LTPL-P033RGB RGB LED Datasheet - High Power LED - Red/Green/Blue - 150mA - English Technical Document

1. Product Overview

The LTPL-P033RGB is a high-power, energy-efficient, and ultra-compact solid-state light source. It combines the long lifetime and reliability advantages of Light Emitting Diodes with the brightness levels required to displace conventional lighting technologies. This device offers designers significant freedom in creating innovative lighting solutions across a wide range of applications.

1.1 Key Features

• High-power LED light source
• Instantaneous light output (less than 100 nanoseconds)
• Low voltage DC operation
• Low thermal resistance package
• RoHS compliant and lead-free
• Compatible with lead-free reflow soldering processes

1.2 Target Applications

This LED is designed for a diverse array of lighting applications, including but not limited to:

• Reading lights for automotive, bus, and aircraft interiors
• Portable lighting such as flashlights and bicycle lights
• Architectural lighting: downlighters, orientation lights, cove lighting, undershelf lighting, and task lighting
• Decorative and entertainment lighting
• Exterior lighting: bollards, security lights, and garden lighting
• Signaling applications: traffic signals, beacons, and rail crossing lights
• Edge-lit signs for exit indicators and point-of-sale displays
• General indoor and outdoor commercial and residential architectural lighting

2. Outline and Mechanical Dimensions

The device features a compact surface-mount package. All critical dimensions are provided in the datasheet with a standard tolerance of +/- 0.2 mm unless otherwise specified. The mechanical drawing outlines the package footprint, lead placement, and overall height, which are crucial for PCB layout and thermal management design.

3. Absolute Maximum Ratings and Characteristics

All ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these limits may cause permanent damage to the device.

3.1 Electrical Ratings

• Forward Current (I_F): 150 mA (continuous) for all colors (Red, Green, Blue).
• Forward Pulse Current (I_FP): 300 mA (pulsed) for all colors. Condition: 1/10 duty cycle, pulse width ≤10μs.
• Power Dissipation (P_D): Red: 360 mW; Green: 540 mW; Blue: 540 mW.

3.2 Thermal and Environmental Ratings

• Operating Temperature Range (T_opr): -30°C to +85°C.
• Storage Temperature Range (T_stg): -40°C to +100°C.
• Maximum Junction Temperature (T_j): 125°C.

Important Notes: Operating under reverse voltage conditions for extended periods is forbidden. It is strongly recommended to follow the provided de-rating curves when operating near maximum ratings to ensure normal and reliable LED operation.

4. Electro-Optical Characteristics

Typical performance parameters are measured at Ta=25°C and I_F=150mA.

4.1 Luminous Output

• Luminous Flux (Typ.): Red: 21 lm; Green: 50 lm; Blue: 9 lm. Luminous flux is the total light output measured with an integrating sphere.
• Luminous Intensity (Typ., for reference): Red: 6.8 cd; Green: 12.5 cd; Blue: 3.0 cd.

4.2 Spectral and Electrical Characteristics

• Dominant Wavelength: Red: 610-630 nm; Green: 515-535 nm; Blue: 450-470 nm.
• Forward Voltage (V_F): Red: 1.5-2.6 V; Green: 2.8-3.8 V; Blue: 2.8-3.8 V.
• Viewing Angle: 120 degrees (typical for all colors).

Test Standard: CAS-140B is referenced for luminous flux, dominant wavelength, and forward voltage measurements.

5. Typical Performance Curves Analysis

The datasheet provides several key graphs essential for circuit and thermal design.

5.1 Spectral Distribution

Figure 1 shows the relative spectral intensity versus wavelength for each color. This curve is vital for understanding the color purity and potential application in color-mixing systems.

5.2 Radiation Pattern

Figure 2 illustrates the spatial radiation (intensity) pattern, confirming the wide 120-degree viewing angle. The pattern is typically Lambertian for this type of package.

5.3 Current vs. Voltage (I-V Curve)

Figure 3 plots forward current against forward voltage for each color. The Red LED shows a lower forward voltage (typically ~2.0V at 150mA) compared to Green and Blue LEDs (typically ~3.2V-3.4V at 150mA). This is a critical parameter for driver design, as different drive voltages or current-limiting resistors are required for each color channel in an RGB system.

5.4 Current vs. Luminous Flux

Figure 4 shows the relationship between forward current and relative luminous flux. The output is generally linear with current in the normal operating range, but efficiency may drop at very high currents due to increased junction temperature and other effects.

5.5 Thermal Performance

Figure 5 is one of the most important graphs, showing relative luminous flux versus board temperature. It acts as a de-rating curve. The output decreases as temperature increases. The note specifies that the data is based on over 80% soldering coverage for good thermal contact and recommends not driving the LED when the board temperature exceeds 85°C to maintain performance and longevity.

5.6 Current vs. Dominant Wavelength

Figure 6 shows how the dominant wavelength shifts with forward current. Generally, wavelength increases slightly with current due to junction heating and other semiconductor physics effects. This is important for color-critical applications.

6. Binning and Classification System

The LEDs are sorted (binned) based on their luminous flux output at 150mA to ensure consistency.

6.1 Red LED Bins (R1 to R5)

Bins range from R1 (18-21 lm) to R5 (30-33 lm).

6.2 Green LED Bins (G1 to G7)

Bins range from G1 (35-39 lm) to G7 (59-63 lm).

6.3 Blue LED Bins (B1 to B4)

Bins range from B1 (6-9 lm) to B4 (15-18 lm).

A tolerance of +/-10% is applied to each luminous flux bin. The bin code is marked on each packing bag for traceability.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Profile

The device is compatible with lead-free reflow soldering. A detailed temperature-time profile is provided:

• Peak Temperature (T_P): 260°C max.
• Time above 217°C (T_L): 60-150 seconds.
• Time within 5°C of peak (t_P): 5 seconds max.
• Preheat: 150-200°C for 60-180 seconds.
• Ramp-up Rate: 3°C/sec max (from T_Smax to T_P).
• Ramp-down Rate: 6°C/sec max.
• Total cycle time: 8 minutes max from 25°C to peak.

7.2 Hand Soldering

If hand soldering is necessary, the recommended condition is a maximum iron temperature of 350°C for a maximum of 2 seconds per solder joint, for one time only.

7.3 Critical Notes for Assembly

• All temperature specifications refer to the top side of the package body.
• The profile may need adjustment based on specific solder paste characteristics.
• A rapid cooling (quenching) process from peak temperature is not recommended.
• Always use the lowest possible soldering temperature that achieves a reliable joint.
• The device is not guaranteed if assembled using the dip soldering method.

8. Recommended PCB Solder Pad Layout

A detailed solder pad design is provided with all dimensions in millimeters. The design ensures proper solder fillet formation and electrical isolation between the anode/cathode pads and any thermal pad or board metallization. Adhering to this layout is crucial for mechanical stability, electrical performance, and optimal thermal transfer from the LED die to the PCB.

9. Tape and Reel Packaging Specifications

The LEDs are supplied on tape and reel for automated assembly.

• Reel size: 7 inches.
• Quantity: 1000 pieces per full reel. Minimum packing quantity for remainders is 500 pieces.
• Pocket sealing: Empty component pockets are sealed with top cover tape.
• Quality: Maximum of two consecutive missing LEDs allowed.
• Standard: Packaging conforms to EIA-481-1-L23 specifications.

10. Reliability and Qualification Testing

Extensive reliability testing has been conducted on sample lots.

10.1 Test Conditions and Results

Tests were performed on 22 samples per condition with zero failures reported:

• High/Low/Room Temperature Operating Life (1000 hours each).
• High/Low Temperature Storage Life (500-1000 hours).
• Damp Heat (85°C/85% RH for 500 hours).
• Thermal Cycling (-40°C to 100°C, 100 cycles).
• Thermal Shock (-40°C to 100°C, 100 cycles).

10.2 Failure Criteria

A device is considered failed if, after testing, it exceeds one of the following limits when measured at I_F=150mA:

• Forward Voltage (V_f) > 110% of its initial value.
• Luminous Flux < 70% of its initial value.

11. Application Design Considerations

11.1 Driver Circuit Design

Due to the different forward voltages of the Red (lower V_f) and Green/Blue (higher V_f) LEDs, a typical RGB driver will use separate current-limiting circuits or a constant-current driver with independent channels. The maximum continuous current is 150mA per color. For pulsed operation (e.g., PWM dimming), ensure pulse parameters stay within the I_FP rating.

11.2 Thermal Management

Effective heat sinking is paramount. The data in Figure 5 clearly shows output declines with rising temperature. To maintain brightness and lifespan:

• Use the recommended solder pad layout with high thermal conductivity.
• Design the PCB with adequate copper area (thermal pads) connected to the LED's thermal path.
• Consider using thermal vias to transfer heat to inner layers or the back side of the board.
• In the final application, ensure adequate airflow or other cooling mechanisms if driving at high currents or in high ambient temperatures.
• Monitor board temperature and avoid exceeding 85°C.

11.3 Optical Design

The 120-degree viewing angle provides a wide, even beam suitable for general illumination and signage. For focused beams, secondary optics (lenses or reflectors) will be required. Designers should account for the different luminous intensities of each color when creating white light or specific color mixes.

12. Comparison and Product Positioning

The LTPL-P033RGB positions itself as a general-purpose, high-power RGB LED suitable for a broad spectrum of applications requiring color mixing or individual color output. Its key advantages include a standardized package, wide viewing angle, clear binning structure for consistency, and robust specifications for reliable manufacturing (reflow compatibility, tape & reel). It is designed to be a workhorse component for solid-state lighting designs displacing older technologies.

13. Frequently Asked Questions (Based on Technical Data)

Q: Can I drive all three colors (RGB) with the same constant voltage source and resistor?
A: Not optimally. The Red LED has a significantly lower forward voltage (~2.0V) than Green/Blue (~3.2V). Using one voltage would require different resistor values for each channel to achieve the same 150mA current. Using independent constant-current drivers or PWM channels is the recommended method for control and color mixing.

Q: What is the main cause of LED brightness degradation over time?
A: The primary cause is high junction temperature. Operating the LED above its recommended temperature range (see Figure 5) accelerates the aging process of the semiconductor materials and phosphors (if present), leading to a permanent drop in light output. Proper thermal management is the most critical factor for long-term reliability.

Q: How do I interpret the luminous flux bin code?
A: The code (e.g., R3, G5, B2) printed on the packing bag tells you the guaranteed minimum and maximum luminous output range for that specific LED at 150mA. This allows designers to select LEDs with matched brightness for uniform appearance in multi-LED fixtures or to guarantee a minimum light output for their design.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range (-30°C to +85°C) and the successful passing of damp heat (85°C/85% RH) testing indicate robustness against environmental factors. However, for prolonged outdoor exposure, the LED itself must be properly encapsulated or housed within a fixture that provides protection against moisture, UV radiation, and physical damage, as the LED package itself is not waterproof.

14. Practical Design Example: RGB Mood Light

Scenario: Designing a microcontroller-based RGB mood light with adjustable color and brightness.
Implementation:
1. Driver: Use a 3-channel constant-current LED driver IC or three separate MOSFETs controlled by the MCU's PWM outputs. Set the current limit to 150mA per channel.
2. Power Supply: Provide a stable DC voltage high enough to accommodate the highest V_f (Blue/Green ~3.8V max) plus the voltage drop across the current regulator.
3. Thermal Management: Mount the LED on a PCB with a solid copper pour connected to the thermal pad. If high duty cycles are used, consider adding a small heatsink to the back of the PCB.
4. Control: The MCU can independently adjust the PWM duty cycle for each color channel (Red, Green, Blue) from 0% to 100%. This allows the creation of millions of colors by mixing the primary outputs at different intensities.
5. Optics: Use a diffuser lens or cover over the LED to blend the three colored points into a single, uniform area of light.

15. Technology Background and Trends

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. The color of the light is determined by the energy bandgap of the semiconductor materials used. The LTPL-P033RGB uses individual dice for Red (likely based on AlInGaP materials) and for Green/Blue (based on InGaN materials) housed in a single package. The trend in power LEDs continues towards higher efficiency (more lumens per watt), improved color rendering, higher reliability, and lower cost. This device represents a mature, cost-effective solution for applications requiring versatile color output without the need for the extreme efficiency of the latest single-color high-power LEDs.