CHIN Series LED ELCH06-BJ4J6Z10-N0 Datasheet - High Power White LED - 200lm @ 1000mA - 6000K CCT - 2.04x1.64mm Package - English Technical Document

1. Product Overview

The CHIN Series ELCH06-BJ4J6Z10-N0 is a high-power, surface-mount LED designed for applications requiring high luminous output and efficiency. It utilizes InGaN semiconductor technology to produce white light. The device is characterized by its compact package, high luminous flux, and robust performance under pulsed operation, making it suitable for demanding lighting and illumination tasks.

1.1 Core Advantages and Target Market

The primary advantages of this LED include a high typical luminous flux of 200 lumens at a drive current of 1000mA, resulting in an optical efficiency of approximately 54 lumens per watt. It features built-in ESD protection rated up to 8kV, enhancing its reliability in handling. With a Moisture Sensitivity Level (MSL) of Class 1, it offers good shelf life and is suitable for standard SMT assembly processes. The device is RoHS compliant and lead-free. Its key target markets are mobile device camera flashes (strobe lights), digital video torch lights, general indoor and decorative lighting, TFT backlighting, and various automotive interior and exterior illumination applications.

2. Technical Parameter Deep-Dive

This section provides a detailed, objective analysis of the device's key technical specifications as defined in the datasheet.

2.1 Absolute Maximum Ratings

The device's operational limits are critical for reliable design. The maximum continuous DC forward current (IF) is 350 mA. However, it can handle a peak pulse current (IPulse) of 1500 mA under specific conditions: a pulse width of 400ms followed by an off-time of 3600ms, or with a maximum duration of 50ms and a duty cycle not exceeding 10%. The maximum junction temperature (TJ) is 125°C, with a thermal resistance from junction to case (Rs) of 10 °C/W. The operating temperature range is from -40°C to +85°C. It is crucial to note that the LED is not designed for reverse bias operation. Exceeding these ratings, especially simultaneously or for prolonged periods, may cause permanent damage or reliability issues.

2.2 Electro-Optical Characteristics

Measured at a solder pad temperature of 25°C under pulsed conditions (50ms pulse), the key performance parameters are defined. The luminous flux (Фv) has a typical value of 200 lm, with a minimum of 160 lm and a maximum of 250 lm at 1000mA, subject to a ±10% measurement tolerance. The forward voltage (VF) at 1000mA ranges from a minimum of 2.95V to a maximum of 4.45V, with a measurement tolerance of ±0.1V. A special low-current, low-voltage parameter is specified: at 10 µA, the VF is typically 2.0V. The correlated color temperature (CCT) is typically 6000K, with a range from 4500K to 7000K.

3. Binning System Explanation

The device is supplied within specific performance bins to ensure consistency in application.

3.1 Forward Voltage Binning

The forward voltage is categorized into five bins, each covering a 0.3V range, measured at IF=1000mA. The bin codes and their corresponding voltage ranges are: 2932 (2.95V - 3.25V), 3235 (3.25V - 3.55V), 3538 (3.55V - 3.85V), 3841 (3.85V - 4.15V), and 4144 (4.15V - 4.45V).

3.2 Luminous Flux Binning

The luminous flux is binned into three categories at IF=1000mA: J4 (160 lm - 180 lm), J5 (180 lm - 200 lm), and J6 (200 lm - 250 lm). The part number ELCH06-BJ4J6Z10-N0 indicates a J6 flux bin.

3.3 White Color Binning

The white color point is defined within specific chromaticity coordinates on the CIE 1931 diagram, grouped into three correlated color temperature (CCT) bins: Bin (1) for 4550K (4500K-5000K range), Bin (2) for 5057K (5000K-5700K range), and Bin (3) for 5770K (5700K-7000K range). The color coordinate measurement allowance is ±0.01. The part number suggests the device falls within a specific white bin structure.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are essential for understanding the device's behavior under different operating conditions.

4.1 Spectral Distribution and Radiation Pattern

The relative spectral distribution curve shows a broad emission spectrum typical of phosphor-converted white LEDs, with a peak in the blue region (from the InGaN chip) and a broad yellow phosphor emission. The typical radiation pattern is Lambertian, meaning the luminous intensity is proportional to the cosine of the viewing angle, resulting in a wide, even beam. The viewing angle (2θ1/2) is 120 degrees with a tolerance of ±5 degrees.

4.2 Forward Voltage vs. Current and Luminous Flux vs. Current

The forward voltage increases with current, which is characteristic of diode behavior. Designers must account for this to ensure proper driver design and thermal management. The luminous flux output increases sub-linearly with forward current. While driving at higher currents yields more light, it also generates more heat, which can reduce efficiency and longevity. The curve shows the relative luminous flux scaling with current up to 1500mA.

4.3 Color Temperature vs. Current and Current Derating

The correlated color temperature (CCT) may shift slightly with drive current, typically increasing as current rises. This is an important consideration for color-critical applications. The forward current derating curve is crucial for thermal design. It shows the maximum allowable continuous forward current as a function of the solder pad temperature. To maintain the junction temperature below its maximum of 125°C, the drive current must be reduced as the ambient or board temperature increases. For example, at a solder pad temperature of 100°C, the maximum allowable continuous current is significantly lower than at 25°C.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a compact surface-mount package. Key dimensions from the top view drawing include an overall package size of approximately 2.04 mm in length and 1.64 mm in width. The optical center is located relative to the package edges. The chip position is indicated, along with the separate anode and cathode pads for electrical connection. All dimensions are in millimeters, with standard tolerances of ±0.1mm unless otherwise specified.

5.2 Pad Design and Polarity Identification

The package features two clearly defined solder pads. The anode and cathode pads are distinctly separated. Proper polarity identification is essential during assembly to prevent reverse connection, as the device is not designed for reverse bias. The dimensional drawing provides the exact pad geometry and spacing, which is critical for PCB land pattern design to ensure good solder joint formation and mechanical stability.

6. Soldering and Assembly Guidelines

The device is rated for reflow soldering with a maximum soldering temperature (TSol) of 260°C. It is qualified for a maximum of two allowable reflow cycles, which is standard for most SMT components. The Moisture Sensitivity Level (MSL) is Class 1, meaning the device can be stored indefinitely at conditions ≤30°C / 85% RH without requiring baking before reflow. This simplifies logistics and handling compared to higher MSL components. When operating the LED, it is advised to avoid exceeding the maximum operating temperature for more than one hour continuously to ensure long-term reliability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

• Mobile Phone Camera Flash: The high pulsed current capability (1500mA) and high luminous flux make it ideal for camera flash/strobe applications in mobile devices. Design must focus on managing the high instantaneous power dissipation.
• Torch Light for DV: Suitable for constant or variable brightness torch applications in digital video equipment, requiring stable color and output.
• General Lighting: Can be used in arrays for indoor lighting, decorative lighting, or architectural accent lighting. Thermal management on the PCB (MCPCB - Metal Core PCB) is paramount for array designs.
• TFT Backlighting: Its high brightness and small size allow it to be used in direct-lit or edge-lit backlight units, potentially with light guides.
• Automotive Lighting: For interior map lights, door lights, or exterior auxiliary lights, considering the wide operating temperature range.

7.2 Critical Design Considerations

• Thermal Management: This is the single most important factor. The datasheet notes that for 1500mA operation, all reliability tests were conducted under "good thermal management" using a 1.0x1.0 cm² MCPCB. Designers must provide an adequate thermal path from the solder pads to a heatsink. The 10 °C/W junction-to-case thermal resistance indicates that heat must be effectively conducted away from the package.
• Current Driving: Use a constant current driver, not a constant voltage source, to ensure stable light output and prevent thermal runaway. Carefully observe the absolute maximum ratings for both DC and pulse currents.
• Optical Design: The Lambertian radiation pattern provides a wide beam. For focused applications, secondary optics (lenses, reflectors) will be required. The location of the optical center is provided in the mechanical drawing for optical alignment.
• ESD Protection: While the device has 8kV ESD protection, standard ESD handling precautions during assembly are still recommended.

8. Technical Comparison and Differentiation

While a direct comparison requires specific competitor data, key differentiating features of this LED can be inferred from its specifications. The combination of a relatively high luminous flux (200 lm) from a compact 2.04x1.64mm package is a significant advantage for space-constrained applications like mobile phones. The specified 8kV ESD protection is a robust feature that may exceed offerings from some competitors, enhancing assembly yield and field reliability. The detailed binning structure for flux, voltage, and color provides designers with predictable performance, which is critical for mass production where consistency is key. The ability to handle high pulse currents (1500mA) specifically tailors it for camera flash applications, a segment with stringent requirements.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED continuously at 1000mA?
A: The datasheet specifies the electro-optical characteristics at 1000mA under a 50ms pulse condition. The maximum continuous DC current rating is 350 mA. Therefore, continuous operation at 1000mA exceeds the absolute maximum rating and is not recommended, as it would likely overheat and damage the LED. For high-brightness continuous operation, the current must be derated according to the thermal derating curve based on the actual solder pad temperature.

Q: What does the "Low current low VF@10 µA" parameter mean?
A: This parameter indicates the typical forward voltage when a very small current (10 microamperes) is applied. It is useful for circuit designers who might use a small current to detect the presence of the LED or for very low-power standby indicator scenarios. It is significantly lower than the VF at operating currents.

Q: How do I interpret the part number ELCH06-BJ4J6Z10-N0?
A: While the full naming convention isn't explicitly detailed, based on the binning tables, "J6" likely refers to the luminous flux bin (200-250 lm), and other segments may encode the color temperature bin, forward voltage bin, and other product variants. The "CHIN Series" and "ELCH06" prefix identify the product family.

Q: Why is the reliability test based on 1000 hours with less than 30% IV degradation?
A: This is a standard industry reliability benchmark for LEDs. It indicates that after 1000 hours of operation under specified test conditions, the luminous flux degradation is guaranteed to be less than 30%. This parameter helps estimate the lumen maintenance and lifetime of the product in actual use.

10. Practical Design and Usage Case

Case: Designing a Mobile Phone Camera Flash Module
A designer is tasked with integrating a high-power flash into a smartphone. They select the ELCH06-BJ4J6Z10-N0 for its high pulsed output and small size. The design process involves:
1. PCB Layout: Creating a thermal land pattern on the PCB that matches the LED's solder pads, using large thermal vias to connect to an internal copper layer or a dedicated metal substrate for heat spreading.
2. Driver Circuit: Implementing a switched-mode or capacitor-based driver circuit capable of delivering the required 1500mA pulse for 400ms, with appropriate control logic from the phone's camera processor.
3. Optical Element: Designing or selecting a plastic lens or diffuser placed over the LED to widen or shape the beam pattern to adequately illuminate the camera's field of view, ensuring the optical center of the LED aligns with the lens.
4. Thermal Simulation: Running thermal simulations to ensure the phone casing and internal components do not overheat during repeated flash usage, potentially implementing software limits on flash duration or frequency.
5. Testing: Verifying light output, color consistency, and reliability under high-temperature chamber conditions to simulate real-world usage.

11. Operating Principle Introduction

The ELCH06-BJ4J6Z10-N0 is a phosphor-converted white LED. Its core is a semiconductor chip made of Indium Gallium Nitride (InGaN), which emits light in the blue spectrum when electrical current passes through it (electroluminescence). This blue light is not used directly. Instead, it strikes a layer of phosphor material (typically Yttrium Aluminum Garnet doped with Cerium, or YAG:Ce) that is deposited on or around the chip. The phosphor absorbs a portion of the blue photons and re-emits light at longer wavelengths, primarily in the yellow region. The combination of the remaining unabsorbed blue light and the emitted yellow light mixes to produce the perception of white light. The exact shade of white (correlated color temperature) is determined by the ratio of blue to yellow light, which is controlled by the phosphor composition and thickness. This technology allows for the efficient generation of high-quality white light from a solid-state device.

12. Technology Trends and Context

This device exists within the broader trend of solid-state lighting (SSL) replacing traditional light sources. Key relevant trends include:
Increasing Efficiency (lm/W): While this LED offers 54 lm/W, the industry continues to push for higher efficacies, reducing energy consumption for the same light output.
Color Quality and Consistency: There is a growing emphasis on high Color Rendering Index (CRI) and tighter color binning for applications where accurate color reproduction is vital, such as retail lighting or photography.
Miniaturization and High Flux Density: The drive to pack more light into smaller packages, as seen with this LED, continues for applications like mobile devices, automotive headlamps, and ultra-thin displays.
Reliability and Lifetime: Improvements in materials, packaging, and thermal management are constantly extending LED lifetimes and lumen maintenance, making them suitable for more critical and long-life applications.
Smart and Connected Lighting: LEDs are the enabling technology for digitally controllable lighting systems. While this is a component-level device, it forms the basis for systems that can adjust brightness and color dynamically.