Green-Yellow SMD LED 3.2x1.6x0.7mm - Forward Voltage 1.8-2.4V - Power 72mW - English Datasheet

1. Description and Key Features

1.1 General Description

This LED product is a green-yellow SMD LED fabricated using a green-yellow chip. The package dimensions are 3.2mm x 1.6mm x 0.7mm. It is designed for surface mount assembly and is compatible with standard SMT processes.

1.2 Features

• Extremely wide viewing angle of 140 degrees.
• Suitable for all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3 (MSL 3).
• RoHS compliant.

1.3 Applications

• Optical indicators.
• Switches, symbols, and displays.
• General illumination and signage.

2. Package Dimension and Soldering Patterns

2.1 Mechanical Dimensions

The LED package measures 3.20mm x 1.60mm x 0.70mm (length x width x height). Top view shows a rectangular outline. The bottom view indicates a large anode pad (pad 2) and smaller cathode pad (pad 1). Side view shows total height. Polarity is marked on the top surface. Recommended solder pad layout is provided with specific dimensions: a central pad of 1.50mm x 1.60mm for the large pad, and two side pads of 0.30mm x 1.60mm for the other terminals. All dimensions are in millimeters with tolerances of ±0.2mm unless otherwise noted.

Fig.1-1 to Fig.1-5 illustrate the top, bottom, side views, polarity mark, and recommended soldering pattern.

3. Electrical and Optical Characteristics

3.1 Parameter Definitions

At test condition IF=20mA and Ts=25°C, the LED exhibits the following characteristics:

• Spectral Half Bandwidth (Δλ): Typical 15nm.
• Forward Voltage (VF): Binned into three groups: B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V). Typical values vary within these ranges.
• Dominant Wavelength (λD): Binned into five groups covering 562.5nm to 575nm: A20 (562.5-565nm), B10 (565-567.5nm), B20 (567.5-570nm), C10 (570-572.5nm), C20 (572.5-575nm).
• Luminous Intensity (IV): Binned into six groups from 12mcd to 100mcd: B00 (12-18mcd), C00 (18-28mcd), D00 (28-43mcd), E00 (43-65mcd), F10 (65-80mcd), F20 (80-100mcd).
• Viewing Angle (2θ1/2): 140 degrees typical.
• Reverse Current (IR): 10μA maximum at VR=5V.
• Thermal Resistance (RTHJ-S): 450°C/W maximum.

3.2 Absolute Maximum Ratings

Measurements tolerance: VF ±0.1V, λD ±2nm, IV ±10%.

4. Typical Optical Characteristics Curves

The datasheet provides several characteristic curves measured at Ta=25°C unless otherwise specified:

4.1 Forward Voltage vs Forward Current

Figure 1-6 shows the forward voltage as a function of forward current. At 20mA, forward voltage is approximately 1.8-2.4V depending on bin. The curve indicates a typical diode exponential shape.

4.2 Forward Current vs Relative Intensity

Figure 1-7 shows that relative intensity increases with forward current. At 20mA, relative intensity is about 1.0 (normalized). At 30mA (maximum), intensity is higher but caution is needed due to thermal limits.

4.3 Pin Temperature vs Relative Intensity

Figure 1-8 indicates that as ambient temperature rises, relative intensity decreases. At 100°C, intensity drops to approximately 0.8 of the value at 25°C.

4.4 Pin Temperature vs Forward Current

Figure 1-9 shows the derating curve: the maximum allowable forward current decreases as pin temperature increases. At 100°C, the maximum current is about 10mA.

4.5 Forward Current vs Dominant Wavelength

Figure 1-10 demonstrates a slight blue shift with increasing current: at 20mA the wavelength is around 570nm, decreasing to about 568nm at 30mA.

4.6 Relative Intensity vs Wavelength

Figure 1-11 shows the spectral distribution. The peak emission is around 570nm with a half bandwidth of 15nm. The spectrum is narrow and typical for green-yellow LEDs.

4.7 Radiation Pattern

Figure 1-12 illustrates the radiation characteristics. The LED has a wide viewing angle of 140°, which is beneficial for indicator applications requiring broad coverage.

5. Packaging Information

5.1 Packaging Specification

The LEDs are packaged in tape and reel format with 4000 pieces per reel. The carrier tape has a width of 8mm and pitch of 4mm. Polarity orientation is clearly marked on the tape.

5.2 Carrier Tape and Reel Dimensions

The carrier tape pocket dimensions are designed to securely hold the 3.2x1.6x0.7mm package. The reel has an outer diameter of 178±1mm, hub diameter of 60±1mm, and tape width of 8.0±0.1mm.

5.3 Label Information

Each reel is labeled with part number, spec number, lot number, bin code (including flux, chromaticity bin, forward voltage, wavelength code), quantity, and date code.

5.4 Moisture Resistant Packing

Reels are sealed in a moisture barrier bag together with a desiccant and humidity indicator card. The bag is labeled with ESD caution and moisture sensitivity level notice.

5.5 Reliability Test Items and Conditions

The LEDs have been subjected to reliability tests according to JEDEC standards:

• Reflow soldering (260°C max, 10s, 2 cycles)
• Temperature cycle (-40°C to 100°C, 100 cycles)
• Thermal shock (-40°C to 100°C, 300 cycles)
• High temperature storage (100°C, 1000h)
• Low temperature storage (-40°C, 1000h)
• Life test (25°C, IF=20mA, 1000h)

Acceptance criteria: 0 failures allowed out of 22 pieces for each test.

5.6 Failure Criteria

After reliability tests, the following changes are considered failures:

• VF increases beyond 1.1 times the upper spec limit.
• IR increases beyond 2 times the upper spec limit.
• Luminous flux drops below 0.7 times the lower spec limit.

6. SMT Reflow Soldering Instructions

6.1 Reflow Profile Parameters

The recommended reflow soldering profile is provided to ensure proper soldering without damaging the LED. Key parameters:

• Average ramp-up rate (Tsmax to Tp): max 3°C/s
• Preheat: 150°C to 200°C for 60-120s
• Time above 217°C: 60-150s
• Peak temperature: 260°C, max 10s
• Cooling rate: max 6°C/s
• Total time from 25°C to peak: max 8 minutes

Reflow should not be performed more than twice. If more than 24 hours between two soldering steps, the LEDs may absorb moisture and get damaged.

6.2 Hand Soldering and Repair

Manual soldering: iron temperature below 300°C, time less than 3 seconds, only once. Repair should be avoided; if necessary, use a double-head soldering iron.

7. Handling and Storage Precautions

7.1 Environmental Considerations

The operating environment should have sulfur compound concentration below 100PPM. Halogen content: Br < 900PPM, Cl < 900PPM, total Br+Cl < 1500PPM. Volatile organic compounds (VOCs) can penetrate silicone encapsulant and cause discoloration; avoid adhesives that outgas organic vapor.

7.2 Mechanical Handling

Use tweezers along side surfaces; do not touch or press the silicone lens directly. Avoid mechanical stress after soldering. Do not warp the PCB.

7.3 Storage Conditions

If the moisture indicator card shows excessive humidity or storage time exceeded, baking is required.

7.4 ESD and Circuit Design

LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Proper ESD protection measures should be implemented. In circuit design, always include a current-limiting resistor to prevent current exceeding the absolute maximum rating. Reverse voltage must be avoided as it can cause migration and damage.

7.5 Cleaning

If cleaning is necessary, use isopropyl alcohol. Do not use solvents that may attack the package resin. Ultrasonic cleaning is not recommended as it may damage the LED.