ELCS17G-NB5060K5K8334316-F6Z LED Datasheet - Package 1.7mm - Voltage 2.95-3.95V - Luminous Flux 540lm - Cool White 5000-6000K - English Technical Document

1. Product Overview

The ELCS17G-NB5060K5K8334316-F6Z is a high-brightness, surface-mount LED designed for applications requiring efficient and compact illumination. It belongs to a series characterized by a small form factor combined with high optical output. The device utilizes InGaN chip technology to produce cool white light. Its primary design goals are to deliver high luminous efficacy within a minimal package footprint, making it suitable for space-constrained electronic assemblies.

1.1 Core Advantages and Target Market

The key advantage of this LED is its high optical efficiency, measured at 87.66 lm/W under typical operating conditions. This efficiency translates to lower power consumption for a given light output. The device is RoHS compliant, halogen-free, and complies with EU REACH regulations, making it suitable for global markets with strict environmental standards. Its primary target applications include mobile phone camera flash units, torch lights for digital video equipment, TFT backlighting, various indoor and outdoor lighting fixtures, decorative lighting, and automotive interior/exterior illumination. The combination of high flux and a wide 120-degree viewing angle provides design flexibility for both focused and diffuse lighting needs.

2. Technical Parameter Deep Dive

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

• DC Forward Current (Torch Mode): 350 mA. This is the maximum continuous DC current the LED can handle.
• Peak Pulse Current: 2000 mA for 400 ms pulses with a 3600 ms off period, limited to 30,000 cycles. This rating is crucial for flash/strobe applications.
• ESD Resistance (Human Body Model): 2000 V. This indicates a moderate level of built-in electrostatic discharge protection.
• Junction Temperature (T_J): 150 °C. The maximum allowable temperature of the semiconductor junction.
• Operating Temperature (T_opr): -40 °C to +85 °C. The ambient temperature range for reliable operation.
• Thermal Resistance (R_th): 9 °C/W. This is a critical parameter representing the temperature rise per watt of power dissipated. A lower value indicates better heat transfer from the junction to the solder pad. Proper thermal management is essential to maintain performance and longevity.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at a solder pad temperature (T_s) of 25°C. All electrical and optical data is tested under a 50 ms pulse condition to minimize self-heating effects.

• Luminous Flux (I_v): 480 lm (Min), 540 lm (Typ), 600 lm (Max) at I_F = 1600 mA. The typical value of 540 lm is the central performance figure.
• Forward Voltage (V_F): 2.95 V (Min), 3.45 V (Typ), 3.95 V (Max) at I_F = 1600 mA. The variation is managed through voltage binning.
• Correlated Color Temperature (CCT): 5000 K (Min), 5500 K (Typ), 6000 K (Max). This defines the cool white color appearance.
• Viewing Angle (2θ_1/2): 120 degrees with a ±5° tolerance. This wide angle produces a Lambertian-like radiation pattern suitable for area lighting.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific application requirements for brightness, voltage, and color.

3.1 Forward Voltage Binning

LEDs are grouped into two primary voltage bins at I_F = 1600 mA:

• Bin 2934: V_F range from 2.95 V to 3.45 V.
• Bin 3439: V_F range from 3.45 V to 3.95 V.

Selecting LEDs from the same voltage bin helps maintain uniform current distribution when multiple devices are driven in parallel.

3.2 Luminous Flux Binning

Brightness is categorized into four bins at I_F = 1600 mA:

• Bin K5: 480 lm to 510 lm.
• Bin K6: 510 lm to 540 lm.
• Bin K7: 540 lm to 570 lm.
• Bin K8: 570 lm to 600 lm.

The part number indicates a K8 bin, meaning it is selected from the highest brightness group.

3.3 Chromaticity (Color) Binning

The cool white light is defined within a specific region on the CIE 1931 chromaticity diagram. The bin designated as \"5060\" encompasses color temperatures from 5000K to 6000K. The datasheet provides the corner coordinates (CIE-x, CIE-y) of this quadrilateral bin: (0.3200, 0.3613), (0.3482, 0.3856), (0.3424, 0.3211), (0.3238, 0.3054). All color measurements have an allowance of ±0.01 and are defined at I_F = 1000 mA.

4. Performance Curve Analysis

The typical characteristic curves provide insight into the device's behavior under varying conditions.

4.1 Relative Spectral Distribution

The graph shows the light output as a function of wavelength (λ) when driven at 1000 mA. For a cool white LED using a blue InGaN chip with a phosphor coating, the spectrum typically shows a dominant blue peak (from the chip) and a broader yellow-green emission band (from the phosphor). The combined output results in white light. The peak wavelength (λ_p) and the spectral width influence the Color Rendering Index (CRI), though CRI is not explicitly specified in this datasheet.

4.2 Forward Voltage vs. Forward Current (V_F-I_F Curve)

This curve is non-linear, typical of a diode. The forward voltage increases with current but at a diminishing rate. Understanding this curve is essential for designing the current drive circuitry, especially for constant-current drivers, to ensure the required voltage headroom is available.

3.3 Relative Luminous Flux vs. Forward Current

Light output increases with current but not linearly. At higher currents, efficiency typically drops due to increased junction temperature and other non-ideal effects (droop). The curve helps determine the optimal drive current for balancing brightness against efficacy and device lifetime.

4.4 CCT vs. Forward Current

The correlated color temperature may shift slightly with drive current. This curve shows how the white point (coolness/warmth) changes from low to high current, which is important for color-critical applications.

5. Mechanical and Package Information

The device comes in a surface-mount package. The exact dimensions are provided in a detailed drawing on page 8 of the datasheet, with a tolerance of ±0.1 mm. The package includes anode and cathode markings for correct PCB orientation. The design of the thermal pad (if present) and the overall footprint are critical for effective heat sinking, directly impacting the achievable luminous flux and long-term reliability.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering

The LED is rated for a maximum soldering temperature of 260°C and can withstand a maximum of 2 reflow cycles. It is crucial to follow the recommended reflow profile to prevent thermal shock, delamination, or damage to the internal wire bonds and phosphor.

6.2 Storage and Handling

The device is sensitive to moisture. It is packaged in a moisture-resistant bag with desiccant. Key storage rules include:

• Do not open the bag until ready for use.
• Store unopened bags at ≤30°C / ≤90% RH.
• After opening, use components within their floor life (exposure time) and store at ≤30°C / ≤85% RH.
• If the specified storage conditions or times are exceeded, a baking pre-treatment (60±5°C for 24 hours) is required before reflow to prevent \"popcorning\" (package cracking due to rapid vapor expansion).

The datasheet specifies the device conforms to JEDEC Moisture Sensitivity Level (MSL) 1, which has an unlimited floor life at ≤30°C/85% RH.

6.3 Electrical Protection

A critical note states that the LED is not designed for reverse bias operation. Although it has some ESD protection, external current-limiting resistors are recommended. Without proper current control, even a small voltage increase can lead to a large, potentially destructive current surge.

7. Packaging and Ordering Information

The LEDs are supplied on embossed carrier tapes, which are then wound onto reels. The standard loaded quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces. The product labeling on the reel includes:

• CPN: Customer's Product Number
• P/N: Manufacturer's Part Number (e.g., ELCS17G-NB5060K5K8334316-F6Z)
• LOT NO: Traceable manufacturing lot number.
• QTY: Packing quantity.
• CAT: Luminous Flux Bin (e.g., K8).
• HUE: Color Bin (e.g., 5060).
• REF: Forward Voltage Bin (e.g., 2934 or 3439).
• MSL-X: Moisture Sensitivity Level.

Detailed dimensions for the carrier tape and the emitter reel are provided in the datasheet.

8. Application Suggestions

8.1 Typical Application Scenarios

• Mobile Camera Flash: Utilize the high peak pulse current (2000mA) capability. Design must manage the high instantaneous power and heat generated during short bursts.
• Torch Light/DV Light: Can be driven at lower continuous currents (e.g., 350mA or below) for sustained operation. Thermal management on the PCB is key.
• TFT Backlighting: The wide viewing angle and high brightness are advantageous. Multiple LEDs are often used in arrays, requiring careful selection from matching bins for uniform brightness and color.
• General Lighting: Suitable for accent, decorative, and task lighting. The high efficiency contributes to energy savings.

8.2 Design Considerations

• Thermal Management: This is the single most critical factor for performance and lifetime. Use a PCB with good thermal conductivity (e.g., metal-core PCB - MCPCB) and ensure a low thermal resistance path from the LED pad to the ambient. The datasheet notes all reliability tests are performed with good thermal management on an MCPCB.
• Current Drive: Always use a constant-current driver, not a constant-voltage source. This ensures stable light output and protects the LED from thermal runaway.
• Optics: The 120-degree viewing angle may require secondary optics (lenses, reflectors) for applications needing a more focused beam.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other models is not provided in this standalone datasheet, the ELCS17G series can be evaluated based on its stated parameters. Its key differentiators likely include the combination of a very compact 1.7mm package with a relatively high typical luminous flux of 540lm. The optical efficiency of 87.66 lm/W at 1.6A is a competitive figure. The comprehensive binning structure (flux, voltage, color) allows for precise selection in high-volume, consistency-sensitive applications like backlighting arrays. The wide 120-degree viewing angle offers a different solution compared to LEDs with narrower beams, which may require more units to achieve the same illuminated area.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED with a 3.3V power supply?
A: Not directly. The typical forward voltage is 3.45V at 1600mA, which is above 3.3V. You must use a constant-current driver circuit that can provide the necessary voltage headroom to regulate the current properly.

Q: What is the expected lifetime of this LED?
A: The datasheet specifies that all specifications are assured by a reliability test for 1000 hours, with luminous flux degradation of less than 30%. Actual lifetime in an application depends heavily on operating conditions, especially junction temperature. Operating at or below the recommended currents with excellent thermal management will maximize lifetime.

Q: How do I interpret the part number ELCS17G-NB5060K5K8334316-F6Z?
A: The part number encodes key bin information: \"5060\" refers to the cool white color bin (5000-6000K), \"K8\" is the luminous flux bin (570-600lm), and \"3343\" or similar likely indicates the forward voltage bin. The prefix \"ELCS17G\" denotes the series and package.

Q: Is a heatsink necessary?
A> For continuous operation at high currents (e.g., near 350mA DC or 1600mA pulsed), effective heat sinking is absolutely necessary. The thermal resistance of 9 °C/W means that for every watt dissipated, the junction temperature rises 9°C above the solder pad temperature. Without a proper thermal path, the junction will quickly exceed its maximum rating, leading to rapid performance degradation and failure.

11. Practical Use Case Example

Scenario: Designing a high-brightness task lamp.
A designer wants to create a compact, USB-powered desk lamp. They plan to use a single ELCS17G-NB5060K8 LED to achieve a bright, cool white light. The USB port provides 5V. The designer selects a constant-current buck driver IC that can accept 5V input and deliver a stable 350mA output. They calculate the approximate forward voltage from the K8/VF2934 bin as 3.2V. The driver must handle the difference between 5V and 3.2V. For thermal management, they design a small aluminum core PCB that acts as both the circuit board and a heatsink. The LED is placed centrally with a generous copper pour connected to the thermal pad. The aluminum PCB is then attached to the lamp's metal housing for additional heat dissipation. A simple diffuser lens is placed over the LED to soften the beam from the wide viewing angle. This design leverages the LED's high efficiency to provide ample light from a low-power USB source while managing heat effectively for long-term reliability.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor. The core is a chip made of Indium Gallium Nitride (InGaN). When a forward voltage is applied across the p-n junction of this chip, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy is engineered to emit photons in the blue region of the spectrum. To create white light, the blue light emitted by the chip strikes a phosphor coating (typically based on yttrium aluminum garnet or similar materials) deposited on or around the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broad spectrum of yellow-green light. The mixture of the remaining blue light and the converted yellow-green light is perceived by the human eye as white light. The exact ratio of blue to yellow-green emission determines the Correlated Color Temperature (CCT), with this device tuned for a cool white (5000-6000K) appearance.

13. Technology Trends and Context

The development of LEDs like the ELCS17G series is part of the ongoing trend in solid-state lighting towards higher efficiency (lm/W), higher luminance (lm/mm²), and improved reliability. Key industry drivers include the global phase-out of inefficient lighting technologies and the demand for miniaturization in consumer electronics. Future trends likely involve continued improvements in the internal quantum efficiency of the InGaN chips (reducing \"efficiency droop\" at high currents), the development of more robust and efficient phosphor materials, and advanced packaging techniques to further lower thermal resistance. There is also a strong focus on improving color quality metrics like Color Rendering Index (CRI) and R9 (saturated red), and enabling precise color tuning. The move towards smart, connected lighting systems also influences LED design, with potential integration of control and sensing capabilities at the package level. The emphasis on environmental compliance (RoHS, REACH, halogen-free) seen in this datasheet is now a standard requirement across the electronics industry.