Green-Yellow LED RF-GSB170TS-BC Datasheet - 2.0x1.25x0.7mm - 1.8-2.4V - 72mW - English Technical Document

1. Product Overview

1.1 General Description

This document specifies the RF-GSB170TS-BC green-yellow light emitting diode (LED). The device is fabricated using a green-yellow chip and packaged in a compact surface-mount form factor measuring 2.0 mm x 1.25 mm x 0.7 mm. It is designed for general-purpose optical indication and illumination applications where a wide viewing angle and low power consumption are required.

1.2 Features

• Extremely wide viewing angle: 140° typical
• Suitable for all SMT assembly and reflow soldering processes
• Moisture sensitivity level: Level 3 (per JEDEC standard)
• RoHS compliant – free from hazardous substances

1.3 Applications

• Optical indicators and status lamps
• Switch backlighting and symbol illumination
• Display backlighting
• General-purpose electronic equipment

2. Technical Parameters

2.1 Electrical and Optical Characteristics (Ts=25°C, IF=20mA unless otherwise noted)

The following parameters are measured under the specified test conditions. Tolerance for forward voltage is ±0.1 V, dominant wavelength ±2 nm, and luminous intensity ±10%.

• Spectral Half Bandwidth: Typical 15 nm
• Forward Voltage (VF): Available in bins B0, C0, D0. Values at 20 mA: B0 min/typ/max = 1.8/2.0/2.0 V; C0 = 2.0/2.2/2.4 V; D0 = 2.2/2.2/2.4 V
• Dominant Wavelength (λD): Available in bins A10 (560.0–562.5 nm), A20 (562.5–565.0 nm), B10 (565.0–567.5 nm), B20 (567.5–570.0 nm), C10 (570.0–572.5 nm), C20 (572.5–575.0 nm)
• Luminous Intensity (IV): Available in bins C00 (18–28 mcd), D00 (28–43 mcd), E00 (43–65 mcd), F00 (65–100 mcd)
• Viewing Angle (2θ1/2): 140° typical
• Reverse Current (IR) at VR=5V: Max 10 μA
• Thermal Resistance (RTHJ-S): Max 450 °C/W

2.2 Absolute Maximum Ratings (Ts=25°C)

• Power Dissipation (Pd): 72 mW
• Forward Current (IF): 30 mA
• Peak Forward Current (IFP, 1/10 duty, 0.1ms pulse): 60 mA
• Electrostatic Discharge (HBM): 2000 V
• Operating Temperature (Topr): -40 ~ +85°C
• Storage Temperature (Tstg): -40 ~ +85°C
• Junction Temperature (Tj): 95°C

Design must ensure that the junction temperature never exceeds 95°C. Proper thermal management and current limiting resistors are essential for reliable operation.

3. Binning System

3.1 Wavelength Bins

The dominant wavelength is sorted into six bins covering the range from 560 nm to 575 nm. Each bin spans 2.5 nm to ensure color consistency. The bins are designated as A10, A20, B10, B20, C10, and C20.

3.2 Luminous Intensity Bins

Luminous intensity is sorted into four bins: C00 (18–28 mcd), D00 (28–43 mcd), E00 (43–65 mcd), and F00 (65–100 mcd). This allows customers to select the appropriate brightness level for their application.

3.3 Forward Voltage Bins

Forward voltage at 20 mA is grouped into three bins: B0 (1.8–2.0 V), C0 (2.0–2.4 V), and D0 (2.2–2.4 V). Note that the typical value for C0 and D0 is 2.2 V, while B0 typical is 2.0 V.

4. Performance Curves

4.1 Forward Voltage vs. Forward Current

As shown in Fig. 1-6, the forward voltage increases with forward current in a nonlinear manner. At 20 mA the typical forward voltage is around 2.2 V (for C0/D0 bins) or 2.0 V (for B0 bin). At lower currents the forward voltage decreases accordingly.

4.2 Relative Intensity vs. Forward Current

Fig. 1-7 illustrates that relative intensity rises almost linearly with forward current up to about 15 mA, then begins to saturate. Operating the LED beyond 20 mA yields diminishing returns in light output and increases junction temperature.

4.3 Temperature Dependence

Fig. 1-8 shows that relative intensity decreases as ambient temperature rises. At 85°C the intensity is approximately 20% lower than at 25°C. Fig. 1-9 indicates that the maximum allowable forward current must be derated at elevated pin temperatures to keep the junction below 95°C. For pin temperatures above 60°C, the current should be reduced linearly.

4.4 Spectral Distribution

Fig. 1-11 presents the relative intensity as a function of wavelength. The emission spectrum peaks near 570 nm with a half-bandwidth of about 15 nm. The color is perceived as green-yellow.

4.5 Radiation Pattern

Fig. 1-12 shows the radiation characteristics. The viewing angle (2θ1/2) is 140°, indicating a very wide beam suitable for indicator applications requiring visibility from a wide range of angles.

5. Mechanical Dimensions and Packaging

5.1 Package Dimensions

The LED package measures 2.0 mm x 1.25 mm x 0.7 mm. The top view shows a rectangular body with a circular lens. The bottom view indicates two solder pads with polarity marking. Detailed mechanical drawings are provided in the datasheet (Fig. 1-1 to 1-4). All dimensions are in millimeters with tolerances of ±0.2 mm unless otherwise specified.

5.2 Soldering Patterns

Recommended soldering pads are shown in Fig. 1-5. The pad dimensions are 3.20 mm x 1.20 mm with a spacing of 0.80 mm. Proper pad geometry ensures reliable solder joint formation and good thermal conduction.

5.3 Polarity Marking

The cathode is identified by a notch or marking on the package (Fig. 1-4). Correct orientation must be observed during assembly to avoid reverse voltage damage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile is shown in Fig. 3-1. Key parameters:

• Average ramp-up rate (Tsmax to TP): max 3°C/s
• Preheat: 150°C to 200°C, 60–120 s
• Time above 217°C (TL): 60–150 s
• Peak temperature (TP): 260°C
• Time within 5°C of peak (tp): max 10 s
• Cooling rate: max 6°C/s
• Total time from 25°C to peak: max 8 minutes

Do not perform reflow soldering more than twice. If more than 24 hours elapse between two solder cycles, the LEDs may absorb moisture and require baking before the second reflow.

6.2 Hand Soldering

If manual soldering is necessary, use a soldering iron with tip temperature below 300°C and a dwell time not exceeding 3 seconds. Only one soldering attempt per LED should be made.

6.3 Storage and Baking

LEDs are shipped in moisture barrier bags. Storage before opening: ≤30°C, ≤75% RH, shelf life 1 year. After opening: ≤30°C, ≤60% RH, usable within 168 hours. If the desiccant has expired or the humidity indicator shows a change, bake the LEDs at 60±5°C for more than 24 hours before use.

7. Packaging Information

7.1 Carrier Tape and Reel

LEDs are packaged in carrier tape with a pitch of 4.0 mm, width 8.0 mm. A reel contains 4000 pieces. The reel dimensions are 178 mm outer diameter, 60 mm inner diameter, and 13.0 mm hub hole.

7.2 Labeling

Each reel is labeled with part number, specification number, lot number, bin codes for flux, chromaticity, forward voltage, wavelength, quantity, and date. A sample label is shown in Fig. 2-3.

7.3 Moisture Barrier Bag

The reel is placed inside a moisture barrier bag with a desiccant and a humidity indicator card. The bag is then sealed to maintain low humidity during storage and transport.

8. Reliability Test

The LED has been qualified according to the following tests (per JEDEC standards where applicable):

• Reflow soldering (260°C max, 10 s, 2 times): 0 failures in 22 samples
• Temperature cycle (-40°C to 100°C, 5 min transition, 30 min dwell, 100 cycles): 0 failures
• Thermal shock (-40°C to 100°C, 15 min dwell, 300 cycles): 0 failures
• High temperature storage (100°C, 1000 hours): 0 failures
• Low temperature storage (-40°C, 1000 hours): 0 failures
• Life test (Ta=25°C, IF=20 mA, 1000 hours): 0 failures

Acceptance criteria: Forward voltage shift ≤ 1.1x upper spec limit, reverse current ≤ 2.0x upper spec limit, luminous flux ≥ 0.7x lower spec limit.

9. Handling Precautions

9.1 Chemical Compatibility

The LED must not be exposed to environments containing sulfur compounds exceeding 100 ppm. Halogen content (bromine and chlorine) in surrounding materials must be individually below 900 ppm and combined below 1500 ppm. Volatile organic compounds (VOCs) can penetrate the silicone encapsulant and cause discoloration. Avoid adhesives that outgas organic vapors.

9.2 Mechanical Handling

Use tweezers or appropriate tools to pick the LED from the side. Do not touch or press the silicone lens surface directly as it may damage internal circuitry. After soldering, avoid bending the PCB or applying mechanical stress during cooling.

9.3 Electrical Overstress and ESD

LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Use proper ESD protection measures (grounded workstations, wrist straps, conductive packaging). The device can withstand 2000 V HBM, but care should still be taken.

9.4 Thermal Management

To maintain junction temperature below 95°C, design adequate heat sinking in the PCB layout. Current should be derated at high ambient temperatures. The thermal resistance of 450°C/W means that 30 mA will cause a temperature rise of 13.5°C above the solder point, under ideal conditions.

10. Application Notes

10.1 Typical Applications

The wide viewing angle and green-yellow color make this LED ideal for status indicators on consumer electronics, automotive dashboards, industrial control panels, and medical devices. Its compact size fits space-constrained designs.

10.2 Circuit Design Considerations

Always use a current-limiting resistor in series with the LED. The resistor value can be calculated as R = (Vcc - VF) / IF, where Vcc is the supply voltage. The forward voltage varies with bin; use the appropriate bin value or include a margin. For parallel arrays, ensure each LED has its own resistor to balance current. Reverse voltage protection (e.g., a blocking diode) is recommended if the circuit could experience reverse bias.

11. Principles of Operation

An LED is a semiconductor p-n junction that emits light when electrons recombine with holes. The energy released during recombination determines the wavelength of the emitted light. In this device, the green-yellow chip uses a material with a bandgap energy corresponding to approximately 560–575 nm. The light is extracted through a transparent silicone lens that also shapes the radiation pattern. The wide viewing angle (140°) is achieved through specific lens geometry and chip placement.

12. Development Trends

The market for visible LEDs continues to evolve toward higher efficacy, smaller packages, and better color uniformity. Future generations of green-yellow LEDs may achieve higher luminous efficacy (lm/W) through improved epitaxial structures and phosphor conversion. The trend toward miniaturization in portable devices favors ultra-compact packages like this 2.0×1.25 mm size. Additionally, increased robustness to harsh environments (high temperature, humidity) is an ongoing focus.