FC1717GF15HP-F4050 LED Datasheet - Package Dimensions - Forward Voltage 2.95-3.95V - Luminous Flux 330-420lm - Cool White 4000-5000K - English Technical Document

1. Product Overview

The FC1717GF15HP-F4050 is a high-brightness, cool white LED designed for applications requiring high luminous efficiency in a compact package. This device utilizes InGaN chip technology to produce cool white light with a correlated color temperature (CCT) ranging from 4000K to 5000K. Its primary design philosophy centers on delivering high optical output while maintaining a small form factor, making it suitable for space-constrained designs. The product is compliant with RoHS, REACH, and halogen-free standards, ensuring its suitability for global markets with stringent environmental regulations.

1.1 Core Advantages and Target Market

The core advantage of this LED is its high optical efficiency, rated at 109 lm/W at a forward current of 1A, with a typical luminous flux of 360lm. This high efficiency translates to lower power consumption and reduced thermal management requirements for end products. The device is binned for brightness, forward voltage, and chromaticity, providing consistency for volume production. The primary target markets include mobile device camera flashes, digital video torch lights, and various indoor and outdoor lighting applications. Its specifications also make it a candidate for TFT backlighting, automotive interior/exterior lighting, and decorative lighting systems where reliable, bright, and efficient white light is required.

2. Technical Parameter Deep-Dive

This section provides an objective and detailed analysis of the key technical parameters specified in the datasheet, covering electro-optical, electrical, and thermal characteristics.

2.1 Electro-Optical Characteristics

The electro-optical performance is defined at a solder pad temperature (Ts) of 25\u00b0C. The luminous flux (Iv) has a minimum of 330 lm, a typical value of 360 lm, and a maximum of 420 lm when driven at a forward current (IF) of 1000mA under pulsed conditions (50ms pulse). The forward voltage (VF) at this current ranges from 2.95V (Min) to 3.95V (Max), with a typical value of 3.45V. The color temperature is specified between 4000K and 5000K, placing it firmly in the cool white spectrum. The Color Rendering Index (CRI) has a typical value of 83, with a minimum of 80, indicating good color reproduction for general lighting tasks. All optical measurements have a stated tolerance of \u00b110%, and forward voltage measurement tolerance is \u00b10.1V.

2.2 Absolute Maximum Ratings and Electrical Parameters

The Absolute Maximum Ratings define the limits beyond which permanent damage may occur. The maximum continuous DC forward current for torch mode operation is 350 mA. For pulsed operation, a peak pulse current of 1500 mA is allowed under a specific duty cycle (400ms on / 3600ms off for 30,000 cycles). The device can withstand an Electrostatic Discharge (ESD) of up to 2000V (Human Body Model). It is critical to note that these LEDs are not designed for reverse bias operation. Exceeding the maximum junction temperature of 150\u00b0C or operating at maximum ratings for extended periods (exceeding 1 hour) can degrade performance and reliability. The thermal resistance from junction to solder point is specified as 9 \u00b0C/W, which is a key parameter for thermal design.

2.3 Thermal and Environmental Specifications

The operating temperature range is from -40\u00b0C to +85\u00b0C, with a storage temperature range of -40\u00b0C to +100\u00b0C. The device can withstand a soldering temperature of 260\u00b0C for a maximum of 2 reflow cycles. It is classified as Moisture Sensitivity Level (MSL) 1, which means it has an unlimited floor life at \u226430\u00b0C/85% RH before requiring baking. This simplifies handling and storage logistics compared to higher MSL components.

3. Binning System Explanation

To ensure color and brightness consistency in production, the LEDs are sorted into bins based on key parameters.

3.1 Chromaticity (Color) Binning

The provided chromaticity chart defines the "4050" bin on the CIE 1931 color space. The bin is represented by a quadrilateral on the chart with specific corner coordinates. The target reference point is at CIE-x: 0.3772, CIE-y: 0.3628. The allowable variation for color coordinate measurement is \u00b10.01. This binning is performed at the standard test condition of IF=1000mA.

3.2 Luminous Flux Binning

Luminous flux output is categorized into two bins: J7 and J8. The J7 bin covers luminous flux values from 330 lm to 360 lm. The J8 bin covers a higher output range from 360 lm to 420 lm. This allows designers to select parts based on the required brightness level for their application.

3.3 Forward Voltage Binning

The forward voltage is binned under the code "2939". This bin encompasses the entire forward voltage range specified in the electro-optical characteristics table, from a minimum of 2.95V to a maximum of 3.95V at 1000mA. Designers must ensure their driver circuitry can accommodate this full voltage range.

4. Performance Curve Analysis

The datasheet includes several typical performance curves that illustrate how key parameters behave under varying conditions.

4.1 Relative Spectral Distribution

The spectral distribution curve shows the relative intensity of light emitted across wavelengths from approximately 400nm to 800nm when driven at 1000mA. The peak wavelength (\u03bbp) for this cool white phosphor-converted LED is in the blue region (typically around 450-455nm for the blue pump die), with a broad phosphor emission in the yellow/green/red spectrum, combining to produce white light. The shape of this curve determines the CCT and CRI.

4.2 IV Curve and Luminous Flux vs. Current

The Forward Voltage vs. Forward Current curve shows a non-linear relationship, typical of diodes. The voltage increases with current. The Relative Luminous Flux vs. Forward Current curve demonstrates that light output increases with current but may not be perfectly linear, especially at higher currents where efficiency droop and heating effects become significant. These curves are essential for selecting the appropriate operating point to balance brightness, efficiency, and thermal load.

4.3 CCT vs. Forward Current and Radiation Pattern

The CCT vs. Forward Current curve indicates how the color temperature shifts with drive current. A stable CCT across the operating range is desirable for color consistency. The Typical Radiation Pattern diagram shows that this LED has a Lambertian emission pattern with a viewing angle (2\u03b81/2) of 120 degrees (\u00b15\u00b0 tolerance), where the intensity is half of the peak value. This wide viewing angle is suitable for general illumination applications requiring broad light distribution.

5. Mechanical and Package Information

The mechanical drawing provides the critical physical dimensions of the LED package. All dimensions are in millimeters with a tolerance of \u00b10.1mm. The drawing includes top view, side view, and footprint details necessary for PCB layout, including pad size, spacing, and component outline. Proper adherence to these dimensions is crucial for successful pick-and-place assembly, soldering, and achieving the specified optical performance (e.g., viewing angle). The polarity of the device is also indicated in the drawing to prevent reverse mounting.

6. Soldering and Assembly Guidelines

Proper handling is critical for reliability. The device is rated for a maximum of 2 reflow cycles at a peak temperature of 260\u00b0C. Although the LED has some ESD protection, it is not designed for reverse bias use. External current-limiting resistors are recommended to prevent damage from voltage shifts. For storage, unopened moisture barrier bags should be kept at \u2264 30\u00b0C / 85% RH. Once opened, components should be used within the specified floor life or stored at \u2264 30\u00b0C / 85% RH. If the specified storage conditions or time are exceeded, baking according to the MSL-1 profile (168 hours at 85\u00b0C/85% RH) is required before reflow to prevent popcorn cracking during soldering.

7. Packaging and Ordering Information

The LEDs are supplied in moisture-resistant packing. They are delivered on embossed carrier tapes, which are then wound onto reels. The standard loaded quantity is 2000 pieces per reel, with a minimum order quantity of 1000 pieces. The product labeling on the reel includes several codes: CPN (Customer's Product Number), P/N (Product Number), LOT NO (Lot Number for traceability), QTY (Packing Quantity), CAT (Luminous Flux Bin e.g., J7/J8), HUE (Color Bin e.g., 4050), REF (Forward Voltage Bin e.g., 2939), and MSL-X (Moisture Sensitivity Level). Diagrams for the carrier tape and reel dimensions are provided, with all measurements in millimeters.

8. Application Recommendations

8.1 Typical Application Scenarios

Based on its high pulse current capability and brightness, the primary application is as a camera flash or strobe light for mobile phones and digital video cameras. Its high efficiency and cool white output make it suitable for various indoor lighting fixtures, including downlights and panel lights. The wide viewing angle supports its use in general illumination, step lighting, exit signs, and decorative lighting. It can also be used for TFT-LCD backlighting and both interior and exterior automotive lighting, provided the application's thermal and electrical environment is within specification.

8.2 Design Considerations

Designers must pay close attention to thermal management. The thermal resistance of 9 \u00b0C/W means that for every watt of power dissipated (calculated as VF * IF), the junction temperature will rise approximately 9\u00b0C above the solder pad temperature. Effective heat sinking via the PCB (MCPCB is recommended for testing) is essential to maintain junction temperature below 150\u00b0C and ensure long-term reliability (specified as less than 30% IV degradation after 1000 hours under good thermal management). The driver circuit must be designed to handle the forward voltage bin range (2.95V-3.95V) and limit the current appropriately, especially for flash applications using high pulse currents.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other specific LED models is not provided in the datasheet, the key differentiating features of this device can be inferred. Its combination of a very high typical luminous flux (360lm) and high efficiency (109 lm/W) at 1A in a small package is a significant advantage for brightness-critical, space-constrained applications. The wide 120-degree viewing angle offers broader illumination compared to LEDs with narrower beam angles. Compliance with RoHS, REACH, and halogen-free standards is a baseline requirement but ensures broader market access. The detailed binning structure for flux, voltage, and color provides manufacturers with the consistency needed for high-volume product assembly.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the maximum continuous current I can drive this LED with?
A: For continuous operation (torch mode), the Absolute Maximum Rating is 350 mA DC. Exceeding this current risks permanent damage.

Q: Can I use this LED for a flash application?
A: Yes, it is suitable for flash applications. The datasheet specifies a peak pulse current of 1500 mA under a 400ms on / 3600ms off duty cycle for 30,000 cycles. You must design your driver circuit to deliver this pulsed current without exceeding the ratings.

Q: How critical is thermal management?
A: Very critical. The reliability test data (1000hrs, <30% degradation) is based on good thermal management using an MCPCB. The 9 \u00b0C/W thermal resistance means heat must be effectively conducted away from the solder pads to prevent overheating, efficiency droop, and accelerated aging.

Q: What does the "4050" in the part number signify?
A: It most likely corresponds to the chromaticity (color) bin, which in this datasheet is defined as the "4050" bin on the CIE chart, targeting a cool white color point.

Q: Is a current-limiting resistor necessary?
A: Yes. The datasheet explicitly recommends using external current-limiting resistors for protection, as slight voltage shifts could cause large current shifts that may damage the LED, even though it has some ESD protection.

11. Practical Use Case Example

Consider designing a high-brightness torchlight for a professional digital video camera. The design requires a compact light source that can deliver intense illumination for short durations. The FC1717GF15HP-F4050 is an ideal candidate. The designer would select components from the J8 luminous flux bin (360-420lm) for maximum output. The driver circuit would be designed to deliver the specified 1500mA pulse current for the flash duration, using robust MOSFETs and capacitors. Thermally, the LED would be mounted on a dedicated metal-core PCB (MCPCB) that is attached to the camera's aluminum housing to act as a heat sink, ensuring the junction temperature stays within limits during extended use. The wide 120-degree beam angle would provide good coverage for video recording.

12. Operating Principle Introduction

This LED is a solid-state light source based on a semiconductor diode. It uses an Indium Gallium Nitride (InGaN) chip that emits blue light when electrical current passes through it in the forward direction (electroluminescence). This blue light is then partially converted to longer wavelengths (yellow, green, red) by a phosphor layer deposited on or near the chip. The mixture of the remaining blue light and the phosphor-converted light results in the perception of white light. The specific ratio of blue to phosphor-converted light determines the correlated color temperature (CCT), in this case, cool white (4000-5000K). The efficiency (lm/W) is a measure of how effectively electrical power is converted into visible light.

13. Technology Trends and Context

The specifications of this LED reflect ongoing trends in the optoelectronics industry. The drive for higher luminous efficacy (lm/W) is a constant, aiming to reduce energy consumption for the same light output. The ability to handle high pulse currents for flash applications aligns with the demands of mobile and imaging technology. The move towards smaller package sizes with maintained or increased output power is key for miniaturization of electronic devices. Furthermore, compliance with environmental regulations like RoHS, REACH, and halogen-free requirements is no longer a differentiator but a mandatory baseline for global market entry. Future developments in this field may focus on further efficiency gains, improved color rendering (higher CRI), better color consistency (tighter binning), and enhanced reliability under higher operating temperatures.