334-15/T2C5-1 QSB LED Lamp Datasheet - T-1 3/4 Package - 3.6V Max - 110mW - White - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white LED lamp. The device is designed for applications requiring significant luminous output within a compact, industry-standard package.

1.1 Core Features and Positioning

The primary advantage of this LED is its high luminous intensity, achieved through an InGaN chip and phosphor conversion system housed in a popular T-1 3/4 round package. This makes it suitable for applications where bright, clear indication is paramount. The product is designed with compliance in mind, adhering to RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It also features a degree of electrostatic discharge (ESD) protection, with a withstand voltage of up to 4KV (HBM). The device is available in bulk or taped on reel for automated assembly processes.

1.2 Target Applications

The high luminous output and standard form factor make this LED ideal for several key application areas:

• Message Panels and Displays: Providing bright, legible illumination for informational signs.
• Optical Indicators: Serving as status or alert indicators in electronic equipment.
• Backlighting: Illuminating small panels, switches, or symbols.
• Marker Lights: Used in applications requiring positional or boundary marking.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's electrical, optical, and thermal limits and characteristics.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 30 mA. The LED should not be driven with a continuous DC current exceeding this value.
• Peak Forward Current (I_FP): 100 mA (at 1/10 duty cycle, 1 kHz). This allows for short pulses of higher current, useful for multiplexing or achieving momentary higher brightness.
• Reverse Voltage (V_R): 5 V. Applying a reverse bias voltage greater than this can damage the LED junction.
• Power Dissipation (P_d): 110 mW. This is the maximum allowable power the package can dissipate as heat, calculated as V_F * I_F.
• Operating Temperature (T_opr): -40 to +85 \u00b0C. The ambient temperature range for reliable operation.
• Storage Temperature (T_stg): -40 to +100 \u00b0C.
• ESD Withstand (HBM): 4 kV. Specifies the level of electrostatic discharge protection.
• Zener Reverse Current (I_z): 100 mA. A protective Zener diode is integrated, with this maximum current limit.
• Soldering Temperature (T_sol): 260 \u00b0C for 5 seconds. Defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at 25\u00b0C. Designers should use these for circuit calculations.

• Forward Voltage (V_F): 2.8V to 3.6V at I_F=20mA. This range necessitates a current-limiting circuit or driver. The typical value falls within this bin range.
• Zener Reverse Voltage (V_z): Typically 5.2V at I_z=5mA. This is the breakdown voltage of the integrated protection diode.
• Reverse Current (I_R): Maximum 50 \u00b5A at V_R=5V. The small leakage current when reverse biased.
• Luminous Intensity (I_V): 3600 to 7150 mcd (millicandela) at I_F=20mA. This is the key performance metric, indicating very high brightness. The specific value is determined by the bin code (Q, R, S).
• Viewing Angle (2\u03b8_1/2): Typically 50 degrees. This is the full angle at which luminous intensity drops to half of its peak axial value. It defines the beam spread.
• Chromaticity Coordinates (CIE 1931): Typical x=0.29, y=0.28. These coordinates define the white point color on the CIE chromaticity diagram. Actual coordinates fall within specified color ranks (A1, A0, B3, B4, B5, B6, C0).

2.3 Thermal Considerations

The power dissipation limit of 110mW and operating temperature up to 85\u00b0C must be respected. Exceeding the junction temperature will reduce luminous output (efficiency droop) and shorten lifespan. Adequate PCB layout for heat sinking is recommended for continuous operation at high currents.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Luminous Intensity Binning

LEDs are categorized into three bins (Q, R, S) based on measured luminous intensity at 20mA:
\u2022 Bin Q: 3600 - 4500 mcd
\u2022 Bin R: 4500 - 5650 mcd
\u2022 Bin S: 5650 - 7150 mcd
A \u00b110% tolerance is noted on the luminous intensity measurement.

3.2 Forward Voltage Binning

LEDs are also binned by forward voltage drop at 20mA into four groups (0, 1, 2, 3):
\u2022 Bin 0: 2.8V - 3.0V
\u2022 Bin 1: 3.0V - 3.2V
\u2022 Bin 2: 3.2V - 3.4V
\u2022 Bin 3: 3.4V - 3.6V
The measurement uncertainty for V_F is \u00b10.1V.

3.3 Color Coordinate Binning (Chromaticity)

The white color point is tightly controlled and defined by seven color ranks on the CIE 1931 diagram: A1, A0, B3, B4, B5, B6, and C0. The datasheet provides the specific quadrilateral areas (defined by x,y coordinate corners) for each rank on the chromaticity diagram. A typical product grouping (Group 1) combines bins A1, A0, B3, B4, B5, B6, and C0. The measurement uncertainty for color coordinates is \u00b10.01. The diagram shows these ranks plotted against lines of constant correlated color temperature (CCT), ranging from approximately 4600K to 22000K, indicating the produced white light can vary from warm to cool white tones across the bins.

4. Performance Curve Analysis

Graphical data provides insight into device behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve (not fully detailed in text but implied) would show the spectral power distribution of the white light. As a phosphor-converted white LED based on an InGaN blue chip, the spectrum would feature a primary blue peak from the chip and a broader yellow-green-red emission band from the phosphor, combining to produce white light.

4.2 Directivity Pattern

The directivity plot illustrates the spatial distribution of light, correlating to the 50-degree typical viewing angle. It shows how intensity decreases as the angle from the central axis increases.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage for the LED junction. Designers use this to determine the necessary drive voltage for a target current and to design appropriate current-limiting circuitry. The curve will show a turn-on voltage around 2.8V and a steep rise in current with small increases in voltage thereafter.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates the light output's dependence on drive current. Luminous intensity typically increases sub-linearly with current due to efficiency droop at higher current densities. This informs decisions on driving the LED for optimal brightness versus efficiency.

4.5 Chromaticity Coordinate vs. Forward Current

This graph shows how the white point color (x,y coordinates) may shift with changes in drive current. Some variation is common and should be considered in color-critical applications.

4.6 Forward Current vs. Ambient Temperature

This derating curve is crucial for reliability. It indicates the maximum allowable forward current as the ambient temperature increases, ensuring the junction temperature remains within safe limits. For operation at high ambient temperatures (e.g., near 85\u00b0C), the drive current must be reduced from its maximum rated value.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED uses a standard T-1 3/4 (5mm) round package with two axial leads. Key dimensional notes include:
\u2022 All dimensions are in millimeters (mm).
\u2022 General tolerance is \u00b10.25mm unless otherwise specified.
\u2022 Lead spacing is measured at the point where the leads emerge from the package body.
\u2022 The maximum protrusion of resin under the flange is 1.5mm.
The detailed drawing would show the overall diameter, lens shape, lead diameter and length, and seating plane.

5.2 Polarity Identification

Typically, the longer lead denotes the anode (positive), and the shorter lead denotes the cathode (negative). The cathode may also be indicated by a flat spot on the plastic lens rim or a notch in the flange. Correct polarity is essential to prevent reverse bias damage.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain device integrity and performance.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb to avoid stress on the seal.
• Perform lead forming before soldering.
• Avoid stressing the package during forming, as it may damage internal connections or the epoxy.
• Cut leadframes at room temperature. High-temperature cutting can induce failures.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress, which can degrade the epoxy and the LED.

6.2 Soldering Parameters

• Maintain a distance of more than 3mm from the solder joint to the epoxy bulb.
• Soldering should not extend beyond the base of the tie bar on the lead.
• Hand Soldering: Iron tip temperature maximum 300\u00b0C (for a 30W max iron), soldering time 3 seconds maximum.
• Wave/DIP Soldering: Maximum preheat temperature of 100\u00b0C for a maximum of 60 seconds.

6.3 Storage Conditions

• Recommended storage after shipment: 30\u00b0C or less and 70% Relative Humidity or less.
• Storage life under these conditions is 3 months.
• For storage beyond 3 months and up to 1 year, place devices in a sealed container with a nitrogen atmosphere and moisture absorbent material.
• Avoid rapid temperature transitions, especially in high humidity, to prevent condensation.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge and moisture ingress:
\u2022 Primary Packing: Anti-electrostatic bags.
\u2022 Secondary Packing: Inner cartons.
\u2022 Tertiary Packing: Outside cartons.
\u2022 Packing Quantity: 200-500 pieces per bag, 5 bags per inner carton, 10 inner cartons per outside carton.

7.2 Label Explanation

Labels on packaging contain the following information:
\u2022 CPN: Customer's Production Number.
\u2022 P/N: Production Number (Part Number).
\u2022 QTY: Packing Quantity.
\u2022 CAT: Combined ranks for Luminous Intensity and Forward Voltage bins.
\u2022 HUE: Color Rank (e.g., A1, B4).
\u2022 REF: Reference.
\u2022 LOT No: Lot Number for traceability.

7.3 Model Number Designation

The part number follows the structure: 334-15/T2C5-\u25a1 \u25a1 \u25a1 \u25a1. The squares represent codes for specific bin selections of luminous intensity, forward voltage, and color coordinates, allowing precise ordering to meet application requirements.

8. Application Design Considerations

8.1 Drive Circuit Design

Due to the forward voltage range (2.8-3.6V) and sensitivity to current, a constant-current driver is strongly recommended over a simple series resistor when possible, especially for uniform brightness and stability over temperature and voltage variations. The driver should be designed to not exceed the absolute maximum ratings for continuous (30mA) and peak (100mA pulsed) current.

8.2 Thermal Management

For continuous operation at high currents or in elevated ambient temperatures, consider the thermal path. While the package is not designed for a heatsink, ensuring the leads are soldered to a sufficient copper area on the PCB can help dissipate heat and lower the junction temperature, improving longevity and maintaining light output.

8.3 Optical Integration

The 50-degree viewing angle provides a broad beam. For applications requiring focusing or collimation, secondary optics (lenses, reflectors) designed for T-1 3/4 packages can be used. The water-clear resin lens is suitable for use with such optics.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the best way to drive this LED from a 5V or 12V supply?
A: For a 5V supply, a series resistor can be used, but its value must be calculated based on the actual V_F bin of the LED to ensure correct current. For a 12V supply or for better stability, a dedicated constant-current LED driver IC or a simple transistor-based current source circuit is recommended.

Q: Can I pulse this LED to make it appear brighter?
A: Yes, you can use the peak forward current rating (100mA at 1/10 duty cycle, 1kHz). Pulsing at a higher current than the DC rating can achieve higher instantaneous brightness, which the human eye may perceive as increased brightness if pulsed fast enough (PWM). Ensure the average power dissipation does not exceed 110mW.

Q: How consistent is the white color between different units?
A: Color consistency is managed through the seven defined color ranks (A1 to C0). For applications requiring very tight color matching, specify a single color rank (HUE) when ordering. The typical chromaticity spread within a single rank is defined by its quadrilateral area on the CIE diagram.

Q: Is a current-limiting resistor necessary?
A: Absolutely. LEDs are current-driven devices. Connecting directly to a voltage source exceeding the LED's forward voltage will cause excessive current flow, potentially destroying the device instantly. Always use a series resistor or active current regulation.

10. Operating Principle and Technology

This LED generates white light through a phosphor conversion method. The core of the device is a semiconductor chip made of Indium Gallium Nitride (InGaN), which emits blue light when forward biased (electroluminescence). This blue light is not emitted directly. Instead, the chip is encapsulated within a reflector cup filled with a yellow (or a mix of green and red) phosphor material. When the blue photons from the chip strike the phosphor particles, they are absorbed and re-emitted at longer wavelengths (Stokes shift), primarily in the yellow region of the spectrum. The combination of the remaining unconverted blue light and the broad-spectrum yellow light from the phosphor mixes to produce the perception of white light. The specific ratios of blue to phosphor emission, and the exact phosphor composition, determine the correlated color temperature (CCT) and color rendering index (CRI) of the white light, which are controlled via the binning process.