Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 1.2 Target Applications
- 2. Technical Specifications Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Relative Intensity vs. Wavelength
- 4.2 Directivity Pattern
- 4.3 Forward Current vs. Forward Voltage (I-V Curve)
- 4.4 Relative Intensity vs. Forward Current
- 4.5 Temperature Dependence
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Lead Forming Precautions
- 6.2 Storage Conditions
- 6.3 Soldering Recommendations
- 7. Packaging and Ordering Information
- 7.1 Packing Specification
- 7.2 Label Explanation
- 7.3 Product Designation / Part Number Breakdown
- 8. Application Design Considerations
- 8.1 Driver Circuit Design
- 8.2 Thermal Management
- 8.3 Optical Design for Signage
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 10.1 What is the recommended operating current?
- 10.2 How do I interpret the binning codes?
- 10.3 Can this LED be used for automotive applications?
- 11. Practical Use Case Example
- 11.1 Designing a High-Visibility Warning Sign
- 12. Technology Principle Introduction
- 13. Industry Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes AlGaInP chip technology to produce a brilliant yellow light and is housed in a popular T-1 3/4 round package with water-clear UV-resistant epoxy resin.
1.1 Core Features and Advantages
- High Efficiency: Engineered for maximum light output relative to input power.
- Standard Package: Utilizes the widely adopted T-1 3/4 round package, ensuring compatibility with common sockets and PCB footprints.
- General Purpose Leads: Standard lead configuration for easy integration.
- Selected Intensity Bins: Devices are binned for minimum luminous intensity, providing consistency in brightness.
- RoHS Compliance: The product adheres to RoHS environmental standards.
- UV Resistant Epoxy: The water-clear lens material is resistant to ultraviolet degradation, making it suitable for long-term outdoor use.
1.2 Target Applications
This LED series is specifically targeted at high-visibility display applications, including:
- Color graphic signs and message boards.
- Variable message signs (VMS).
- Commercial outdoor advertising displays.
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Reverse Voltage (VR): 5 V
- Continuous Forward Current (IF): 50 mA
- Peak Forward Current (IFP): 160 mA (Duty cycle 1/10 @ 1 kHz)
- Power Dissipation (Pd): 115 mW
- Operating Temperature Range (Topr): -40°C to +85°C
- Storage Temperature Range (Tstg): -40°C to +100°C
- Electrostatic Discharge (ESD) HBM: 2000 V
- Soldering Temperature (Tsol): 260°C for 5 seconds maximum.
2.2 Electro-Optical Characteristics
Measured at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20 mA, unless otherwise specified.
- Luminous Intensity (Iv): 7150 mcd (Min), 18000 mcd (Max). This high intensity is a key feature for signage applications.
- Viewing Angle (2θ1/2): 15° (Typical). A narrow viewing angle concentrates light forward, ideal for directed illumination in signs.
- Peak Wavelength (λp): 591 nm (Typical).
- Dominant Wavelength (λd): 586 nm (Min), 589 nm (Typical), 594 nm (Max). Defines the perceived color (brilliant yellow).
- Spectral Bandwidth (Δλ): 15 nm (Typical). Indicates the purity of the yellow color.
- Forward Voltage (VF): 1.8 V (Min), 2.0 V (Typical), 2.6 V (Max) at IF=20mA.
- Reverse Current (IR): 10 μA (Max) at VR=5V.
3. Binning System Explanation
To ensure color and brightness consistency in production batches, LEDs are sorted into bins based on key parameters.
3.1 Luminous Intensity Binning
Devices are categorized into four bins (T, U, V, W) with a ±10% tolerance within each bin.
- Bin T: 7150 - 9000 mcd
- Bin U: 9000 - 11250 mcd
- Bin V: 11250 - 14250 mcd
- Bin W: 14250 - 18000 mcd
3.2 Dominant Wavelength Binning
Sorted into two bins with a tight tolerance of ±1 nm to maintain color uniformity.
- Bin 1: 586 - 590 nm
- Bin 2: 590 - 594 nm
3.3 Forward Voltage Binning
Sorted into four bins (1, 2, 3, 4) with a ±0.1V tolerance. This helps in designing consistent current drive circuits.
- Bin 1: 1.8 - 2.0 V
- Bin 2: 2.0 - 2.2 V
- Bin 3: 2.2 - 2.4 V
- Bin 4: 2.4 - 2.6 V
4. Performance Curve Analysis
The datasheet provides several characteristic curves that are crucial for circuit design and thermal management.
4.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, peaking around 591 nm (yellow) with a typical bandwidth of 15 nm, confirming the color purity.
4.2 Directivity Pattern
The polar diagram illustrates the 15° viewing angle, showing how light intensity drops sharply outside the central beam, which is optimal for directed lighting applications.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
This non-linear relationship is fundamental for selecting the appropriate current-limiting resistor or constant-current driver. The typical VF is 2.0V at 20mA.
4.4 Relative Intensity vs. Forward Current
Light output increases with current but not linearly. Operating above the absolute maximum rating (50mA continuous) is prohibited despite higher potential output.
4.5 Temperature Dependence
Relative Intensity vs. Ambient Temperature: Luminous output decreases as ambient temperature rises. Proper heat sinking is essential to maintain brightness in high-temperature environments.
Forward Current vs. Ambient Temperature: At a constant voltage, the forward current may change with temperature, affecting light output. Constant-current driving is recommended for stable performance.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED uses a standard T-1 3/4 (5mm) round package. Key dimensional notes include:
- All dimensions are in millimeters unless specified.
- A standard tolerance of ±0.25mm applies to most features.
- The maximum protrusion of the resin lens below the flange is 1.5mm, which is important for clearance in panel mounting.
5.2 Polarity Identification
The cathode is typically indicated by a flat spot on the rim of the LED flange or by a shorter lead. Always refer to the package diagram for correct orientation during assembly to prevent reverse bias damage.
6. Soldering and Assembly Guidelines
6.1 Lead Forming Precautions
- Bend leads at a point at least 3mm from the base of the epoxy lens to avoid stress on the internal die and wire bonds.
- Always form leads before soldering.
- Cut leadframes at room temperature to prevent thermal shock.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Storage Conditions
- Store at ≤30°C and ≤70% Relative Humidity (RH) upon receipt. Shelf life under these conditions is 3 months.
- For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
- Avoid rapid temperature changes in humid environments to prevent condensation.
6.3 Soldering Recommendations
Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
- Hand Soldering: Iron tip temperature ≤300°C (for irons ≤30W). Soldering time ≤3 seconds.
- Wave/DIP Soldering: Preheat ≤100°C for ≤60 seconds. Solder bath temperature ≤260°C for ≤5 seconds.
- Avoid mechanical stress on the leads while the LED is hot.
- Do not solder (dip or hand) more than once.
- Protect the LED from shock/vibration until it cools to room temperature after soldering.
- Avoid rapid cooling from peak soldering temperature.
7. Packaging and Ordering Information
7.1 Packing Specification
- LEDs are packed in anti-static bags to prevent ESD damage.
- Packing Quantity: 200-500 pieces per bag. 5 bags per inner carton. 10 inner cartons per master (outside) carton.
7.2 Label Explanation
Labels on packaging contain critical information:
- CPN: Customer's part number.
- P/N: Manufacturer's part number (e.g., 333/Y5C1-ATWB/MS).
- QTY: Quantity in the package.
- CAT: Code for Luminous Intensity and Forward Voltage bin.
- HUE: Code for Dominant Wavelength bin.
- LOT No.: Traceable production lot number.
7.3 Product Designation / Part Number Breakdown
The part number 333/Y5C1-ATWB/MS can be decoded as follows, though the exact mapping for each character is model-specific: It typically includes codes for the product series (333), color (Y for Yellow, 5 for specific hue), viewing angle, luminous intensity bin, voltage group, and lens color (Water Clear).
8. Application Design Considerations
8.1 Driver Circuit Design
Due to the non-linear I-V characteristic and forward voltage binning, a constant-current driver is strongly recommended over a simple series resistor for consistent brightness and longevity, especially in multi-LED arrays. Ensure the driver complies with the Absolute Maximum Ratings (50mA continuous).
8.2 Thermal Management
Although power dissipation is relatively low (115mW max), high ambient temperatures (up to 85°C operating) will reduce light output as shown in the performance curves. For densely packed arrays or enclosed fixtures, consider PCB copper pours or other heat sinking methods to keep the junction temperature low.
8.3 Optical Design for Signage
The 15° viewing angle provides a concentrated beam. For large-area signs, careful optical design or lensing may be required to ensure even illumination across the display surface. The UV-resistant epoxy is critical for maintaining clarity and light transmission in direct sunlight applications.
9. Technical Comparison and Differentiation
This LED differentiates itself primarily through its very high luminous intensity (up to 18,000 mcd) in the yellow spectrum, which is achieved using AlGaInP semiconductor technology. Compared to standard 5mm LEDs, it offers significantly greater brightness, making it unsuitable for indicator purposes but ideal for illumination. The narrow 15° viewing angle is a design choice for applications requiring directed light rather than wide-area glow.
10. Frequently Asked Questions (FAQ)
10.1 What is the recommended operating current?
The electro-optical characteristics are specified at 20mA. While the maximum continuous current is 50mA, operating at or below 20mA is typical for a balance of brightness, efficiency, and long-term reliability. Always refer to the derating curves for high-temperature operation.
10.2 How do I interpret the binning codes?
The CAT code on the label combines the luminous intensity bin (T,W,V,W) and voltage bin (1,2,3,4). The HUE code indicates the dominant wavelength bin (1 or 2). For consistent color and brightness in an assembly, specify or select LEDs from the same bins.
10.3 Can this LED be used for automotive applications?
While it has a wide operating temperature range (-40°C to +85°C), this datasheet does not specify AEC-Q101 automotive qualification. For automotive use, verify that the specific part number meets the required reliability standards for that application.
11. Practical Use Case Example
11.1 Designing a High-Visibility Warning Sign
Consider a solar-powered, standalone warning sign. The high luminous intensity ensures visibility in daylight. The narrow beam angle helps conserve energy by directing light toward viewers. The wide operating temperature range allows functionality from desert heat to winter cold. A constant-current driver powered by a battery/buck converter would be used, with the driver set to 20mA per LED to maximize battery life while maintaining specified brightness.
12. Technology Principle Introduction
This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The specific composition of the AlGaInP layers determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, in the yellow region (~589 nm). The water-clear epoxy lens acts as a primary optic, shaping the light output into the specified 15° viewing angle.
13. Industry Trends
The trend in high-brightness indicator/signage LEDs continues toward higher efficacy (more lumens per watt), improved color consistency through tighter binning, and enhanced reliability for harsh environments. There is also a growing integration of driver electronics and control interfaces (e.g., addressable LEDs) at the package level, though this particular device remains a traditional, discrete component. The use of UV-resistant and high-temperature materials remains critical for outdoor and automotive-adjacent applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |