Table of Contents
- 1. Product Overview
- 1.1 Key Features and Advantages
- 2. Technical Specifications Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Bin Code System Explanation
- 3.1 Forward Voltage (Vf) Binning
- 3.2 Luminous Flux (Φe) Binning
- 3.3 Dominant Wavelength (Wd) Binning
- 4. Performance Curve Analysis
- 4.1 Relative Luminous Flux vs. Forward Current
- 4.2 Relative Spectral Distribution
- 4.3 Radiation Pattern
- 4.4 Forward Current vs. Forward Voltage (I-V Curve)
- 4.5 Relative Luminous Flux vs. Case Temperature
- 5. Mechanical and Package Information
- 5.1 Outline Dimensions
- 5.2 Recommended PCB Attachment Pad
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Cleaning
- 7. Packaging and Ordering Information
- 7.1 Tape and Reel Specifications
- 8. Reliability Test Plan
- 9. Application Suggestions and Design Considerations
- 9.1 Drive Method
- 9.2 Thermal Management
- 9.3 Optical Design
- 10. Technical Comparison and Positioning
- 11. Frequently Asked Questions (Based on Technical Parameters)
- 12. Design and Usage Case Study
- 13. Operating Principle Introduction
- 14. Technology Trends
1. Product Overview
The LTPL-C035GH530 is a high-performance, energy-efficient green light-emitting diode (LED) designed for solid-state lighting applications. It represents a compact and reliable light source that combines the longevity advantages of LED technology with high brightness output. This product is engineered to provide design flexibility and is suitable for applications seeking to replace conventional lighting solutions with more efficient and durable alternatives.
1.1 Key Features and Advantages
The LED offers several distinct advantages that make it suitable for demanding applications:
- IC Compatibility: Designed for easy integration with standard integrated circuits, simplifying driver design.
- Environmental Compliance: The device is RoHS compliant and manufactured using lead-free processes, adhering to modern environmental standards.
- Operational Efficiency: It features lower operating costs compared to traditional light sources due to its high electrical-to-optical conversion efficiency.
- Reduced Maintenance: The long operational lifetime inherent to LED technology significantly reduces maintenance frequency and associated costs over the product's lifespan.
2. Technical Specifications Deep Dive
This section provides a detailed analysis of the LED's key performance parameters under standard test conditions (Ta=25°C).
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not recommended.
- DC Forward Current (If): 500 mA maximum.
- Power Consumption (Po): 1.9 Watts maximum.
- Operating Temperature Range (Topr): -40°C to +85°C.
- Storage Temperature Range (Tstg): -55°C to +100°C.
- Junction Temperature (Tj): 125°C maximum.
Important Note: Prolonged operation under reverse bias conditions can lead to component failure.
2.2 Electro-Optical Characteristics
These are the typical performance parameters measured at a forward current (If) of 350mA.
- Forward Voltage (Vf): Typically 3.0V, with a range from 2.6V (Min) to 3.8V (Max).
- Luminous Flux (Φv): Typically 120 milliwatts (mW) of radiant flux, corresponding to a specific luminous output. The range is from 90 mW (Min) to 150 mW (Max). Luminous flux is measured using an integrating sphere.
- Dominant Wavelength (Wd): Defines the perceived color. For this green LED, it ranges from 520 nm to 540 nm.
- Viewing Angle (2θ1/2): Typically 130 degrees, indicating a wide beam pattern.
- Thermal Resistance (Rth jc): Typically 9 °C/W from the junction to the case. This parameter is critical for thermal management design, with a measurement tolerance of ±10%.
3. Bin Code System Explanation
To ensure consistency in production, LEDs are sorted into performance bins. The bin code is marked on the packaging.
3.1 Forward Voltage (Vf) Binning
LEDs are categorized based on their forward voltage drop at 350mA.
V0: 2.6V - 3.0V
V1: 3.0V - 3.4V
V2: 3.4V - 3.8V
Tolerance: ±0.1V
3.2 Luminous Flux (Φe) Binning
LEDs are sorted by their radiant flux output at 350mA.
L1: 90 mW - 110 mW
L2: 110 mW - 130 mW
L3: 130 mW - 150 mW
Tolerance: ±10%
3.3 Dominant Wavelength (Wd) Binning
Precise color sorting is achieved through wavelength bins.
D5E: 520 nm - 525 nm
D5F: 525 nm - 530 nm
D5G: 530 nm - 535 nm
D5H: 535 nm - 540 nm
Tolerance: ±3nm
4. Performance Curve Analysis
The datasheet provides several characteristic curves essential for design engineers.
4.1 Relative Luminous Flux vs. Forward Current
This curve shows how light output increases with drive current. It is non-linear, and operating above the recommended current leads to diminished efficiency and increased heat.
4.2 Relative Spectral Distribution
This graph depicts the intensity of light emitted across different wavelengths, centered around the dominant wavelength (e.g., ~530nm for the D5G bin), showing the spectral purity of the green light.
4.3 Radiation Pattern
The polar diagram illustrates the spatial distribution of light intensity, confirming the wide 130-degree viewing angle.
4.4 Forward Current vs. Forward Voltage (I-V Curve)
This fundamental curve shows the exponential relationship between voltage and current in a diode. It is crucial for designing the current-limiting circuitry.
4.5 Relative Luminous Flux vs. Case Temperature
This critical curve demonstrates the negative impact of rising temperature on light output. As the case temperature increases, luminous flux decreases, highlighting the importance of effective thermal management in the application.
5. Mechanical and Package Information
5.1 Outline Dimensions
The package dimensions are approximately 3.5mm x 3.5mm in footprint. The lens height and ceramic substrate length/width have tighter tolerances (±0.1mm) compared to other dimensions (±0.2mm). The thermal pad is electrically isolated from the anode and cathode pads.
5.2 Recommended PCB Attachment Pad
A land pattern design is provided to ensure proper soldering and thermal connection. The design includes separate pads for the anode, cathode, and the central thermal pad for heat sinking.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
A suggested reflow profile is provided, emphasizing controlled heating and cooling rates. Key parameters include:
- Peak temperature should be controlled.
- A rapid cooling process is not recommended.
- The lowest possible soldering temperature is desirable.
- Reflow should be performed a maximum of three times.
6.2 Hand Soldering
If hand soldering is necessary, the iron tip temperature should not exceed 300°C, and contact time should be limited to 2 seconds maximum, performed only once.
6.3 Cleaning
Only alcohol-based solvents like isopropyl alcohol should be used for cleaning. Unspecified chemicals may damage the LED package.
7. Packaging and Ordering Information
7.1 Tape and Reel Specifications
The LEDs are supplied on embossed carrier tape and reels compliant with EIA-481-1-B specifications.
- Reel size: 7 inches.
- Maximum quantity per reel: 500 pieces.
- Cover tape seals empty pockets.
- A maximum of two consecutive missing components is allowed.
8. Reliability Test Plan
The product undergoes rigorous reliability testing. The test plan includes:
1. Low/High Temperature Operating Life (LTOL/HTOL).
2. Room Temperature Operating Life (RTOL).
3. Wet High Temperature Operating Life (WHTOL).
4. Thermal Shock (TMSK).
5. High Temperature Storage.
Pass/fail criteria are based on changes in Forward Voltage (±10%) and Luminous Flux (±15%) after testing.
9. Application Suggestions and Design Considerations
9.1 Drive Method
LEDs are current-driven devices. To ensure uniform brightness when connecting multiple LEDs in parallel, each LED should have its own current-limiting resistor in series. Driving LEDs in series with a constant current source is generally preferred for better matching.
9.2 Thermal Management
Given the thermal resistance (9°C/W) and the sensitivity of light output to temperature, proper heat sinking is essential. The central thermal pad must be connected to a sufficiently sized copper area on the PCB to dissipate heat effectively and maintain performance and longevity.
9.3 Optical Design
The wide 130-degree viewing angle makes this LED suitable for area lighting and illumination applications where broad coverage is needed. For focused beams, secondary optics (lenses) would be required.
10. Technical Comparison and Positioning
Compared to traditional incandescent or fluorescent lighting, this LED offers significantly higher efficiency, longer lifetime (typically tens of thousands of hours), instant-on capability, and greater robustness. Within the LED market, its combination of high power (1.9W max), compact size, and precise binning for color and flux makes it competitive for applications requiring consistent, bright green illumination.
11. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the typical operating current?
A: The electro-optical characteristics are specified at 350mA, which is the recommended typical operating point for balanced performance.
Q: How do I interpret the bin codes?
A: The bin code (e.g., V1L2D5G) specifies the Forward Voltage (V1), Luminous Flux (L2), and Dominant Wavelength (D5G) bin of that specific LED, ensuring you receive parts with tightly grouped characteristics.
Q: Why is thermal management so important?
A> As shown in the performance curves, light output decreases with increasing temperature. Excessive heat also accelerates degradation, reducing the LED's lifespan. Proper heat sinking is non-negotiable for reliable operation.
12. Design and Usage Case Study
Scenario: Designing an indicator panel with uniform green backlighting.
1. Component Selection: Specify a tight bin code (e.g., D5F for wavelength, L2 for flux) to ensure color and brightness consistency across all LEDs in the panel.
2. Circuit Design: Use a constant current driver. If driving in parallel, include an individual resistor for each LED to compensate for minor Vf variations and prevent current hogging.
3. PCB Layout: Design the PCB with large thermal pads connected to the LED's thermal pad. Use thermal vias to transfer heat to inner or bottom copper layers.
4. Assembly: Follow the recommended reflow profile precisely to avoid thermal shock and ensure reliable solder joints.
13. Operating Principle Introduction
Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The specific color of the light is determined by the energy band gap of the semiconductor material used. In this green LED, materials like Indium Gallium Nitride (InGaN) are typically engineered to produce photons in the 520-540 nm wavelength range.
14. Technology Trends
The solid-state lighting industry continues to evolve with trends focusing on:
- Increased Efficiency: Achieving higher lumens per watt (lm/W) to reduce energy consumption further.
- Improved Color Quality: Enhancing color rendering index (CRI) and offering more saturated and consistent colors.
- Higher Power Density: Packing more light output into smaller packages, demanding ever-better thermal management solutions.
- Smart Lighting Integration: Incorporating drivers with dimming, color tuning, and connectivity for IoT applications.
Products like the LTPL-C035GH530 align with these trends by offering a high-brightness, efficient source in a compact form factor suitable for modern lighting designs.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |