Table of Contents
- 1. Product Overview
- 2. Optical and Electrical Characteristics
- 2.1 Forward Voltage (VF)
- 2.2 Dominant Wavelength (λD)
- 2.3 Luminous Intensity (IV)
- 2.4 Other Parameters
- 3. Binning System
- 4. Typical Optical Characteristics Curves
- 4.1 Forward Voltage vs. Forward Current
- 4.2 Relative Intensity vs. Forward Current
- 4.3 Pin Temperature vs. Relative Intensity
- 4.4 Pin Temperature vs. Forward Current
- 4.5 Forward Current vs. Dominant Wavelength
- 4.6 Relative Intensity vs. Wavelength
- 4.7 Radiation Pattern
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Carrier Tape and Reel
- 5.3 Label Information
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Storage and Moisture Handling
- 7. Packaging and Ordering Information
- 8. Application Recommendations
- 9. Handling Precautions
- 10. Reliability and Quality
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This green chip LED is fabricated using a high-efficiency green LED chip and encapsulated in a miniature 1.6mm x 0.8mm x 0.4mm surface-mount package. The device delivers a dominant wavelength range of 525nm to 535nm, making it suitable for various indicator and display applications. With an extremely wide viewing angle of 140° and a low forward voltage starting from 2.3V, it offers excellent optical performance for general-purpose use.
The LED is designed for automated SMT assembly and is compatible with standard reflow soldering processes. It is classified as moisture sensitivity level 3 (MSL 3) and is fully RoHS compliant. The absolute maximum ratings include a power dissipation of 60mW, a forward current of 20mA (60mA peak), and an operating temperature range from -40°C to +85°C.
2. Optical and Electrical Characteristics
The following table summarizes the key optical and electrical parameters at an ambient temperature of 25°C and a test current of 2mA (unless otherwise noted).
2.1 Forward Voltage (VF)
The forward voltage is binned into several sub-ranges (D2, E1, E2, F1, F2, G1, G2) with typical values from 2.3V to 2.9V and maximum values from 2.4V to 3.0V. The exact bin code depends on the voltage measured at IF=2mA.
2.2 Dominant Wavelength (λD)
The dominant wavelength is categorized into four bins: F10 (525-527.5nm), F20 (527.5-530nm), G10 (530-532.5nm), and G20 (532.5-535nm). The spectral half bandwidth (Δλ) is typically 15nm.
2.3 Luminous Intensity (IV)
Luminous intensity is sorted into bins ranging from FD0 (90-100 mcd) through 1FS (150-160 mcd) at IF=2mA. The tolerance on measurement is ±10%.
2.4 Other Parameters
The viewing angle (2θ1/2) is 140° (typical). Reverse current (IR) at VR=5V is ≤10 μA. Thermal resistance (RTHJ-S) is ≤450 °C/W.
3. Binning System
The product is sorted by forward voltage, dominant wavelength, and luminous intensity. Bin codes are marked on the reel label as shown in the packaging section. Customers should specify the required bin combination when ordering to ensure consistency in their application.
4. Typical Optical Characteristics Curves
The data sheet provides several characteristic curves to help designers understand the device behavior under different conditions.
4.1 Forward Voltage vs. Forward Current
At low current (below 5mA), the forward voltage increases sharply. The curve shows a non-linear relationship typical of diodes. At 20mA, forward voltage is approximately 3.0V (typical for green chips).
4.2 Relative Intensity vs. Forward Current
The relative luminous intensity increases linearly with forward current up to about 20mA, after which saturation begins. This curve is useful for determining the optimal drive current for a given brightness requirement.
4.3 Pin Temperature vs. Relative Intensity
As ambient temperature rises, the relative intensity decreases. At 100°C, the intensity drops to approximately 0.85 of the value at 25°C. Thermal management is critical to maintain consistent light output.
4.4 Pin Temperature vs. Forward Current
The maximum forward current must be derated at higher pin temperatures. The safe operating area is defined in the curve; for example, at 100°C the allowable forward current reduces to about 10mA.
4.5 Forward Current vs. Dominant Wavelength
Increasing the forward current from 0 to 30mA causes a slight shift in dominant wavelength (approximately 2-3nm toward longer wavelengths) due to junction heating. This effect must be considered in color-critical applications.
4.6 Relative Intensity vs. Wavelength
The spectrum shows a narrow emission peak around 527nm (typical for green). The full width at half maximum (FWHM) is about 15nm, providing good color purity.
4.7 Radiation Pattern
The polar radiation plot indicates a wide, Lambertian-style distribution with half-intensity at approximately ±70°. This makes the LED suitable for applications requiring broad illumination.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED package measures 1.6mm (length) x 0.8mm (width) x 0.4mm (height). Tolerances are ±0.2mm unless otherwise noted. The top view shows two electrical pads (pad 1 and pad 2) with dimensions 0.22mm x 0.70mm. The bottom view indicates the polarity mark (anode pad is larger). The recommended soldering pattern is provided with pad dimensions 0.8mm x 0.8mm spaced 2.4mm apart.
5.2 Carrier Tape and Reel
The LEDs are packaged in carrier tape with 8mm width, 4mm pitch, and a cavity size accommodating the 1.6x0.8mm package. The tape includes polarity marks and a top cover tape. Each reel holds 4,000 pieces. The reel outer diameter is 178±1mm, hub diameter 60±1mm, and tape width 8.0±0.1mm.
5.3 Label Information
The reel label includes the part number, spec number, lot number, bin code (luminous flux, chromaticity, forward voltage, wavelength), quantity, and date code. The label is affixed to the reel and also to the moisture barrier bag.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
The recommended reflow profile follows JEDEC standards. Key parameters: ramp-up rate ≤3°C/s, preheat from 150°C to 200°C for 60-120 seconds, time above 217°C (TL) of 60-150 seconds, peak temperature (TP) 260°C with a maximum time of 10 seconds within 5°C of TP, and cooling rate ≤6°C/s. The total time from 25°C to peak should not exceed 8 minutes. Only two reflow passes are allowed.
6.2 Hand Soldering
If manual soldering is required, the iron temperature must be ≤300°C and contact time ≤3 seconds. Only one hand-soldering operation is permitted.
6.3 Storage and Moisture Handling
The LEDs are stored in a moisture barrier bag with desiccant. Before opening the bag, storage conditions are ≤30°C and ≤75% RH for up to one year. After opening, the LEDs must be used within 168 hours at ≤30°C and ≤60% RH. If the storage time is exceeded or the desiccant indicator shows moisture, the LEDs must be baked at 60±5°C for at least 24 hours before use.
7. Packaging and Ordering Information
The standard packaging unit is a reel of 4,000 pieces. The reels are sealed in moisture barrier bags, with labels indicating bin codes. Multiple reels are packed in cardboard boxes. When ordering, customers should specify the required bin codes for forward voltage, wavelength, and intensity to ensure product uniformity.
8. Application Recommendations
This green LED is suitable for optical indicators, switches, symbols, displays, and general-purpose lighting. Designers should consider thermal management: the junction temperature must not exceed 95°C, and power dissipation should be kept under 60mW. A current-limiting resistor is mandatory to prevent current overshoot due to voltage variations. The LED is ESD-sensitive (HBM 1000V); proper ESD protection during handling is required.
9. Handling Precautions
Avoid applying mechanical stress to the silicone lens. Use proper tools to pick and place the LEDs from the side. Do not touch the lens surface directly. The environment must have low sulfur content (<100ppm) to prevent discoloration. Bromine and chlorine content in surrounding materials should be individually <900ppm and total <1500ppm. Volatile organic compounds (VOCs) can degrade the silicone encapsulant; avoid adhesives that outgas organic vapors.
10. Reliability and Quality
The product is subjected to reliability tests including reflow (260°C, 10s, 2 cycles), temperature cycle (-40°C to 100°C, 100 cycles), thermal shock (-40°C to 100°C, 300 cycles), high-temperature storage (100°C, 1000h), low-temperature storage (-40°C, 1000h), and life test (25°C, 2mA, 1000h). Acceptance criteria: forward voltage change ≤1.1x upper spec limit, reverse current ≤2x upper spec limit, and luminous intensity ≥0.7x lower spec limit.
The technical information provided is based on typical characteristics and does not constitute a warranty for specific applications. End users should verify performance in their own system conditions.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |