LED Lamp 333-2SUBC/C470/S400-A6 Datasheet - Blue 470nm - 3.4V - 20mA - English Technical Document

1. Product Overview

This document details the technical specifications for a high-brightness blue LED lamp. The device is engineered for applications demanding superior luminous output and reliability. It features a compact package suitable for automated assembly processes.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include a selection of various viewing angles, availability on tape and reel for efficient production, and a robust, reliable design. It is compliant with Pb-free and RoHS directives, making it suitable for environmentally conscious manufacturing. The product is specifically designed for applications requiring higher brightness levels and is available in different colors and intensities. Its target applications include consumer electronics such as television sets, computer monitors, telephones, and general computer peripherals.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's key electrical, optical, and thermal parameters.

2.1 Absolute Maximum Ratings

The device's operational limits are defined under specific ambient conditions (Ta=25°C). Exceeding these ratings may cause permanent damage.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (IFP): 100 mA. This pulsed current rating applies under a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage beyond this limit can damage the LED junction.
• Power Dissipation (Pd): 110 mW. This is the maximum power the package can dissipate.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40°C to +100°C.
• Soldering Temperature (Tsol): 260°C for 5 seconds, defining the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These parameters are measured at the standard test condition of IF=20mA and Ta=25°C, unless otherwise specified.

• Luminous Intensity (Iv): Ranges from a minimum of 1000 mcd to a typical 2000 mcd. This high intensity is a key feature for visibility.
• Viewing Angle (2θ1/2): The typical full viewing angle at half intensity is 10 degrees, indicating a relatively narrow beam pattern.
• Peak Wavelength (λp): Typically 468 nm.
• Dominant Wavelength (λd): Typically 470 nm, defining the perceived blue color.
• Spectrum Radiation Bandwidth (Δλ): Typically 20 nm, indicating the spectral purity.
• Forward Voltage (VF): Typically 3.4 V, with a maximum of 4.0 V at 20mA. Designers must account for this voltage drop in their driver circuits.
• Reverse Current (IR): Maximum 50 μA at VR=5V.

Note: Measurement uncertainties are provided for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm), which are important for precision applications.

3. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

This graph shows the spectral power distribution, centered around the 470nm dominant wavelength with a typical bandwidth. It confirms the monochromatic blue light output.

3.2 Directivity Pattern

The directivity curve visualizes the 10-degree viewing angle, showing how light intensity decreases as the angle from the central axis increases.

3.3 Forward Current vs. Forward Voltage (IV Curve)

This non-linear relationship is critical for driver design. The curve shows the voltage rise with increasing current, highlighting the typical 3.4V operating point at 20mA.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output increases with current but may not be perfectly linear, especially as current approaches the maximum rating. It emphasizes the need for constant current drive for stable brightness.

3.5 Temperature Dependence

Two key graphs are provided:

Relative Intensity vs. Ambient Temperature: Shows how luminous output typically decreases as ambient temperature increases. Effective heat sinking is crucial to maintain performance.

Forward Current vs. Ambient Temperature: May illustrate how the forward voltage characteristic shifts with temperature, which can affect driver circuit stability.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing. Key notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. Precise dimensions are essential for PCB footprint design and ensuring proper fit within the assembly.

4.2 Polarity Identification

The cathode (negative) lead is typically indicated in the dimensional drawing, often by a flat spot on the lens, a shorter lead, or a specific marking on the package. Correct polarity orientation during assembly is mandatory.

5. Soldering and Assembly Guidelines

Proper handling is vital for reliability. The guidelines are comprehensive.

5.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base.
• Forming must be done before soldering.
• Avoid stressing the package; misaligned PCB holes can cause stress and degradation.
• Cut leads at room temperature.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% RH after receipt. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature max 300°C (30W max), time max 3 seconds.

Wave/DIP Soldering: Preheat max 100°C (60 sec max), solder bath max 260°C for 5 seconds.

A recommended soldering temperature profile graph is provided, showing the time-temperature relationship for reflow. Key points: avoid stress on leads at high temperature, do not solder more than once, protect the LED from shock while cooling, and avoid rapid cooling. Always use the lowest effective temperature.

5.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Do not use ultrasonic cleaning unless pre-qualified, as it can cause damage.

5.5 Heat Management

Thermal management must be considered during the application design phase. Excessive junction temperature reduces light output and lifespan. The operating current should be appropriately de-rated based on the thermal environment of the final application.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed in anti-static bags for ESD protection. The packing hierarchy is: 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per master (outside) carton.

6.2 Label Explanation

Labels on packaging contain several codes:

- CPN: Customer's Production Number

- P/N: Manufacturer's Part Number (e.g., 333-2SUBC/C470/S400-A6)

- QTY: Quantity

- CAT: Ranks/Binning

- HUE: Dominant Wavelength

- REF: Reference

- LOT No: Traceable Lot Number

6.3 Model Number Breakdown

The part number 333-2SUBC/C470/S400-A6 likely encodes package style (333), lead count/configuration (2SUBC), dominant wavelength (C470), luminous intensity bin (S400), and possibly a revision or variant code (A6).

7. Application Notes and Design Considerations

7.1 Typical Application Scenarios

This high-brightness blue LED is ideal for status indicators, backlighting for small displays, panel illumination, and decorative lighting in consumer electronics like TVs, monitors, and telephones where a vivid blue signal is required.

7.2 Circuit Design

Always use a series current-limiting resistor or a dedicated constant-current LED driver. Calculate the resistor value based on the supply voltage (Vs), the LED's typical forward voltage (Vf ≈ 3.4V), and the desired operating current (e.g., 20mA): R = (Vs - Vf) / If. Ensure the resistor's power rating is adequate.

7.3 PCB Layout

Follow the recommended footprint from the dimensional drawing. Ensure adequate copper area or thermal vias for heat dissipation if operating at high ambient temperatures or near maximum current.

8. Technical Comparison and Differentiation

Compared to standard indicator LEDs, this device's key differentiator is its high luminous intensity (up to 2000 mcd), making it suitable for applications where visibility under bright ambient light is crucial. The narrow 10-degree viewing angle concentrates the light into a more directed beam compared to wider-angle LEDs, which is advantageous for certain optical designs.

9. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 25mA continuously?

A: Yes, 25mA is the absolute maximum continuous rating. For improved longevity and reliability, operating at or below the typical 20mA is recommended.

Q: What is the difference between peak and dominant wavelength?

A: Peak wavelength is where the spectral output is highest. Dominant wavelength is the single wavelength perceived by the human eye, which determines the color. They are often close but not identical.

Q: How critical is the 3mm distance for soldering?

A: Very critical. Soldering closer can transfer excessive heat to the epoxy bulb, potentially causing internal stress, cracking, or degradation of the optical material and the semiconductor die.

10. Practical Use Case Example

Scenario: Designing a status indicator for a network router.

The LED needs to be visible from across a room. The designer selects this LED for its high brightness. They design a driver circuit using a 5V supply. Using Ohm's Law with Vf=3.4V and If=20mA, they calculate a series resistor of (5V - 3.4V) / 0.02A = 80 Ohms. A standard 82 Ohm, 1/8W resistor is chosen. The PCB layout includes the exact footprint, and during assembly, wave soldering parameters are strictly set to the recommended 260°C for 5 seconds, ensuring the solder joint is >3mm from the LED body.

11. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage is applied across the p-n junction, electrons and holes recombine within the active region (composed of InGaN material for blue light). This recombination releases energy in the form of photons (light). The specific wavelength of 470 nm (blue) is determined by the bandgap energy of the InGaN semiconductor material used in the chip.

12. Industry Trends

The LED industry continues to focus on increasing luminous efficacy (lumens per watt), improving color rendering, and enhancing reliability. Packaging technologies are evolving to allow for higher power density and better thermal management. There is also a trend towards miniaturization while maintaining or increasing light output, as seen in advanced SMD packages. The drive for energy efficiency across all electronic devices ensures LEDs remain the dominant technology for indicators and illumination.