SMD Flash LED LTPL-C0677WPYB Datasheet - High Brightness - White Light - 1000mA - 6.3W Pulse - English Technical Document

1. Product Overview

The LTPL-C0677WPYB is a compact, high-power SMD (Surface-Mount Device) LED specifically engineered as a flash light source. Its primary design objective is to deliver exceptionally high luminous output in a miniaturized form factor. This enables the capture of higher-resolution images in low ambient light conditions and extends the effective flash range for imaging devices.

1.1 Key Features

• Highest Brightness SMD Flash LED: Engineered for maximum light output in pulse mode operation.
• Instant Turn-On: Provides immediate illumination with minimal delay, critical for flash photography.
• Very Small Emitter Size: The compact package allows for integration into space-constrained modern devices like smartphones.
• RoHS Compliant: Manufactured in compliance with the Restriction of Hazardous Substances directive.

1.2 Target Applications

• Camera phones and smartphones
• Handheld electronic devices with imaging capabilities
• Digital still cameras (DSC)
• Portable devices requiring high-intensity, short-duration illumination

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed analysis of the LED's operational limits and performance characteristics under specified conditions.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for extended periods, as it can adversely affect reliability.

• Power Dissipation (Pulse Mode): 6.3 W. This is the maximum allowable power the LED can handle in pulsed operation without exceeding its thermal limits.
• Pulsed Forward Current (50ms ON, 950ms OFF): 1500 mA. The peak current the LED can withstand in a pulsed duty cycle, crucial for flash applications.
• DC Forward Current: 350 mA. The maximum continuous forward current for steady-state operation.
• Junction Temperature (Tj): 125 °C. The maximum permissible temperature at the semiconductor junction.
• Electrostatic Discharge (ESD) Threshold (HBM): 8000 V. Indicates a relatively robust level of protection against electrostatic discharge according to the Human Body Model.
• Operating Temperature Range: -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature Range: -40°C to +100°C. The safe temperature range for storing the device when not in operation.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured under standard test conditions (Ta=25°C, 300ms pulse).

• Luminous Flux (ΦV): 260 lm (Min), 300 lm (Typ), 400 lm (Max) at I_FP = 1000mA. This quantifies the total visible light output, with a measurement tolerance of ±10%.
• Forward Voltage (V_F): 2.9 V (Min), 3.6 V (Typ), 4.2 V (Max) at I_FP = 1000mA. The voltage drop across the LED when operating, with a measurement tolerance of ±0.1V.
• Color Temperature (CCT): 5000 K to 6000 K at I_FP = 1000mA. This defines the white light shade, falling within the \"cool white\" range, suitable for flash photography.
• Viewing Angle (2θ_1/2): 120° (Typ). The angular span at which the luminous intensity is half of the maximum intensity (at 0°). A wide viewing angle is beneficial for even illumination.
• Reverse Current (I_R): 100 µA (Max) at V_R = 5V. The device is not designed for reverse operation; this parameter is for informational/test purposes only.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted (binned) based on key performance parameters. The LTPL-C0677WPYB uses a binning system for luminous flux and forward voltage.

3.1 Luminous Flux Binning

LEDs are categorized into bins based on their measured light output at 1000mA.

• Bin P4: Luminous Flux range from 260 lm to 315 lm.
• Bin Q0: Luminous Flux range from 315 lm to 400 lm.

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage drop at 1000mA.

• Bin 4: Forward Voltage range from 2.9 V to 3.8 V.
• Bin 5: Forward Voltage range from 3.8 V to 4.2 V.

This binning allows designers to select LEDs with closely matched electrical and optical properties for their specific application, ensuring uniform performance in multi-LED designs.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. All correlation data is based on the LED mounted on a 2cm x 2cm Metal Core PCB (MCPCB) acting as a heat sink.

4.1 Relative Spectral Power Distribution

The spectrum curve shows the intensity of light emitted across different wavelengths. For a white LED like this (using InGaN technology with a phosphor coating), the spectrum typically features a blue peak from the chip and a broader yellow/green/red emission from the phosphor, combining to produce white light.

4.2 Radiation Pattern

The polar diagram (Radiation Characteristics) visually represents the 120° typical viewing angle, showing how light intensity distributes spatially from the LED.

4.3 Forward Current vs. Relative Luminous Flux

This curve demonstrates that light output is not linearly proportional to current, especially at higher currents where efficiency may drop due to increased thermal effects.

4.4 Forward Current vs. Correlated Color Temperature (CCT) Shift

This graph is critical as it shows how the white point (color temperature) of the LED changes with drive current. For flash applications, minimizing CCT shift is important for consistent color rendering in photos.

4.5 Forward Current Derating Curve

Perhaps the most important curve for reliable design, it shows the maximum allowable pulsed forward current as a function of ambient temperature. As temperature increases, the maximum safe current decreases to prevent the junction temperature from exceeding 125°C. This curve must be strictly adhered to for long-term reliability.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED comes in a specific SMD package. All dimensions are in millimeters (mm) with a general tolerance of ±0.1mm unless otherwise noted. The package features a Yellow/White lens that emits InGaN-based White light. Detailed dimensional drawings are provided in the datasheet for PCB footprint design.

5.2 Recommended PCB Attachment Pad Layout

A suggested land pattern (footprint) for the PCB is provided to ensure proper soldering and thermal management. The recommendation includes a maximum stencil thickness of 0.10mm for solder paste application.

5.3 Polarity Identification

Standard SMD LED polarity markings apply (typically a cathode indicator on the package). The datasheet drawing should be consulted for the exact marking on this specific part.

6. Soldering and Assembly Guidelines

6.1 Recommended IR Reflow Profile (Pb-Free Process)

The LED is compatible with lead-free reflow soldering. A detailed profile is specified, aligned with J-STD-020D, including:

• Peak Temperature (T_P): 260°C maximum.
• Time above Liquidus (T_L = 217°C): 60 to 150 seconds.
• Ramp-Up and Ramp-Down Rates: Controlled to minimize thermal shock.

Critical Notes: A rapid cooling process is not recommended. The lowest possible soldering temperature that achieves a reliable joint is always desirable to minimize thermal stress on the LED. The device is not guaranteed if assembled using dip soldering methods.

6.2 Cleaning

If cleaning is necessary after soldering, only specified chemicals should be used. The LED can be immersed in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. The use of unspecified chemicals can damage the package material or optics.

7. Packaging and Handling

7.1 Tape and Reel Specifications

The LEDs are supplied in standard embossed carrier tape on reels for automated pick-and-place assembly. Key specifications include:

• Reel Size: 7-inch reel.
• Quantity per Reel: 3000 pieces (standard full reel).
• Minimum Order Quantity (MOQ): 500 pieces for remnants.
• The packaging complies with EIA-481 specifications. The tape is sealed with a top cover, and a maximum of two consecutive missing components (empty pockets) is allowed.

Detailed dimensional drawings for both the carrier tape and the reel are provided in the datasheet.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

This high-current flash LED requires a dedicated driver circuit. Typical implementations use a switched-mode power supply (like a boost converter) to generate the high pulse current from a low-voltage battery (e.g., 3.7V Li-ion). The driver must be capable of delivering very short, high-current pulses (up to 1500mA for 50ms or less) while managing inrush current and providing over-current protection.

8.2 Thermal Management

Effective heat sinking is paramount. Even during short pulses, significant heat is generated. The recommendation to mount the LED on a 2cm x 2cm MCPCB is a minimum guideline. For high-duty-cycle applications or operation in high ambient temperatures, more substantial thermal management (larger PCB copper area, thermal vias, or an external heatsink) is necessary to keep the junction temperature within safe limits, as defined by the derating curve.

8.3 Optical Design

The 120° viewing angle provides broad illumination. For applications requiring a more focused beam (e.g., to increase throw distance), a secondary optic (reflector or lens) can be placed over the LED. The small emitter size is advantageous for achieving tight optical control.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other models is not provided in this standalone datasheet, the LTPL-C0677WPYB's key differentiators can be inferred from its specifications:

• High Pulse Current Capability (1500mA): Enables very high instantaneous brightness, which is the primary metric for a flash LED.
• High Luminous Flux (up to 400 lm): Places it in the high-brightness category for SMD flash LEDs.
• Compact SMD Package: Offers a significant advantage over larger, through-hole flash LEDs in space-constrained mobile devices.
• Wide Viewing Angle (120°): Provides even scene illumination compared to narrower-angle LEDs, reducing hotspots in images.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this LED with a constant 1000mA DC current?

Answer: No. The Absolute Maximum Rating for DC forward current is 350 mA. The 1000mA value is for pulsed operation under a specific test condition (300ms pulse, likely with low duty cycle) or as a peak pulse rating (50ms ON). Continuous operation at 1000mA would exceed the power dissipation and junction temperature limits, leading to rapid failure.

10.2 Why is the forward voltage binning important for my design?

Answer: If you are driving multiple LEDs in parallel from the same current source, differences in forward voltage (V_F) will cause an uneven distribution of current. LEDs with a lower V_F will draw more current than those with a higher V_F, leading to differences in brightness and potentially overstressing the lower-V_F units. Using LEDs from the same V_F bin ensures more uniform current sharing and performance.

10.3 What is the purpose of the \"Time above Liquidus\" in the reflow profile?

Answer: This is the time the solder joints spend above the melting point of the solder paste (217°C for lead-free). A sufficient time (60-150s here) ensures proper wetting and formation of a reliable metallurgical bond between the LED's solder pads and the PCB. Too little time can cause cold solder joints; too much time increases thermal stress on the component.

11. Practical Design and Usage Case

Scenario: Integrating into a Smartphone Flash Module

A design engineer is tasked with adding a high-quality flash to a new smartphone model. The LTPL-C0677WPYB is selected for its high output and small size. The engineer must:

1. Driver Selection: Choose a flash LED driver IC that can deliver the required 1000-1500mA pulse from the phone's 3.8V battery, with control via the phone's camera processor (I2C or similar).
2. PCB Layout: Design the PCB footprint exactly per the datasheet's recommended pad layout. They will create a dedicated small MCPCB (2cm x 2cm or larger) for the LED to act as a heat spreader, which will then be connected to the phone's internal frame for additional thermal dissipation.
3. Optical Integration: Work with the mechanical design team to create a light guide or diffuser that evenly spreads the 120° beam from the LED across the flash window on the phone's exterior, ensuring no visible hotspots.
4. Firmware: Program the camera software to trigger the flash driver with pulse durations that stay within the 50ms maximum ON time for high-current pulses, managing the duty cycle to prevent overheating during burst photo modes.

12. Operating Principle Introduction

The LTPL-C0677WPYB is a solid-state light source based on semiconductor physics. It utilizes an Indium Gallium Nitride (InGaN) chip that emits blue light when electrons recombine with holes across the chip's p-n junction under forward bias (electroluminescence). This blue light is then partially converted to longer wavelengths (yellow, green, red) by a phosphor coating deposited on or near the chip. The mixture of the remaining blue light and the phosphor-converted light results in the perception of white light. The specific ratios of the phosphor determine the correlated color temperature (CCT), which is tuned here to the 5000-6000K \"cool white\" range preferred for flash photography to match daylight conditions.

13. Technology Trends and Context

High-power SMD flash LEDs represent a key trend in optoelectronics, driven by the miniaturization of consumer electronics, particularly smartphones. The evolution focuses on:

• Increasing Luminous Efficacy (lm/W): Delivering more light output for the same electrical input power, improving battery life.
• Higher Peak Current and Lumen Output: Enabling better low-light photography and features like \"night mode\".
• Improved Color Rendering: Developing phosphors that produce light spectra closer to natural daylight (high CRI - Color Rendering Index), leading to more accurate colors in photos, even though CRI is not specified in this particular datasheet.
• Dual-Tone Flash: A market trend where two LEDs with different CCTs (e.g., a cool white and a warm white) are used together to allow the camera system to adjust the flash color temperature for more pleasing skin tones and ambient light matching. While this datasheet is for a single-CCT LED, the technology exists within the same product families.
• Integration with Sensors: Flash LEDs are increasingly part of a system that includes ambient light sensors and proximity sensors, allowing for adaptive brightness and turning off the flash when an object is too close.