions. Do not apply mechanical force or vibration during cooling. Avoid exposing LEDs to sulfur-containing compounds (limit <100ppm for sulfur). Bromine and chlorine content in external materials must each be <900ppm, total <1500ppm. Outgassing adhesives should be avoided. Proper ESD handling is required.

8. Packaging & Ordering Information

Packaging quantity: 4000pcs per reel. Carrier tape dimensions: 8mm width, 4mm pitch, with cover tape. Reel diameter 178mm ±1mm, hub 60mm ±0.1mm. Moisture barrier bag with desiccant is used for moisture-sensitive Level 3 components. Labels include part number, spec number, lot number, bin codes for flux, chromaticity, forward voltage, wavelength, quantity, and date.

9. Reliability Test Data

Reliability tests conform to JEDEC standards: reflow (260°C, 10s, 2 times) – 22pcs; temperature cycle (-40°C to 100°C, 30min dwell, 100 cycles) – 22pcs; thermal shock (-40°C to 100°C, 15min dwell, 300 cycles) – 22pcs; high temperature storage (100°C, 1000h) – 22pcs; low temperature storage (-40°C, 1000h) – 22pcs; life test (Ta=25°C, IF=20mA, 1000h) – 22pcs. Acceptance criteria: forward voltage should not exceed 1.1×USL, reverse current not exceed 2×USL, luminous flux not fall below 0.7×LSL.

10. Application Notes

10.1 Typical Applications

Ideal for optical indicators, switch and symbol backlighting, general illumination in consumer electronics, appliances, and automotive interior lighting.

10.2 Thermal Design

Heat dissipation is critical to avoid junction temperature exceeding 95°C. Adequate PCB copper area and thermal vias are recommended. The thermal resistance of 450°C/W indicates a small package; good thermal management is essential for high current operation.

10.3 Circuit Design Considerations

Each LED must have current-limiting resistors. Reverse voltage protection is required (e.g. parallel diode) to prevent damage from reverse bias. Forward voltage variation between bins should be considered when designing series strings.

11. Comparison with Alternative Green LEDs

This 2.0x1.25mm package offers a compact footprint with a wide viewing angle of 140°, which is wider than many standard 0603 (1.6x0.8mm) or 0805 (2.0x1.25mm) alternatives that typically provide 120° viewing angle. The wavelength coverage (515-530nm) covers both pure green and yellow-green regions, suitable for matching with specific color requirements. The intensity range up to 900mcd provides sufficient brightness for indicator applications. However, thermal resistance is relatively high compared to larger package LEDs; careful thermal management is needed.

12. Frequently Asked Questions

Q: Can this LED be driven at 30mA continuously?
A: Yes, but only if junction temperature remains below 95°C. Adequate heatsinking is required. At high ambient temperatures, derating is necessary.

Q: What is the storage life before opening the sealed bag?
A: Up to 1 year in original bag at 30°C/75%RH. After opening, it must be used within 168 hours at 30°C/60%RH, otherwise baking is required (60°C for 24h).

Q: What does "Spectral Half Bandwidth" of 15nm mean?
A: It indicates the full width at half maximum of the emission spectrum. A narrower band means purer color; 15nm is typical for InGaN green LEDs.

Q: Can the LED be used in outdoor applications?
A: The operating temperature range -40°C to +85°C is suitable for many outdoor uses, but direct exposure to high humidity (>75%RH) without conformal coating may affect reliability. Sulfur and halogen contamination must be avoided.

13. Practical Use Case Example

In a smart home control panel, multiple green LEDs are used to indicate device status. Using bin F10 (525-527.5nm, 560-700mcd) provides a uniform green backlight. A series resistor of 150Ω for a 5V supply limits current to 20mA. The wide 140° viewing angle ensures readability from various angles. The compact 2.0x1.25mm package allows dense placement on a small PCB. The LED's Level 3 moisture sensitivity requires baking if the panel assembly is not completed within 168 hours of opening the moisture barrier bag.

14. Working Principle

This SMD LED is based on an InGaN (Indium Gallium Nitride) green chip. When forward biased, electrons and holes recombine in the active layer, emitting photons with energy corresponding to the green wavelength (515-530nm). The chip is encapsulated in a transparent silicone or epoxy lens, designed to extract light efficiently and provide a wide beam angle. The package uses a standard side-view SMT design with two solder pads for electrical connection.

15. Technology Trends

Green LEDs based on InGaN have seen continuous improvement in efficacy. Recent trends include higher luminous efficacy (>200 lm/W for premium parts), narrower spectral bandwidth for better color purity, and smaller packages for miniaturization. This product represents a mature technology suitable for cost-sensitive mass production. Future developments may include better thermal management within the same footprint and enhanced ESD robustness.