1. Product Overview
This document details the specifications for a high-brightness brilliant green LED lamp. The device is designed for applications requiring superior luminous output and reliability. It features a water-clear resin encapsulation that enhances light extraction and provides a clear, brilliant green color. The product is compliant with RoHS directives and is available in packaging suitable for automated assembly processes.
1.1 Core Features and Advantages
The LED offers several key advantages for design engineers:
- High Luminous Intensity: Delivers typical luminous intensity values ranging from 4000 to 8000 millicandelas (mcd) at a standard drive current of 20mA, making it suitable for indicator and backlighting applications requiring high visibility.
- Narrow Viewing Angle: Features a typical viewing angle (2θ1/2) of 10 degrees, providing a focused beam of light ideal for directed illumination or status indicators.
- Choice of Packaging: Available on tape and reel, facilitating efficient pick-and-place manufacturing.
- Robust Construction: Designed for reliable operation with robust lead frame and encapsulation.
- Environmental Compliance: The product is lead-free (Pb-free) and remains within RoHS compliant specifications.
1.2 Target Market and Applications
This LED is targeted at consumer electronics and display applications where bright, reliable indicators are essential. Typical applications include:
- Status indicators for television sets and monitors.
- Backlighting or indicator lights for telephones and communication devices.
- Indicator lights on computer peripherals and internal components.
2. Technical Parameter Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Continuous Forward Current (IF): 25 mA - The maximum DC current that can continuously flow through the LED.
- Electrostatic Discharge (ESD): 150 V (Human Body Model) - Indicates the device's sensitivity to static electricity; proper ESD handling precautions are necessary.
- Reverse Voltage (VR): 5 V - The maximum voltage that can be applied in the reverse direction.
- Power Dissipation (Pd): 110 mW - The maximum power the package can dissipate at an ambient temperature of 25°C.
- Operating Temperature (Topr): -40°C to +85°C - The ambient temperature range for normal operation.
- Storage Temperature (Tstg): -40°C to +100°C - The temperature range for safe storage.
- Soldering Temperature (Tsol): 260°C for 5 seconds - The peak temperature and time tolerance for wave or reflow soldering.
2.2 Electro-Optical Characteristics (Ta=25°C)
These are the typical performance parameters measured under specified test conditions. Design should be based on these values.
- Luminous Intensity (Iv): Min. 4000 mcd, Typ. 8000 mcd (at IF=20mA). This high intensity is the primary feature.
- Viewing Angle (2θ1/2): Typ. 10 degrees. A narrow angle concentrates the light output.
- Peak Wavelength (λp): Typ. 525 nm. The wavelength at which the emitted light intensity is highest.
- Dominant Wavelength (λd): Typ. 530 nm. The single wavelength perceived by the human eye, defining the green color.
- Forward Voltage (VF): Typ. 3.4 V, Max. 4.0 V (at IF=20mA). Important for driver circuit design and power supply selection.
- Reverse Current (IR): Max. 50 μA (at VR=5V). Specifies leakage current in the off state.
Measurement Tolerances: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm.
3. Performance Curve Analysis
The datasheet provides several characteristic curves that illustrate device behavior under varying conditions. These are critical for understanding real-world performance beyond the single-point specifications.
3.1 Relative Intensity vs. Wavelength
This spectral distribution curve shows the light output across different wavelengths. It confirms the green color emission with a peak around 525nm and a typical spectral bandwidth (Δλ) of 35nm, which defines the purity of the green color.
3.2 Directivity Pattern
The polar plot illustrates the spatial distribution of light intensity, correlating with the 10-degree viewing angle. It shows how intensity drops off sharply outside the central beam.
3.3 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship between current and voltage. The typical forward voltage of 3.4V at 20mA is a key operating point. The curve is essential for designing current-limiting circuits, as LEDs are current-driven devices.
3.4 Relative Intensity vs. Forward Current
This graph demonstrates that light output (intensity) is approximately proportional to the forward current, up to the maximum rating. It highlights the importance of stable current control for consistent brightness.
3.5 Temperature Dependence
Two key curves show the impact of ambient temperature (Ta):
Relative Intensity vs. Ambient Temp.: Shows that luminous output decreases as ambient temperature increases. This is due to reduced internal quantum efficiency at higher temperatures.
Forward Current vs. Ambient Temp.: Indicates how the forward voltage characteristic shifts with temperature. Typically, VF decreases slightly with increasing temperature for InGaN-based LEDs.
4. Mechanical and Package Information
4.1 Package Dimensions
The LED features a standard radial leaded package (often referred to as a \"lamp\" package). Key dimensional notes include:
- All dimensions are in millimeters (mm).
- The height of the flange (the flat section at the base of the lens) must be less than 1.5mm (0.059\").
- General tolerance for unspecified dimensions is ±0.25mm.
The dimensional drawing specifies the lead spacing, body diameter, lens shape, and overall height, which are critical for PCB footprint design and ensuring proper fit within enclosures.
4.2 Polarity Identification
The longer lead typically denotes the anode (positive terminal), while the shorter lead is the cathode (negative terminal). This is a standard convention for radial LEDs. The cathode may also be indicated by a flat edge on the LED lens or a notch in the plastic base. Correct polarity is essential for operation.
5. Soldering and Assembly Guidelines
Proper handling is crucial to maintain LED performance and reliability.
5.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb to avoid stress on the internal die and wire bonds.
- Perform lead forming before soldering.
- Avoid applying stress to the LED package during forming.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
5.2 Storage Conditions
- Recommended storage: ≤30°C and ≤70% Relative Humidity (RH).
- Shelf life after shipment: 3 months under these conditions.
- For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
5.3 Soldering Process
General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering:
- Iron tip temperature: Max. 300°C (for a max. 30W iron).
- Soldering time per lead: Max. 3 seconds.
Dip/Wave Soldering:
- Preheat temperature: Max. 100°C (for max. 60 seconds).
- Solder bath temperature & time: Max. 260°C for 5 seconds.
Critical Soldering Notes:
- Avoid stress on leads during high-temperature operations.
- Do not perform dip/hand soldering more than once.
- Protect the LED from mechanical shock/vibration until it cools to room temperature after soldering.
- Avoid rapid cooling from peak soldering temperature.
- Always use the lowest possible soldering temperature that achieves a reliable joint.
- Wave soldering parameters must be strictly controlled.
5.4 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Dry at room temperature before use.
- Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs, as ultrasonic energy can fracture internal bonds or the epoxy.
5.5 Heat Management
Although this is a low-power device, thermal management is still important for longevity:
- Consider heat dissipation during application design.
- De-rate the operating current appropriately at higher ambient temperatures (refer to de-rating curves, which are implied but not explicitly shown in the provided excerpt).
- Control the temperature surrounding the LED in the final application.
6. Packaging and Ordering Information
6.1 Packing Specification
The LEDs are packaged to prevent damage and moisture ingress:
- Primary Packing: Anti-electrostatic bags.
- Secondary Packing: Inner cartons.
- Tertiary Packing: Outside cartons for shipping.
6.2 Packing Quantity
- Minimum 200 to 500 pieces per anti-static bag.
- 4 bags are packed into 1 inner carton.
- 10 inner cartons are packed into 1 outside carton.
6.3 Label Explanation
Labels on packaging contain key information:
- CPN: Customer's Production Number.
- P/N: Production Number (Part Number).
- QTY: Packing Quantity.
- CAT: Ranks (likely binning categories for intensity or wavelength).
- HUE: Dominant Wavelength.
- REF: Reference.
- LOT No: Lot Number for traceability.
7. Application Suggestions and Design Considerations
7.1 Driver Circuit Design
Due to the typical forward voltage of 3.4V, a constant current driver is recommended, especially when powered from a voltage source like a 5V or 12V rail. A simple series resistor can be used for basic indicator applications, calculated as R = (Vsupply - VF) / IF. Ensure the resistor power rating is adequate.
7.2 Optical Design
The narrow 10-degree viewing angle makes this LED suitable for applications requiring a focused beam. For wider illumination, secondary optics (e.g., diffusers or lenses) would be required. The water-clear resin provides a clear, non-diffused output.
7.3 PCB Layout
Ensure the PCB footprint matches the package dimensions and lead spacing. Provide adequate clearance around the LED body for the recommended 3mm minimum distance from the solder joint. Consider thermal relief pads if the LED is to be driven near its maximum current.
8. Technical Comparison and Differentiation
While a direct comparison requires specific competitor data, this LED's key differentiators based on its datasheet are:
- Very High Luminous Intensity: 4000-8000 mcd at 20mA is notably high for a standard green LED lamp package, offering superior brightness.
- Narrow, Focused Beam: The 10-degree viewing angle is narrower than many standard LEDs (which are often 30-60 degrees), providing more directed light.
- InGaN Chip Technology: The use of Indium Gallium Nitride (InGaN) material is standard for high-brightness green/blue/white LEDs, offering good efficiency and stability.
9. Frequently Asked Questions (FAQ)
9.1 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (525nm) is the physical wavelength where the spectral power is maximum. Dominant Wavelength (530nm) is the psychophysical single wavelength that the human eye perceives as matching the color of the LED. They are often close but not identical.
9.2 Can I drive this LED at its maximum current of 25mA continuously?
While the Absolute Maximum Rating is 25mA, the Electro-Optical Characteristics are specified at 20mA. For reliable long-term operation and to account for temperature rise, it is generally advisable to design for a nominal current at or below the \"Typ.\" test condition (20mA). De-rating may be necessary at high ambient temperatures.
9.3 Why is the minimum distance of 3mm from the solder joint so important?
This distance prevents excessive heat from traveling up the lead and damaging the sensitive internal semiconductor die or the epoxy resin during soldering. Excessive heat can cause delamination, cracking, or permanent degradation of light output.
10. Practical Use Case Example
Scenario: Designing a high-visibility power status indicator for a rack-mounted industrial computer.
- Requirement: A bright, unambiguous green light visible from several feet away in a well-lit room.
- Selection: This LED is chosen for its high intensity (8000 mcd typ.) and narrow viewing angle, which helps concentrate light toward the viewer.
- Circuit Design: The device is powered from the system's 5V standby rail. A series resistor is calculated: R = (5V - 3.4V) / 0.020A = 80 Ohms. A standard 82 Ohm, 1/4W resistor is selected.
- Mechanical Integration: The LED is mounted on the front panel PCB. The panel has a small aperture. The narrow beam ensures most of the light exits through the aperture without spillage.
- Assembly: During PCB assembly, wave soldering is used with a profile peaking at 250°C for 4 seconds, adhering to the datasheet limits. The leads are clipped after soldering, ensuring the cut is more than 3mm from the LED body.
This use case leverages the LED's key strengths: high brightness and beam focus.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |