1. Product Overview
The ELEM-NB5060J6J8293910-F3C is a high-performance, surface-mount white LED designed for applications requiring high luminous output and reliability. This device utilizes InGaN chip technology to produce white light with a typical correlated color temperature (CCT) of 5500K. Its compact 5.0mm x 6.0mm package makes it suitable for space-constrained designs while delivering a typical luminous flux of 260 lumens at a forward current of 1000mA.
The LED is engineered with robust features including ESD protection rated up to 8KV, making it suitable for environments where electrostatic discharge is a concern. It is fully compliant with RoHS (Restriction of Hazardous Substances) directives, EU REACH regulations, and is manufactured as halogen-free, ensuring environmental safety and meeting global regulatory standards for electronic components.
1.1 Core Advantages and Target Market
The primary advantages of this LED are its combination of small form factor and high optical efficiency. The typical luminous efficacy is significant for its package size. The device is grouped by key parameters such as total luminous flux and color coordinates, providing consistency for batch production in lighting applications.
The target market is broad, encompassing consumer electronics and professional lighting. Key application areas identified include mobile phone camera flash modules, where high-intensity pulsed light is required; torch lights for digital video equipment; various indoor and outdoor general lighting applications; backlighting for displays; and decorative or automotive lighting. Its performance characteristics make it a versatile choice for designers seeking a reliable, bright white light source.
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
The device has strict operational limits to ensure longevity and prevent damage. The absolute maximum ratings are specified at a solder pad temperature (Tsolder pad) of 25\u00b0C.
- DC Forward Current (IF): 350 mA (continuous operation).
- Peak Pulse Current (IPulse): 1000 mA. This is specified for a pulse duration of 400ms ON and 3600ms OFF, representing a maximum duty cycle of 10%. Exceeding this can cause permanent damage.
- ESD Resistance (Human Body Model): 8000 V.
- Reverse Voltage (VR): Note: The LED is not designed for reverse bias operation. Applying reverse voltage can damage the device.
- Junction Temperature (TJ): 115 \u00b0C (maximum).
- Operating & Storage Temperature: -40 \u00b0C to +85 \u00b0C.
- Power Dissipation (Pulse Mode): 3.95 W.
- Soldering Temperature: 245 \u00b0C (peak during reflow).
- Viewing Angle (2\u03b81/2): 120 degrees (\u00b1 5\u00b0 tolerance). This is the full angle at which luminous intensity is half the peak value.
Critical Design Notes: Operating the LED at maximum ratings for extended periods (exceeding 1 hour) is not recommended as it can lead to reliability issues and potential permanent damage. All reliability testing was performed under good thermal management using a 1.0 cm x 1.0 cm Metal Core Printed Circuit Board (MCPCB). Designers must implement proper heat sinking to maintain the solder pad temperature within safe limits.
2.2 Electro-Optical Characteristics
The key performance parameters are measured under pulsed conditions (50ms pulse width) at Tsolder pad = 25\u00b0C. This minimizes self-heating effects during measurement.
- Luminous Flux (\u03a6v): Minimum 240 lm, Typical 260 lm. Measurement tolerance is \u00b110%.
- Forward Voltage (VF): Minimum 2.95V, Typical 3.3V, Maximum 3.95V at IF=1000mA. Measurement tolerance is \u00b10.1V. The forward voltage is a critical parameter for driver design and power consumption calculation.
- Correlated Color Temperature (CCT): 5000K to 6000K, with a typical value of 5500K. This places the white light output in the \"cool white\" or \"daylight white\" range.
3. Binning System Explanation
The product uses a multi-parameter binning system to ensure consistency. The part number ELEM-NB5060J6J8293910-F3C encodes specific bin codes.
3.1 Forward Voltage Binning
LEDs are sorted into bins based on their forward voltage at 1000mA.
- Bin Code \"2935\": VF range from 2.95V to 3.55V.
- Bin Code \"3539\": VF range from 3.55V to 3.95V.
The part number indicates a bin code of \"2939\\
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |