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LTE-5228A IR Emitter Datasheet - High Current, Low Forward Voltage, 940nm Wavelength - English Technical Document

Technical datasheet for the LTE-5228A high-power infrared LED emitter. Features include high current operation, low forward voltage, wide viewing angle, and clear transparent package. Includes absolute ratings, electrical/optical characteristics, and performance curves.
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PDF Document Cover - LTE-5228A IR Emitter Datasheet - High Current, Low Forward Voltage, 940nm Wavelength - English Technical Document

1. Product Overview

The LTE-5228A is a high-power infrared (IR) light-emitting diode (LED) designed for applications requiring robust optical output. Its core advantages stem from its engineering for high current drive capability while maintaining a relatively low forward voltage, making it efficient for pulsed and continuous operation. The device is packaged in a clear, transparent housing, which is typical for IR emitters to minimize absorption of the emitted non-visible light. The primary target markets include industrial automation, security systems (e.g., surveillance camera illumination), optical sensors, and remote control units where reliable, invisible light sources are critical.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. The LTE-5228A can dissipate up to 150 mW of power. Its peak forward current rating is exceptionally high at 2 Amperes, but this is only permissible under specific pulsed conditions (300 pulses per second with a 10 microsecond pulse width). The continuous forward current is rated at a more conventional 100 mA. The device can withstand a reverse voltage of up to 5V. The operating and storage temperature ranges are from -40°C to +85°C and -55°C to +100°C, respectively, indicating suitability for harsh environments. The lead soldering temperature is specified as 260°C for 5 seconds at a distance of 1.6mm from the package body, which is a critical parameter for assembly processes.

2.2 Electrical & Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (IF) of 20mA. The key optical outputs are defined in two ways: Aperture Radiant Incidence (Ee in mW/cm²) and Radiant Intensity (IE in mW/sr). Both parameters are binned, meaning devices are sorted into performance groups (BIN A, B, C, D) after manufacturing, with BIN D representing the highest output. The peak emission wavelength (λPeak) is typically 940 nm, placing it firmly in the near-infrared spectrum. The spectral line half-width (Δλ) is 50 nm, indicating the spectral bandwidth of the emitted light. Electrically, the forward voltage (VF) is between 1.2V and 1.6V at 20mA, confirming its low-voltage operation claim. The reverse current (IR) is a maximum of 100 µA at 5V reverse bias. The viewing angle (2θ1/2) is 40 degrees, defining the angular spread where the radiant intensity is at least half of its peak value.

3. Binning System Explanation

The datasheet clearly employs a performance binning system for the radiant output. Devices are tested and categorized into four bins (A, B, C, D) based on their measured Aperture Radiant Incidence and Radiant Intensity at IF = 20mA. BIN A represents the lower output range, while BIN D represents the highest guaranteed output. This system allows manufacturers to offer consistent performance levels and enables designers to select a bin that precisely meets their application's sensitivity or range requirements. There is no indication of voltage or wavelength binning for this specific part number; the forward voltage and peak wavelength are given as typical/maximum ranges without bin codes.

4. Performance Curve Analysis

The datasheet provides several graphs illustrating device behavior under varying conditions.

4.1 Spectral Distribution (Fig.1)

This curve shows the relative radiant intensity as a function of wavelength. It confirms the peak at 940 nm and the approximately 50 nm spectral half-width. The shape is typical for an AlGaAs-based IR LED.

4.2 Forward Current vs. Ambient Temperature (Fig.2)

This derating curve shows how the maximum allowable continuous forward current decreases as the ambient temperature increases. This is crucial for thermal management design to ensure the junction temperature does not exceed safe limits.

4.3 Forward Current vs. Forward Voltage (Fig.3)

This is the standard I-V (current-voltage) characteristic curve. It shows the exponential relationship, with the voltage rising as current increases. The curve allows designers to determine the necessary drive voltage for a desired operating current.

4.4 Relative Radiant Intensity vs. Ambient Temperature (Fig.4) & vs. Forward Current (Fig.5)

Figure 4 illustrates the temperature dependence of light output, typically showing a decrease in efficiency as temperature rises. Figure 5 shows how the optical output increases with forward current, highlighting the non-linear relationship, especially at higher currents where efficiency may drop due to heating.

4.5 Radiation Diagram (Fig.6)

This polar plot visually represents the spatial distribution of the emitted light, confirming the 40-degree viewing angle. The diagram shows the relative intensity at different angles from the central axis (0°).

5. Mechanical & Package Information

The package is a standard LED style with a flange. Key dimensions include the lead spacing, which is measured where the leads emerge from the package body. A note specifies that the maximum protrusion of resin under the flange is 1.5mm. The package is described as "clear transparent," which is optimal for IR emission. The polarity is typically indicated by the longer lead being the anode (+) and/or a flat spot on the package rim near the cathode (-) lead, though this specific marking is not detailed in the provided text. The dimensional drawing (referenced but not provided in text) would show the exact length, width, and height.

6. Soldering & Assembly Guidelines

The primary guideline provided is the absolute maximum rating for lead soldering: 260°C for 5 seconds, measured 1.6mm (0.063") from the package body. This is a critical parameter for wave soldering or hand-soldering processes. Exceeding this can damage the internal die attach or the epoxy package. For reflow soldering, a profile with a peak temperature below 260°C and a time above liquidus tailored to the solder paste should be used. It is generally advised to avoid excessive mechanical stress on the leads during handling. Storage conditions should adhere to the specified range of -55°C to +100°C in a dry environment to prevent moisture absorption.

7. Application Suggestions

7.1 Typical Application Scenarios

7.2 Design Considerations

8. Technical Comparison & Differentiation

Compared to standard low-power IR LEDs, the LTE-5228A's key differentiators are its high current capability (100mA continuous, 2A pulsed) and relatively low forward voltage. This combination allows for higher radiant output without proportionally higher power dissipation from excessive voltage drop. The wide 40-degree viewing angle is broader than some focused IR emitters, providing more uniform illumination for area coverage rather than long-distance spotting. The clear package offers higher transmission efficiency for 940nm light compared to tinted packages used for visible LEDs.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED directly from a 3.3V or 5V microcontroller pin?
A: No. The low forward voltage (max 1.6V at 20mA) means a direct connection would likely destroy the LED and potentially damage the microcontroller pin due to excessive current. A current-limiting resistor or driver circuit is mandatory.

Q: What is the difference between Aperture Radiant Incidence and Radiant Intensity?
A: Aperture Radiant Incidence (Ee) is the power density (mW/cm²) arriving at a surface placed close to and perpendicular to the LED. Radiant Intensity (IE) is the power emitted per solid angle (mW/sr), describing the inherent directionality of the source. IE is more useful for calculating illumination at a distance.

Q: How do I select the correct BIN?
A> Choose based on your system's sensitivity. If your receiver needs a minimum signal level, select a bin that guarantees that level at your operating current and distance. Higher bins (C, D) provide more output margin.

Q: Is a heatsink required?
A: It depends on the operating current and ambient temperature. At the maximum continuous current (100mA) and elevated ambient temperature, the power dissipation (P = VF * IF) approaches 160mW, which exceeds the absolute maximum power dissipation of 150mW. Therefore, for full-power continuous operation, thermal management via PCB copper area or a heatsink is necessary. For pulsed operation or lower currents, it may not be needed.

10. Practical Use Case Example

Designing a Long-Range Passive Infrared Motion Sensor Activator: A PIR motion sensor often has limited range. To extend its range at night, an IR illuminator can be used. For this application, the LTE-5228A would be driven in pulsed mode. A circuit would be designed to deliver 1A pulses (within the 2A max) at a low duty cycle (e.g., 1%) to keep average power low. This high peak current would generate very high instantaneous optical output, illuminating a scene at a distance of 20-30 meters effectively. The wide 40-degree angle would cover a broad area in front of the sensor. The clear package ensures maximum energy is projected outward. The designer would select BIN D LEDs for maximum range and use the derating curves to ensure the device temperature remains stable in an outdoor enclosure.

11. Operating Principle

The LTE-5228A is a semiconductor p-n junction diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific material composition (typically Aluminum Gallium Arsenide - AlGaAs) determines the bandgap energy, which corresponds to the infrared wavelength of 940 nm. The clear epoxy package encapsulates the semiconductor chip, provides mechanical protection, and acts as a lens to shape the output beam. The radiant output is directly proportional to the rate of carrier recombination, which is controlled by the forward current.

12. Technology Trends

Infrared emitter technology continues to evolve alongside visible LED technology. Trends include:
Increased Efficiency: Development of new semiconductor materials and structures (e.g., multi-quantum wells) to extract more photons per unit of electrical input power, reducing heat generation.
Higher Power Density: Packaging improvements to handle higher drive currents and dissipate heat more effectively, enabling smaller devices with equal or greater output.
Integrated Solutions: Combining the IR emitter with a driver IC, photodiode, or even a microcontroller in a single module for simplified design in sensor applications.
Wavelength Diversification: While 940nm is common (invisible, good for silicon detectors), other wavelengths like 850nm (slightly visible red glow) or 1050nm are used for specific applications like eye-tracking or longer atmospheric transmission.
The LTE-5228A represents a mature, high-reliability component in this landscape, optimized for robust performance in demanding conditions rather than the absolute cutting edge of efficiency.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.