ELXI-NB5060J6J8293910-F3H LED Datasheet - 5.0x6.0mm Package - 3.3V Forward Voltage - 260lm Luminous Flux - 5500K White - English Technical Documentation

1. Product Overview

The ELXI-NB5060J6J8293910-F3H is a high-performance, surface-mount white LED designed for applications requiring high luminous output and reliability in a compact form factor. Utilizing InGaN chip technology, this device delivers excellent efficiency and consistent color performance. Its primary design targets include mobile device camera flashes, portable lighting, and various indoor and decorative illumination applications where space and power efficiency are critical.

1.1 Core Advantages

The device offers several key advantages that make it suitable for demanding applications. It features a very compact package footprint, which is essential for space-constrained designs like mobile phones. With a typical luminous flux of 260 lumens at a drive current of 1000mA, it provides high brightness output. The LED incorporates robust ESD protection rated up to 8KV (HBM), enhancing its reliability in handling and assembly. It is fully compliant with RoHS, REACH, and halogen-free regulations, making it suitable for global markets with strict environmental standards. The product is also grouped by key parameters like total luminous flux and color coordinates, ensuring consistency in batch production for applications requiring uniform light output.

2. Technical Parameter Deep Dive

This section provides a detailed, objective analysis of the key technical parameters specified in the datasheet, explaining their significance for design engineers.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• DC Forward Current (I_F): 350 mA. This is the maximum continuous DC current that can be applied to the LED. Exceeding this value risks overheating and catastrophic failure.
• Peak Pulse Current (I_Pulse): 1000 mA for 400ms ON, 3600ms OFF (10% duty cycle). This rating is crucial for flash applications, indicating the LED can handle short, high-current pulses typical of camera flashes.
• Junction Temperature (T_J): 115°C. The maximum allowable temperature of the semiconductor junction itself. Prolonged operation at or near this limit will accelerate lumen depreciation and reduce lifespan.
• Operating & Storage Temperature: -40°C to +85°C. This wide range ensures reliable performance in various environmental conditions, from cold storage to hot operating environments.
• Power Dissipation (Pulse Mode): 3.95 W. This is the maximum power the package can dissipate during pulsed operation, a critical factor for thermal management in flash applications.
• Soldering Temperature: 245°C. This specifies the peak temperature tolerance during reflow soldering processes.
• Viewing Angle (2θ_1/2): 120 degrees (±5°). This indicates a wide, Lambertian-style emission pattern, suitable for general illumination and flash applications that require broad coverage.

Critical Design Note: The datasheet explicitly warns against operating at maximum ratings for extended periods (exceeding 1 hour) as it will cause permanent damage and reliability issues. Simultaneous application of multiple maximum ratings should be avoided.

2.2 Electro-Optical Characteristics

These parameters are measured under typical conditions (T_{solder pad} = 25°C) and represent the expected performance.

• Luminous Flux (Φ_v): 240 lm (Min), 260 lm (Typ) at I_F=1000mA. This is the total visible light output. The measurement has a ±10% tolerance. The 'Typical' value of 260lm is the expected average performance.
• Forward Voltage (V_F): 2.95V (Min), 3.3V (Typ), 3.95V (Max) at I_F=1000mA. This is the voltage drop across the LED when driven at the specified current. A lower V_F generally indicates higher electrical efficiency. The ±0.1V measurement tolerance is important for precise driver design.
• Correlated Color Temperature (CCT): 5000K (Min), 5500K (Typ), 6000K (Max). This defines the white point of the light. 5500K is a cool white, similar to midday sunlight. The range indicates the natural variation in the manufacturing process.

All electro-optical data is tested using a 50ms pulse to minimize self-heating effects and provide a stable measurement baseline.

3. Binning System Explanation

The LED is sorted (binned) after production to ensure electrical and optical consistency. This allows designers to select parts that meet specific application requirements.

3.1 Forward Voltage Binning

LEDs are grouped based on their forward voltage at 1000mA.
- Bin Code 2935: V_F between 2.95V and 3.55V.
- Bin Code 3539: V_F between 3.55V and 3.95V.
Selecting a tighter V_F bin can lead to more uniform brightness and thermal behavior when multiple LEDs are used in parallel or driven by a constant-voltage source.

3.2 Luminous Flux Binning

LEDs are grouped based on their light output at 1000mA.
- Bin Code J6: Luminous Flux between 240 lm and 250 lm.
- Bin Code J7: Luminous Flux between 250 lm and 300 lm.
- Bin Code J8: Luminous Flux between 300 lm and 330 lm.
The specific part number (ELXI-NB5060J6J8293910-F3H) indicates it belongs to the J6 brightness bin (240-250lm). This allows for predictable and consistent brightness levels in production.

3.3 Color (White) Binning

The color is defined within a specific region on the CIE 1931 chromaticity diagram. The bin code '5060' corresponds to a white color temperature range of approximately 5000K to 6000K, centered around the typical 5500K point. The datasheet provides reference CIE (x, y) coordinates that define the corners of this acceptable color region. The measurement allowance for color coordinates is ±0.01, which is a standard tolerance for ensuring visual consistency.

4. Performance Curve Analysis

The provided graphs offer insight into how the LED behaves under different operating conditions.

4.1 Relative Spectral Distribution

The spectral graph shows a peak in the blue wavelength region (around 450-460nm) from the InGaN chip, combined with a broad yellow phosphor emission. The combined output creates white light. The specific shape and peaks determine the Color Rendering Index (CRI), though not explicitly stated in this datasheet.

4.2 Radiation Pattern

The polar radiation pattern confirms the Lambertian distribution with a 120-degree viewing angle. The relative intensity is nearly uniform across the X and Y axes, indicating symmetrical light emission from the package, which is ideal for even illumination.

4.3 Forward Voltage vs. Current (I-V Curve)

The curve shows the non-linear relationship between forward voltage (V_F) and forward current (I_F). V_F increases with current. For stable operation, LEDs should be driven with a constant current source, not a constant voltage source, to prevent thermal runaway. The graph allows designers to estimate the power dissipation (V_F * I_F) at different drive currents.

4.4 Relative Luminous Flux vs. Current

This graph shows that light output increases sub-linearly with current. While driving at higher currents yields more light, it also generates more heat and reduces efficiency (lumens per watt). The point of operation (e.g., 1000mA) represents a balance between output and efficiency/thermal load.

4.5 CCT vs. Current

The Correlated Color Temperature shows a slight shift with drive current, typically increasing (becoming cooler/bluer) at higher currents. This is an important consideration for applications where consistent color is critical across different brightness settings.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED features a compact surface-mount package measuring approximately 5.0mm in length and 6.0mm in width (as indicated in the part number NB5060). Detailed dimensional drawings with tolerances of ±0.1mm are provided for PCB footprint design. The package includes a thermal pad that is electrically connected to the anode. This pad is crucial for effective heat sinking, as it provides a low thermal resistance path from the LED junction to the printed circuit board (PCB).

Critical Handling Note: The datasheet explicitly warns against handling the device by the lens, as incorrect force may cause mechanical failure. Proper vacuum pickup tools should be used during assembly.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering

The device is rated for a maximum soldering temperature of 245°C and can withstand a maximum of 2 reflow cycles. This is typical for many SMD LEDs. Designers must ensure their reflow profile does not exceed this temperature to avoid damaging the internal materials, phosphor, or lens.

6.2 Over-Current Protection

A critical design rule stated in the datasheet: \"Customer must apply resistors for protection; otherwise slight voltage shift will cause big current...\" This underscores the essential need for a current-limiting circuit (e.g., a constant current driver or a series resistor when using a voltage source) to prevent the LED from drawing excessive current, which would lead to immediate failure.

6.3 Thermal Management

All reliability testing and typical performance curves are based on using the LED with good thermal management, specifically mounted on a 1.0cm x 1.0cm Metal Core PCB (MCPCB). For optimal performance and longevity, especially at high drive currents like 1000mA, effective heat sinking is non-negotiable. The thermal pad must be properly soldered to a PCB pad with adequate thermal vias or connected to a heatsink.

7. Packaging & Ordering Information

7.1 Moisture Sensitivity & Packing

The LEDs are packaged in moisture-resistant materials. The label on the packaging includes key information: Customer Part Number (CPN), Manufacturer Part Number (P/N), Lot Number, Quantity (QTY), and the specific Binning Codes for Luminous Flux (CAT), Color (HUE), and Forward Voltage (REF). The Moisture Sensitivity Level (MSL-X) is also indicated, which defines the storage and handling requirements before soldering to prevent \"popcorning\" damage during reflow.

7.2 Tape and Reel Specifications

The device is supplied on carrier tape and reel for automated assembly. The carrier tape dimensions are provided. Each reel contains 2000 pieces, with a minimum order quantity of 1000 pieces. Reel dimensions are also specified to ensure compatibility with standard pick-and-place equipment.

8. Application Recommendations

8.1 Typical Application Scenarios

• Mobile Phone Camera Flash/Strobe: The high pulse current rating (1000mA), compact size, and high luminous output make this LED ideal for this application. Design must focus on thermal management during flash bursts and driver circuitry for precise current pulses.
• Torch Light for Digital Video (DV) & General Flashlights: Provides bright, cool white illumination. A constant current driver with multiple brightness settings is recommended.
• Indoor Lighting & Decorative Lighting: Suitable for accent lighting, step lights, exit signs, and other luminaries where a compact, bright source is needed.
• TFT Backlighting: Can be used in arrays for backlighting small to medium displays, though diffusion is required for even illumination.
• Automotive Interior/Exterior Illumination: May be suitable for certain non-critical automotive lighting applications, but designers must verify compliance with specific automotive standards (e.g., AEC-Q102) which are not explicitly claimed in this datasheet.

8.2 Design Considerations

• Driver Selection: Always use a constant current driver. For battery-powered applications, consider a driver with high efficiency to maximize battery life.
• PCB Layout: Design a PCB pad that matches the thermal pad dimensions exactly. Use multiple thermal vias under the pad to transfer heat to other PCB layers or a heatsink. Ensure adequate trace width for the drive current (350mA continuous, 1000mA pulse).
• Optical Design: The wide 120-degree beam may require secondary optics (reflectors, lenses) to achieve desired beam patterns for flashlights or spotlights.
• ESD Precautions While the LED has 8KV ESD protection, standard ESD handling procedures should still be followed during assembly.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 1000mA continuously?
A: No. The Absolute Maximum Rating for DC forward current is 350mA. The 1000mA rating is specifically for pulsed operation (400ms ON, 10% duty cycle). Continuous operation at 1000mA would exceed the power dissipation and junction temperature limits, causing rapid failure.

Q: What is the difference between the \"Typical\" and \"Bin Code\" values for luminous flux?
A: The \"Typical\" value (260lm) is a statistical average from production. The \"Bin Code\" (J6: 240-250lm) specifies the guaranteed minimum and maximum range for the specific LEDs you are purchasing. The parts in the J6 bin will have flux values within the 240-250lm range.

Q: The thermal pad is connected to the anode. Does this affect PCB design?
A: Yes, significantly. It means the thermal pad pad on your PCB will be at the anode voltage. You must ensure this pad does not short to any other net (like ground or the cathode). You must also design your heatsinking strategy accordingly, as the heatsink will be electrically live.

Q: How do I interpret the color binning chart?
A: The chart defines a quadrilateral region on the CIE color space. LEDs are tested, and their measured (x,y) color coordinates must fall within this region to be accepted into the \"5060\" bin. This ensures all LEDs have a similar white color appearance, between 5000K and 6000K.

10. Technology Introduction & Trends

10.1 Operating Principle

This is a phosphor-converted white LED. The core is a semiconductor chip made of Indium Gallium Nitride (InGaN) that emits blue light when electrically biased. This blue light strikes a layer of yellow (or yellow and red) phosphor material deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broader spectrum of longer wavelengths (yellow, red). The mixture of the remaining blue light and the phosphor-converted light is perceived by the human eye as white. The ratio of blue to phosphor-converted light determines the Correlated Color Temperature (CCT).

10.2 Industry Trends

The development of LEDs like this one follows several key industry trends: Increased Efficiency (lm/W): Ongoing improvements in chip design and phosphor technology yield more light output for the same electrical input. Higher Power Density: Packing more light into smaller packages, as seen in this 5.0x6.0mm device producing 260lm. This places greater emphasis on thermal management. Improved Color Consistency & Quality: Tighter binning and advanced phosphor systems lead to better color uniformity and higher Color Rendering Index (CRI) values, though CRI is not specified here. Integration & Smart Features: While this is a discrete component, the broader market is seeing growth in LEDs with integrated drivers, controllers, and sensors. Reliability & Robustness: Enhanced packaging materials and structures, along with higher ESD protection ratings (8KV here), improve longevity and suitability for harsh environments.