LED 3535 White High Power Specification - 3.45x3.45x2.65mm - Forward Voltage 2.6-3.4V - Power up to 6800mW - CCT 2700K-6000K - English Technical Document

1. Product Overview

The RF-AL-C3535L2K1**-H2 series is a high-power white LED designed for general illumination and specialty lighting applications. It utilizes a blue LED chip combined with phosphor to produce white light with high efficacy and excellent color rendering. The package measures 3.45mm x 3.45mm x 2.65mm, making it suitable for compact luminaires and high‑density arrays. Key features include a ceramic substrate for superior thermal management, a wide 120° viewing angle, and RoHS compliance. The LED supports high‑current driving up to 2000 mA (peak 3000 mA) and can dissipate up to 6800 mW, enabling high lumen output in demanding environments.

2. Technical Parameter Analysis

2.1 Electrical Characteristics

The forward voltage (VF) at 350 mA is typically in the range of 2.6 V to 3.4 V, with a standard value around 3.0 V. The LED can be driven with a continuous forward current up to 2000 mA, provided adequate heat sinking is maintained. The reverse voltage is limited to 5 V, and the device is rated for ESD sensitivity of 2000 V (HBM). Power dissipation must not exceed 6800 mW under any operating condition.

2.2 Optical Characteristics

Luminous flux varies with current and color temperature bin. At 350 mA, typical flux ranges are 140–190 lm for different CCT bins. At 700 mA, flux roughly doubles (260–360 lm). Correlated Color Temperature (CCT) options include 2700 K, 3000 K, 3500 K, 4000 K, 4500 K, 5000 K, 5700 K, and 6000 K. Color Rendering Index (Ra) is minimum 80. The viewing angle (2θ1/2) is 120°, providing a wide and uniform light distribution.

2.3 Thermal Characteristics

Thermal resistance from junction to solder point (RthJ‑S) is typically 1.90 °C/W at 700 mA and 25°C ambient. This low thermal resistance ensures efficient heat transfer to the PCB. The maximum junction temperature is 125°C. Proper thermal design is critical to maintain reliability and prevent lumen depreciation.

3. Binning System

3.1 Forward Voltage Bins

At 350 mA, forward voltage is sorted into four bins: F0 (2.6–2.8 V), G0 (2.8–3.0 V), H0 (3.0–3.2 V), and I0 (3.2–3.4 V). This allows customers to select LEDs with matched VF for parallel or series string designs.

3.2 Luminous Flux Bins

Luminous flux at 350 mA is binned as FC6 (140–150 lm), FC7 (150–160 lm), FC8 (160–170 lm), FC9 (170–180 lm), and FD1 (180–190 lm). Higher flux bins are available for the same CCT, enabling tight sorting for uniform light output.

3.3 Chromaticity Bins

For each nominal CCT (e.g., 2700K, 3000K, etc.), the LED is further divided into sub‑bins (e.g., 27A, 27B, 27C, 27D) based on CIE 1931 chromaticity coordinates. The provided tables list exact x/y coordinate boundaries. This ensures consistent color appearance across production lots.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (Fig. 1-6)

The curve shows a near‑linear relationship between forward current (0–1600 mA) and forward voltage (2.6–3.3 V). At higher currents the slope increases slightly due to resistive heating and series resistance.

4.2 Forward Current vs. Relative Intensity (Fig. 1-7)

Relative luminous intensity increases with current, but not linearly. At 350 mA the relative intensity is about 1.0, and at 1400 mA it reaches approximately 3.5. The efficiency droops at high currents due to thermal and non‑radiative recombination effects.

4.3 Temperature vs. Relative Intensity (Fig. 1-8)

As the solder point temperature (Ts) rises from 25°C to 125°C, the relative intensity drops by about 30%. This thermal derating must be accounted for in system design to maintain target lumen output.

4.4 Radiation Diagram (Fig. 1-10) and Spectrum (Fig. 1-11)

The radiation pattern is Lambertian with a 120° half‑angle (FWHM). The spectral distribution shows a blue peak around 450 nm and a broad phosphor emission from 500–700 nm, typical for white LEDs with Ra >80.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a 3.45 mm x 3.45 mm ceramic package with a total height of 2.65 mm. The bottom view shows two electrical pads (anode and cathode) with polarity marking. The top view is a clear silicone lens. Soldering patterns provide recommended PCB land pads for optimal heat dissipation and mechanical stability.

5.2 Polarity and Soldering Patterns

Polarity is indicated on the package and must be observed during assembly. The recommended soldering pattern ensures proper thermal conduction and avoids short circuits. All dimensions are in millimeters with a tolerance of ±0.2 mm unless otherwise noted.

6. Assembly and Soldering Guide

6.1 Reflow Soldering Profile

The recommended reflow profile has a preheat zone of 150–200°C for 60–120 seconds, a ramp‑up rate ≤3°C/s, a time above 217°C (TL) of up to 60 seconds, and a peak temperature of 260°C for ≤10 seconds. Cooling rate should not exceed 6°C/s. Only two reflow cycles are allowed.

6.2 Hand Soldering and Repair

If hand soldering is necessary, the iron temperature must be below 300°C and the soldering time less than 3 seconds, performed only once. Repair should be avoided; if unavoidable, use a double‑head soldering iron and verify no damage to the LED.

6.3 Handling Precautions

The silicone lens is soft; avoid mechanical pressure on the top surface. Use forceps on the side surfaces. Do not mount LEDs on warped PCBs. After soldering, do not warp or apply vibration until cooled to room temperature. Sulfur content in surrounding materials must be below 100 ppm; bromine and chlorine limits are specified to prevent corrosion and discoloration.

7. Packaging and Ordering Information

7.1 Packaging Specifications

LEDs are delivered on tape and reel: 1000 pieces per reel. The carrier tape has dimensions 4.0 mm pitch, 12.0 mm width, with 100 empty pockets at both leader and trailer. Reel dimensions: 178 mm diameter, 14.0 mm hub hole. Moisture barrier bag and label details are provided.

7.2 Label Information

Each label includes part number, spec number, lot number, bin code for luminous flux (Φ), chromaticity bin (XY), forward voltage bin (VF), quantity, and date code. This ensures traceability.

8. Application Recommendations

8.1 Typical Applications

The LED is suitable for warning lights, downlights, wash wall lights, spotlights, street lights, plant lighting, landscape lighting, stage photography lights, as well as indoor commercial and residential lighting (hotels, markets, offices, households).

8.2 Design Considerations

Thermal management is critical. Use a PCB with adequate thermal vias and metal‑core PCB (MCPCB) for high‑current designs. Always include current‑limiting resistors or constant‑current drivers. Avoid reverse voltage. Consider derating curves to ensure junction temperature stays below 125°C. For parallel strings, use matched VF bins to prevent current imbalance.

9. Reliability and Testing

9.1 Reliability Test Items

The LED has passed reflow soldering (260°C, 2 times), thermal shock (-40°C to 100°C, 1000 cycles), high temperature storage (100°C, 1000 h), low temperature storage (-40°C, 1000 h), life test (350 mA at 25°C, 1000 h), and high temperature high humidity life test (60°C/90% RH, 350 mA, 1000 h). Acceptance criteria: luminous flux maintenance ≥80%, no open/short circuit or flicker.

9.2 Storage Conditions

Before opening sealed bag: store at ≤30°C, ≤75% RH, within 6 months. After opening: ≤30°C, ≤60% RH, within 168 hours. If exceeded, bake at 60°C ±5°C, <5% RH for ≥24 hours. ESD precautions must be observed throughout handling.