T-1 3mm White LED Lamp Datasheet - 3.0x5.0mm Package - 3.2V Typical - 20mA Drive - 14.25-28.5k mcd Intensity - English Technical Document

1. Product Overview

This document details the specifications for a high-luminosity white light-emitting diode (LED) encapsulated in a popular T-1 (3mm) round package. The device is engineered to deliver superior luminous output, making it suitable for applications requiring bright, clear indicators or illumination.

The core technology utilizes an InGaN (Indium Gallium Nitride) semiconductor chip that emits blue light. This blue emission is converted to a broad-spectrum white light through the use of a phosphor coating deposited within the LED's reflector cup. The resulting white light is characterized by specific chromaticity coordinates as defined by the CIE 1931 color space standard.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include its high luminous power within a compact, industry-standard form factor. The device is designed for reliability and compliance with modern environmental and safety standards.

• High Luminous Output: Delivers intense brightness for its size.
• Standard Package: The T-1 round package ensures compatibility with existing PCB footprints and sockets.
• Regulatory Compliance: The product adheres to RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is classified as Halogen-Free, meeting specific limits for Bromine (Br) and Chlorine (Cl) content.
• ESD Protection: Features an electrostatic discharge (ESD) withstand voltage of up to 4kV, enhancing handling robustness.

The target applications are diverse, focusing on areas where clear, bright signaling is paramount. Key markets include backlighting for message panels and displays, status or optical indicators in consumer and industrial electronics, and various marker light applications.

2. In-Depth Technical Parameter Analysis

A thorough understanding of the device's limits and operating characteristics is crucial for reliable circuit design and long-term performance.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided for reliable performance.

• Continuous Forward Current (I_F): 30 mA
• Peak Forward Current (I_FP): 100 mA (at a duty cycle of 1/10 and 1 kHz frequency)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 100 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for a maximum of 5 seconds (wave or reflow soldering).

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters are measured under standard test conditions and represent the typical performance of the device when driven with a forward current (I_F) of 20 mA.

• Forward Voltage (V_F): 2.8 V (Min), 3.2 V (Typ), 3.6 V (Max). The typical voltage drop across the LED is 3.2V.
• Luminous Intensity (I_V): 14,250 mcd (Min), 28,500 mcd (Max). The actual intensity is binned (see Section 3).
• Viewing Angle (2θ_1/2): 15 degrees (Typical). This narrow viewing angle concentrates the light output, contributing to high axial intensity.
• Chromaticity Coordinates: x=0.29, y=0.30 (Typical), according to the CIE 1931 color space. This defines the specific white point of the emitted light.
• Reverse Current (I_R): 50 µA (Max) at V_R=5V.

3. Binning System Explanation

To manage production variations and allow for precise selection, the LEDs are categorized into bins for key parameters.

3.1 Luminous Intensity Binning

LEDs are sorted based on their measured luminous intensity at 20 mA. This allows designers to choose a brightness grade suitable for their application.

• Bin W: 14,250 to 18,000 mcd
• Bin X: 18,000 to 22,500 mcd
• Bin Y: 22,500 to 28,500 mcd

The overall tolerance for luminous intensity is ±10%.

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage drop, which is important for power supply design and ensuring consistent current in parallel configurations.

• Bin 0: V_F = 2.8V to 3.0V
• Bin 1: V_F = 3.0V to 3.2V
• Bin 2: V_F = 3.2V to 3.4V
• Bin 3: V_F = 3.4V to 3.6V

The measurement uncertainty for forward voltage is ±0.1V.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

4.1 Relative Intensity vs. Forward Current

This curve shows that the light output (relative intensity) increases with forward current, but the relationship is not perfectly linear, especially at higher currents. Driving the LED above the recommended continuous current (30mA) may lead to reduced efficiency and accelerated aging.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve demonstrates the exponential relationship typical of a diode. The \"knee\" voltage, where current begins to increase significantly, is around 2.8V to 3.0V for this white LED. Stable current drive, not voltage drive, is essential for consistent light output.

4.3 Relative Intensity vs. Ambient Temperature

LED light output is temperature-dependent. This curve typically shows a decrease in luminous intensity as the ambient temperature (T_a) rises. Effective thermal management in the application is necessary to maintain brightness, especially when operating near the maximum temperature limit.

4.4 Chromaticity Coordinate vs. Forward Current

This graph reveals how the color of the white light (its chromaticity coordinates) may shift slightly with changes in drive current. For color-critical applications, a constant current driver is mandatory to maintain a stable white point.

4.5 Spectral Distribution

The relative intensity vs. wavelength plot shows the emission spectrum. A white LED using a blue chip + phosphor system will show a strong blue peak (from the InGaN chip) and a broader yellow/red emission band (from the phosphor). The combined spectrum determines the Color Rendering Index (CRI) and correlated color temperature (CCT), though specific CCT is not listed in this datasheet.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard T-1 (3mm) radial leaded package. Key dimensions include:

• Overall diameter: Approximately 5.0 mm (max).
• Lead spacing: 2.54 mm (standard 0.1-inch pitch, measured where leads emerge from package).
• Total height: Varies, but includes the epoxy lens and leads. Protruded resin under the flange is a maximum of 1.5mm.
• Lead wire diameter: Standard for component insertion.

All dimensional tolerances are ±0.25mm unless otherwise specified. Designers must refer to the detailed mechanical drawing for precise PCB hole placement and keep-out areas.

5.2 Polarity Identification

For radial leaded LEDs, polarity is typically indicated by two features: the longer lead is the anode (positive), and there is often a flat spot or notch on the rim of the plastic lens near the cathode (negative) lead. Correct polarity must be observed during assembly to prevent reverse bias damage.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to prevent mechanical or thermal damage to the LED.

6.1 Lead Forming

• Bending must be performed at a point at least 3mm from the base of the epoxy lens.
• Lead forming should always be done before the soldering process.
• Avoid applying stress to the LED package body during bending.
• Cut leads at room temperature; using hot cutters may induce failure.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

6.2 Storage Conditions

• Recommended storage: ≤ 30°C and ≤ 70% Relative Humidity (RH).
• Shelf life in original shipping bag: 3 months.
• For longer storage (up to 1 year), place in a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

The minimum distance from the solder joint to the epoxy bulb must be 3mm.

Hand Soldering:

• Iron tip temperature: 300°C Max (for a 30W max iron).
• Soldering time per lead: 3 seconds Max.

Wave or Dip Soldering:

• Preheat temperature: 100°C Max (for 60 seconds Max).
• Solder bath temperature: 260°C Max.
• Contact time in bath: 5 seconds Max.

Critical Notes:

• Avoid stress on leads while the LED is hot from soldering.
• Do not subject the LED to more than one soldering cycle (dip/hand).
• Protect the epoxy lens from flux splatter and cleaning solvents.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage during transport and storage.

• Primary Packing: Anti-static bags.
• Quantity per Bag: 200 to 500 pieces.
• Secondary Packing: 5 bags are placed into one inner carton.
• Tertiary Packing: 10 inner cartons are packed into one master (outside) carton.

7.2 Label Explanation

Labels on the bags and cartons contain the following information for traceability and identification:

• P/N: Part Number (specific product code).
• CAT: Category code, indicating the combined bin for Luminous Intensity and Forward Voltage (e.g., a code representing Bin Y for intensity and Bin 1 for voltage).
• HUE: Color rank or chromaticity bin.
• LOT No: Manufacturing lot number for quality tracking.
• QTY: Quantity of pieces in the package.

8. Application Notes and Design Considerations

8.1 Typical Application Scenarios

• Message Panels & Backlighting: Its high intensity and narrow viewing angle make it ideal for backlighting segmented or dot-matrix displays where bright, legible characters are needed.
• Optical Indicators: Perfect for status lights, power-on indicators, or warning lights in equipment where high visibility is required, even in ambient light.
• Marker Lights: Suitable for position indicators, exit signs, or low-level architectural accent lighting.

8.2 Circuit Design Considerations

• Current Limiting: Always use a series current-limiting resistor or a constant-current driver. Calculate the resistor value using R = (V_supply - V_F) / I_F. Use the maximum V_F from the bin or datasheet to ensure current does not exceed limits if V_F is lower.
• Parallel Connections: Avoid directly connecting LEDs in parallel without individual current-limiting elements. Variations in V_F can cause current hogging, where one LED draws most of the current and fails prematurely.
• Thermal Management: Although power dissipation is low (100mW max), ensure adequate ventilation and avoid placing the LED near other heat sources on the PCB. High junction temperature reduces light output and lifespan.
• Reverse Voltage Protection: The maximum reverse voltage is only 5V. In AC or bipolar signal applications, or where reverse connection is possible, include a protection diode in parallel with the LED (cathode to anode, anode to cathode) to clamp reverse voltage.

9. Technical Comparison and Differentiation

Compared to generic 3mm white LEDs, this device offers distinct advantages:

• Higher Intensity Bins: With a maximum intensity of 28,500 mcd, it provides significantly higher brightness than standard 3mm LEDs, which often range from 2,000 to 10,000 mcd.
• Narrow Viewing Angle (15°): Concentrates the luminous flux into a tighter beam, resulting in higher axial (on-axis) intensity compared to LEDs with wider (e.g., 30° or 60°) viewing angles. This is a key differentiator for directed lighting applications.
• Integrated Zener Diode (optional/protected versions): The mention of Zener Reverse Voltage (V_z) and current (I_z) in the ratings suggests some variants may include an integrated reverse-voltage protection Zener diode, which is not common in basic LED packages.
• Comprehensive Compliance: Explicit compliance with Halogen-Free, REACH, and RoHS standards is a critical factor for designers targeting regulated markets like Europe and for companies with strict environmental policies.

10. Frequently Asked Questions (FAQ)

Q1: What driver current should I use?
A1: The standard test condition and recommended operating point is 20 mA. You can drive it up to the Absolute Maximum Rating of 30 mA continuous, but this will increase power dissipation, generate more heat, and may reduce operational lifetime. For optimal balance of brightness, efficiency, and longevity, 20 mA is recommended.

Q2: How do I interpret the luminous intensity binning?
A2: The bin code (W, X, Y) on the package label tells you the guaranteed minimum and maximum intensity for that batch of LEDs. For example, Bin Y LEDs will be the brightest available from this series. Specify the required bin when ordering for brightness consistency in your production.

Q3: Can I use this LED for outdoor applications?
A3: The operating temperature range (-40°C to +85°C) supports many outdoor environments. However, the epoxy lens material may be susceptible to UV degradation and yellowing over prolonged direct sunlight exposure, which would reduce light output and shift color. For harsh outdoor use, LEDs with UV-resistant silicone lenses are more appropriate.

Q4: Why is the viewing angle so narrow?
A4: The narrow 15° viewing angle is a design feature to achieve very high axial luminous intensity (measured in millicandelas). The light is focused into a tighter beam. If you need wider area illumination, you would select an LED with a wider viewing angle (e.g., 60°), though its axial intensity will be lower.

11. Operational Principles

This LED operates on the principle of electroluminescence in a semiconductor. When a forward voltage exceeding the diode's bandgap is applied, electrons and holes recombine within the InGaN active region, releasing energy in the form of photons. The specific composition of the InGaN alloy results in the emission of blue light with a wavelength around 450-470 nm.

This blue light is not emitted directly. Instead, it strikes a layer of phosphor material (typically Yttrium Aluminum Garnet doped with Cerium, or YAG:Ce) deposited inside the reflector cup. The phosphor absorbs the high-energy blue photons and re-emits lower-energy photons across a broad spectrum in the yellow and red regions. The human eye perceives the mixture of the remaining blue light and the converted yellow/red light as white. The exact \"shade\" of white (cool, neutral, warm) is determined by the ratio of blue to yellow/red light, which is controlled by the phosphor composition and thickness.

12. Technology Trends

The technology described represents a mature and widely adopted approach to generating white light from LEDs. The \"blue chip + phosphor\" method is cost-effective and allows for good control over color temperature. Current trends in the industry include:

• Increased Efficiency (lm/W): Ongoing improvements in InGaN chip design, phosphor efficiency, and package architecture continue to push luminous efficacy higher, reducing energy consumption for the same light output.
• Improved Color Quality: Development of multi-phosphor blends (adding red phosphors) to enhance the Color Rendering Index (CRI), providing more natural and accurate color reproduction under the LED light.
• Miniaturization & High-Density Packaging: While this is a through-hole component, the broader market trend is towards smaller surface-mount device (SMD) packages (e.g., 2835, 2016, 1515) for automated assembly and higher-density lighting arrays.
• Specialized Spectra: LEDs are being engineered with specific spectral outputs for applications beyond general illumination, such as horticultural lighting (optimized for plant growth) or human-centric lighting (tunable white light to mimic natural daylight cycles).