T-1 3/4 LED Lamp Datasheet - Warm White - 30mA - 110mW - English Technical Documentation

1. Product Overview

This document details the specifications for a high-performance, warm white LED lamp. The device is engineered to deliver high luminous intensity, making it suitable for applications requiring bright, clear illumination. The core of the device utilizes an InGaN semiconductor chip. The emitted blue light from this chip is converted to a warm white color through a phosphor layer deposited within the reflector cup of the package. This design approach allows for precise color control and high efficiency.

The LED is housed in a popular T-1 3/4 round package, which is a standard through-hole form factor widely used in the industry for its reliability and ease of assembly. The device is compliant with key environmental and safety regulations, including RoHS, EU REACH, and halogen-free standards, ensuring it meets modern manufacturing requirements.

1.1 Core Advantages and Target Market

The primary advantage of this LED series is its combination of high luminous output within a standard, cost-effective package. The typical luminous intensity is significant, providing ample brightness for indicator and illumination purposes. The warm white color (with typical CIE 1931 chromaticity coordinates of x=0.40, y=0.39) is designed to be visually comfortable and is often preferred for display backlighting and panel indicators.

The target applications are diverse, focusing on areas where clear, reliable visual signaling is paramount. These include message panels and display boards where individual LEDs form characters or graphics. It is also ideal for general-purpose optical indicators in consumer electronics, industrial equipment, and automotive interiors. Furthermore, its brightness makes it suitable for backlighting smaller panels, switches, or scales. Marker light applications, such as in appliances or signage, also benefit from its performance.

2. Technical Parameter Deep Dive

A comprehensive understanding of the device's limits and operating characteristics is essential for reliable circuit design and long-term performance.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Continuous Forward Current (I_F): 30 mA. This is the maximum DC current that can be applied continuously to the LED anode.
• Peak Forward Current (I_FP): 100 mA. This higher current is permissible only under pulsed conditions, specified here at a duty cycle of 1/10 and a frequency of 1 kHz. Exceeding the continuous current rating even briefly can degrade the LED.
• Reverse Voltage (V_R): 5 V. Applying a reverse bias voltage higher than this can cause junction breakdown.
• Power Dissipation (P_d): 110 mW. This is the maximum amount of power the device can dissipate as heat, calculated as Forward Voltage (V_F) multiplied by Forward Current (I_F).
• Operating & Storage Temperature: The device can function in ambient temperatures from -40°C to +85°C and can be stored in temperatures from -40°C to +100°C.
• ESD Withstand Voltage (HBM): 4 kV. The device offers a good level of protection against Electrostatic Discharge using the Human Body Model, which is important for handling during assembly.
• Soldering Temperature: The leads can withstand a soldering temperature of 260°C for up to 5 seconds, which is compatible with standard wave or hand soldering processes.

2.2 Electro-Optical Characteristics

These parameters are measured under typical conditions (Ta=25°C) and define the device's performance in operation.

• Forward Voltage (V_F): Ranges from 2.8V to 3.6V at a test current of 20mA. This range is critical for designing the current-limiting circuitry. The typical value falls within this range, and actual voltage will depend on the specific bin (see section 3).
• Luminous Intensity (I_V): Has a minimum value of 7150 millicandelas (mcd) at 20mA. This is a measure of the perceived brightness of the LED in a specific direction. The actual intensity for a given unit will fall into a defined bin (T, U, or V).
• Viewing Angle (2θ_1/2): The typical full viewing angle at half intensity is 30 degrees. This describes the angular spread of the light output; a smaller angle like this indicates a more focused, directional beam pattern.
• Chromaticity Coordinates: The typical color point is defined as x=0.40, y=0.39 on the CIE 1931 chromaticity diagram. This places the white light in the "warm white" region. Individual units are grouped into specific color bins (D1, D2, E1, E2, F1, F2) to ensure color consistency.
• Reverse Current (I_R): Maximum of 50 µA when 5V reverse bias is applied.
• Zener Reverse Voltage (V_z): A typical value of 5.2V is noted when a Zener current (I_z) of 5mA is applied. This suggests the device may have integrated reverse voltage protection, which is a valuable feature for preventing damage from accidental reverse connection.

3. Binning System Explanation

To ensure consistency in brightness, color, and electrical characteristics in mass production, LEDs are sorted into bins. This allows designers to select parts that meet specific application requirements.

3.1 Luminous Intensity Binning

LEDs are categorized into three bins based on their measured luminous intensity at 20mA:
- Bin T: 7150 mcd to 9000 mcd.
- Bin U: 9000 mcd to 11250 mcd.
- Bin V: 11250 mcd to 14250 mcd.
A tolerance of ±10% is applied to the luminous intensity. Selecting a higher bin (e.g., V) guarantees a brighter minimum output.

3.2 Forward Voltage Binning

Forward voltage is sorted into four bins to aid in power supply design and current matching in multi-LED arrays:
- Bin 0: 2.8V to 3.0V.
- Bin 1: 3.0V to 3.2V.
- Bin 2: 3.2V to 3.4V.
- Bin 3: 3.4V to 3.6V.
The measurement uncertainty for V_F is ±0.1V.

3.3 Color Binning

The warm white color is tightly controlled by grouping LEDs into specific chromaticity regions on the CIE diagram, labeled D1, D2, E1, E2, F1, and F2. The datasheet provides the corner coordinate ranges for each of these hexagonal bins. For ordering, these are combined into a single group (Group 1: D1+D2+E1+E2+F1+F2), meaning the shipped product can be from any of these six color ranks, ensuring they are all within the warm white specification. The measurement uncertainty for color coordinates is ±0.01.

4. Performance Curve Analysis

The provided characteristic curves offer insight into the device's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This spectral distribution curve shows the LED emits a broad spectrum characteristic of a phosphor-converted white LED. It has a peak in the blue region (from the InGaN chip) and a broader peak in the yellow/red region (from the phosphor), combining to create white light. The curve confirms the "warm" quality by having significant energy in the longer wavelengths.

4.2 Directivity Pattern

The radiation pattern plot confirms the 30-degree typical viewing angle. The intensity is highest at 0 degrees (on-axis) and decreases symmetrically to half its value at approximately ±15 degrees.

3.3 Forward Current vs. Forward Voltage (IV Curve)

This curve shows the exponential relationship typical of a diode. The forward voltage increases with current. Designers use this to determine the necessary drive voltage for a chosen operating current, ensuring the current-limiting resistor or driver is correctly sized.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output (relative intensity) increases with forward current, but the relationship is not perfectly linear, especially at higher currents. It highlights the importance of stable current control for consistent brightness.

4.5 Chromaticity vs. Forward Current

This plot shows how the color coordinates (x, y) shift slightly with changes in drive current. This is a known phenomenon in white LEDs due to phosphor efficiency changes and chip characteristics. For color-critical applications, operating at the recommended 20mA ensures the color is within the specified bin ranges.

4.6 Forward Current vs. Ambient Temperature

This derating curve is crucial for reliability. It indicates the maximum allowable forward current decreases as the ambient temperature increases. To prevent overheating and premature failure, the drive current must be reduced when operating at high ambient temperatures, staying within the power dissipation limits.

5. Mechanical and Package Information

The device uses a standard T-1 3/4 (5mm) round LED package with two axial leads. Key dimensional notes include:
- All dimensions are in millimeters with a general tolerance of ±0.25mm unless otherwise specified.
- Lead spacing is measured at the point where the leads exit the package body.
- The maximum allowable protrusion of the resin lens below the flange is 1.5mm.
The package drawing provides exact measurements for the lens diameter, body height, lead length, and lead spacing, which are essential for PCB footprint design and ensuring proper fit in housings or panels.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain device integrity and performance.

6.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy lens to avoid stress on the internal die and wire bonds.
• Forming must be completed before the soldering process.
• Excessive stress during bending can crack the epoxy or damage internal connections.
• Lead cutting should be done at room temperature; hot cutting can induce thermal shock.
• PCB holes must align perfectly with the LED leads to avoid mounting stress.

6.2 Storage Conditions

• Recommended storage after receipt is at ≤30°C and ≤70% Relative Humidity for up to 3 months.
• For longer storage (up to 1 year), devices should be kept in a sealed, nitrogen-filled container with desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation on the devices.

6.3 Soldering Process

• Maintain a distance of more than 3mm from the solder joint to the epoxy lens.
• It is recommended to solder only up to the base of the tie bar on the leadframe.
• For hand soldering, control the iron tip temperature and time to prevent overheating.
• For dip/wave soldering, the leads can withstand 260°C for 5 seconds.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent damage and ESD:
- They are placed in anti-static bags.
- Each bag contains a minimum of 200 and a maximum of 500 pieces.
- Five bags are packed into an inner carton.
- Ten inner cartons are packed into a master (outside) carton.

7.2 Label Explanation

Labels on the packaging include:
- CPN: Customer's part number reference.
- P/N: Manufacturer's part number.
- QTY: Quantity of devices in the package.
- CAT: Combination code for the Luminous Intensity and Forward Voltage bins.
- HUE: Code for the Color Rank (e.g., D1, E2).
- REF: Reference information.
- LOT No: Traceable manufacturing lot number.

7.3 Model Number Designation

The part number follows a structured format: 334-15/X2C3- □ □ □ □. The blank squares (□) are placeholders for codes that specify the exact binning selections for luminous intensity, forward voltage, and color rank. This allows customers to order parts tailored to their specific brightness, voltage drop, and color consistency needs.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

The most common drive method is a simple series resistor. The resistor value (R_series) is calculated as: R_series = (V_supply - V_F) / I_F. Use the maximum V_F from the bin or datasheet (e.g., 3.6V) to ensure the current does not exceed the desired I_F (e.g., 20mA) even with a low-resistance LED. For example, with a 5V supply: R = (5V - 3.6V) / 0.020A = 70 Ohms. A standard 68 or 75 Ohm resistor would be suitable. For multiple LEDs, connect them in series with a single current-limiting resistor if the supply voltage is sufficiently high, or use parallel strings each with their own resistor for better current matching.

8.2 Thermal Management

Although the power dissipation is relatively low (110mW max), proper thermal design extends lifetime and maintains light output. Ensure the PCB has adequate copper area around the LED leads to act as a heat sink, especially if operating near maximum current or at high ambient temperatures. Avoid placing the LED near other heat-generating components.

8.3 Optical Integration

The 30-degree viewing angle provides a focused beam. For wider illumination, secondary optics like diffusers or lenses may be needed. The warm white color is less prone to causing glare than cool white, making it suitable for direct-view indicators.

9. Technical Comparison and Differentiation

Compared to generic 5mm white LEDs, this device offers key advantages:
1. Higher Luminous Intensity: With a minimum of 7150 mcd, it is significantly brighter than standard indicator-grade LEDs, enabling its use in sunlight-readable displays or as a small-area light source.
2. Integrated Protection: The 4kV ESD rating and suggested Zener clamping (Vz=5.2V) provide robustness against handling and electrical transients, which is often an extra cost or external component in basic LEDs.
3. Rigorous Binning: The detailed binning for intensity, voltage, and color allows for precise selection and better consistency in applications where uniform brightness or color across multiple units is critical.
4. Environmental Compliance: Full compliance with RoHS, REACH, and halogen-free standards makes it suitable for global markets with strict environmental regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA continuously?
A: Yes, 30mA is the Absolute Maximum Continuous Forward Current. For optimal lifetime and reliability, it is common practice to operate below this maximum, such as at 20mA as specified in the typical characteristics.

Q: What is the purpose of the different color bins (D1, F2, etc.)?
A: All bins (D1 through F2) produce warm white light but with slight variations in the exact hue (e.g., more yellowish vs. more pinkish). Grouping them allows the manufacturer to use all produced LEDs while guaranteeing they fall within an acceptable warm white range. For most applications, Group 1 is sufficient. For applications requiring very tight color matching, specifying a single bin may be necessary.

Q: How do I interpret the Forward Voltage bin?
A: If your design is sensitive to voltage drop (e.g., running from a low-voltage battery), selecting a lower V_F bin (0 or 1) will ensure more consistent brightness as the battery discharges, as a lower voltage drop leaves more voltage across the current-limiting resistor.

Q: Is a current-limiting resistor always required?
A> Yes. An LED is a current-driven device. Connecting it directly to a voltage source without a current limit will cause it to draw excessive current, leading to immediate failure. A series resistor or a constant-current driver is mandatory.

11. Practical Design and Usage Case

Case: Designing a Status Indicator Panel for Industrial Equipment
An engineer needs to design a panel with 20 bright, warm white status indicators. Requirements: consistent brightness and color, 24V DC supply, high reliability.
Design Steps:
1. Drive Method: Use a series resistor for simplicity and cost-effectiveness. Connect LEDs in series-parallel to efficiently use the 24V supply. Four LEDs in series have a max V_F of ~14.4V (4 * 3.6V). The resistor value: R = (24V - 14.4V) / 0.020A = 480 Ohms. Use a 470 Ohm, 1/4W resistor. Create 5 identical strings of 4 LEDs + 1 resistor.
2. Binning Selection: To ensure uniform appearance, specify the same luminous intensity bin (e.g., Bin U) and the same color bin group for all units in the order.
3. PCB Layout: Provide adequate pad size for the LED leads. Include a small copper pour connected to the cathode lead for slight heat dissipation. Ensure the 3mm lead bending rule is observed in the footprint design.
4. Assembly: Follow the soldering guidelines, using a controlled process to avoid thermal damage.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor. The active region is made of Indium Gallium Nitride (InGaN). When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons. The specific composition of the InGaN layer determines that these photons are in the blue wavelength range (~450-470 nm).

To create white light, a phosphor coating is applied over the blue chip. This phosphor is a ceramic material doped with rare-earth elements. When the high-energy blue photons strike the phosphor, they are absorbed and re-emitted as lower-energy photons across a broad spectrum, primarily in the yellow and red regions. The combination of the unconverted blue light and the down-converted yellow/red light is perceived by the human eye as white light. The "warm" quality is achieved by tuning the phosphor composition to enhance the longer wavelength (red) component of the spectrum.

13. Technology Trends and Context

The use of InGaN-based blue chips with phosphor conversion is the dominant technology for producing white LEDs, known as pc-LEDs. This device represents a mature, high-volume product in a through-hole package. Industry trends are moving towards:
1. Increased Efficiency (lm/W): Ongoing improvements in chip design, phosphor efficiency, and package extraction continue to push luminous efficacy higher, reducing energy consumption for the same light output.
2. Color Quality: Advancements in phosphor technology, including the use of multiple phosphors or quantum dots, are improving the Color Rendering Index (CRI), making the white light more natural and accurate for displaying colors.
3. Package Miniaturization & SMT Migration: While T-1 3/4 remains popular, surface-mount device (SMD) packages (like 3528, 5050) are increasingly common for automated assembly and higher-density designs. However, through-hole LEDs like this one retain advantages in prototyping, repair, and applications requiring higher single-point brightness or robustness against vibration.
4. Smart and Connected Lighting: The broader market is integrating LEDs with sensors and controllers for intelligent lighting systems, though this primarily affects higher-power lighting modules rather than discrete indicator lamps.

This particular LED sits in a stable, performance-optimized niche, offering a reliable solution for applications where its specific combination of brightness, package style, and color is required.