Select Language

T5C Series 5050 White LED Datasheet - Size 5.0x5.0x1.9mm - Voltage 6.4V - Power 5.12W - English Technical Document

Detailed technical specifications for the T5C series 5050 high-power white LED, including electro-optical characteristics, binning structure, package dimensions, and reflow soldering guidelines.
smdled.org | PDF Size: 0.8 MB
Rating: 4.5/5
Your Rating
You have already rated this document
PDF Document Cover - T5C Series 5050 White LED Datasheet - Size 5.0x5.0x1.9mm - Voltage 6.4V - Power 5.12W - English Technical Document

1. Product Overview

The T5C series represents a high-performance, top-view white LED designed for demanding general lighting applications. This 5050 package (5.0mm x 5.0mm) utilizes a thermally enhanced design to manage heat effectively, enabling stable operation at high drive currents. Its primary advantages include a high luminous flux output, wide viewing angle, and compatibility with lead-free reflow soldering processes, making it suitable for modern, automated assembly lines. The product is RoHS compliant, aligning with global environmental standards. Target markets encompass architectural and decorative lighting, retrofit solutions for existing fixtures, general illumination, and backlighting for both indoor and outdoor signage.

2. Technical Parameter Deep Dive

2.1 Electro-Optical Characteristics

Key performance is measured at a junction temperature (Tj) of 25°C and a forward current (IF) of 800mA. The luminous flux varies with Correlated Color Temperature (CCT). For a 2700K LED with a Color Rendering Index (CRI or Ra) of 80, the typical luminous flux is 645 lumens, with a minimum of 600 lumens. For CCTs from 3000K to 6500K (all at Ra80), the typical flux is between 680 and 710 lumens, with minimums ranging from 600 to 650 lumens. Tolerances are ±7% for luminous flux and ±2 for CRI.

2.2 Electrical & Thermal Parameters

The Absolute Maximum Ratings define the operational limits. The maximum continuous forward current (IF) is 960mA, with a pulsed current (IFP) of 1440mA under specific conditions (pulse width ≤100μs, duty cycle ≤1/10). Maximum power dissipation (PD) is 6720mW. The device can operate in ambient temperatures from -40°C to +105°C and withstand junction temperatures up to 120°C.

Under typical operating conditions (IF=800mA, Tj=25°C), the forward voltage (VF) is 6.4V typical, with a range from 6.0V to 7.0V (±0.2V tolerance). The viewing angle (2θ1/2) is a wide 120 degrees. A critical parameter is the thermal resistance from the junction to the solder point (Rth j-sp), which is typically 2.5°C/W. This low value is indicative of the package's efficient heat transfer capability to the mounting PCB.

3. Binning System Explanation

3.1 Part Numbering

The part number follows a structured code: T □□ □□ □ □ □ □ – □ □□ □□ □. Key positions indicate: Type (e.g., 5C for 5050), CCT (e.g., 27 for 2700K), CRI (e.g., 8 for Ra80), number of serial and parallel chips, component code, and color code defining the chromaticity standard (e.g., R for 85°C ANSI).

3.2 Luminous Flux Binning

LEDs are sorted into flux bins denoted by two-letter codes (e.g., GN, GP, GQ, GR). For example, a 4000K LED with Ra82 can be binned as GP (650-700 lm), GQ (700-750 lm), or GR (750-800 lm). This allows designers to select components based on precise brightness requirements for consistency in their application.

3.3 Forward Voltage Binning

Voltage is also binned to ensure electrical consistency. Codes like B4, C4, D4, E4, and F4 represent voltage ranges from 6.0-6.2V up to 6.8-7.0V, in 0.2V steps. Matching voltage bins can be important for driving multiple LEDs in series to ensure uniform current distribution.

3.4 Chromaticity Binning

The color consistency is tightly controlled within a 5-step MacAdam ellipse for each CCT. The datasheet provides the center chromaticity coordinates (x, y) at both 25°C and 85°C junction temperatures, along with ellipse parameters (a, b, Φ). This ensures minimal visible color variation between LEDs from the same bin, even under different operating temperatures. The standard follows Energy Star binning for CCTs from 2600K to 7000K.

4. Performance Curve Analysis

4.1 Spectral Distribution

While the exact spectral power distribution (SPD) graph is not detailed in the provided text, it is a standard feature showing the relative intensity across wavelengths for a white LED. Typically, a white LED using a blue chip with phosphor conversion shows a dominant blue peak and a broader yellow phosphor emission band. The exact shape determines the CCT and CRI.

4.2 Viewing Angle Distribution

The provided polar diagram (Fig 2) illustrates the luminous intensity as a function of angle from the central axis. With a stated 120-degree viewing angle, the curve will show a near-Lambertian or batwing pattern, indicating how light is distributed spatially. This is crucial for designing optics for specific beam patterns.

5. Mechanical & Package Information

5.1 Dimensions and Polarity

The package is a 5050 form factor with dimensions of 5.00mm x 5.18mm in footprint and a height of approximately 1.90mm. The soldering pad pattern is clearly defined, with separate anode and cathode pads. A polarity mark (likely a cut corner or a marking on the package) identifies the cathode. All unspecified tolerances are ±0.1mm.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is suitable for lead-free reflow soldering. The recommended profile includes: a preheat from 150°C to 200°C over 60-120 seconds, a ramp-up to peak temperature at a maximum rate of 3°C/sec, a time above liquidus (217°C) of 60-150 seconds, a peak package body temperature (Tp) not exceeding 260°C, and a time within 5°C of Tp of less than 30 seconds. The total time from 25°C to peak temperature should not exceed 8 minutes. Adherence to this profile is critical to prevent thermal damage to the LED die, phosphor, and package.

7. Packaging & Ordering Information

The LEDs are supplied on tape and reel for automated placement. Each reel can contain a maximum of 2000 pieces. The tape dimensions ensure compatibility with standard pick-and-place equipment. The cumulative tolerance over 10 pitches is ±0.2mm. The reel packaging includes labels with the part number (P/N) and manufacturing date.

8. Application Recommendations

8.1 Typical Application Scenarios

This high-power LED is ideal for: Architectural Lighting: Facade washing, cove lighting, and accent lighting where high output and good color rendering are needed. Retrofit Lamps: Direct replacement for traditional light sources in downlights, track lights, and panel lights. General Lighting: High-bay lighting, industrial lighting, and commercial fixtures. Signage Backlighting: Illuminating channel letters, light boxes, and informational displays, both indoors and outdoors.

8.2 Design Considerations

Thermal Management: The key to longevity and maintaining light output. Use an MCPCB (Metal Core Printed Circuit Board) with adequate thermal vias and consider the overall heat sink design to keep the junction temperature well below the 120°C maximum. The low Rth j-sp of 2.5°C/W helps, but system-level design is paramount. Drive Current: While rated for up to 960mA, operating at 800mA or lower will improve efficacy and lifespan. Use a constant current driver suitable for the LED's forward voltage. Optics: The 120-degree viewing angle provides a wide beam. Secondary optics (lenses, reflectors) can be used to collimate or shape the light as required by the application.

9. Technical Comparison & Differentiation

Compared to standard mid-power LEDs (e.g., 2835, 3030), this 5050 package offers significantly higher single-point luminous flux, reducing the number of components needed for a given light output. Its thermally enhanced design allows it to sustain higher drive currents than older 5050 packages. The comprehensive binning (flux, voltage, chromaticity) provides superior color and brightness consistency critical for professional lighting applications, setting it apart from commodity-grade LEDs with looser tolerances.

10. Frequently Asked Questions (FAQs)

Q: What is the typical power consumption of this LED?
A: At the typical operating point of 800mA and 6.4V, the power is approximately 5.12 Watts (P = I*V).

Q: How does temperature affect performance?
A: As junction temperature increases, luminous flux typically decreases, and the forward voltage drops slightly. The chromaticity coordinates also shift, as noted in the binning table. Proper heat sinking mitigates these effects.

Q: Can I drive this LED with a constant voltage source?
A: It is strongly discouraged. LEDs are current-driven devices. A constant voltage source with a simple series resistor is inefficient and offers poor current regulation over temperature and component variations. Always use a dedicated constant current LED driver.

Q: What is the meaning of the "5-step MacAdam ellipse"?
A: It defines an area on the chromaticity diagram. LEDs whose color points fall within the same 5-step ellipse are considered to have no perceptible color difference to the average human eye under standard viewing conditions. Smaller step numbers (e.g., 3-step, 2-step) indicate even tighter color matching.

11. Practical Use Case Example

Scenario: Designing a High-Quality 4000K LED Panel Light.
A designer aims for a panel light with 3000 lumens output and uniform color. Using the 5050 LED binned in GR (750-800 lm min) at 4000K and Ra82, they would need approximately 4 LEDs (3000 lm / 750 lm per LED = 4). They would select all LEDs from the same flux bin (GR) and voltage bin (e.g., C4 for 6.2-6.4V) to ensure consistent brightness and electrical behavior. The LEDs would be mounted on a large, thermally conductive MCPCB acting as a heat spreader, which is then attached to the metal frame of the panel light. A constant current driver capable of delivering 800mA to the series string of 4 LEDs (total forward voltage ~25.6V) would be selected. Secondary diffusers would be used to blend the light from the four discrete sources into a uniform panel.

12. Operating Principle

This is a phosphor-converted white LED. The core is a semiconductor chip (typically indium gallium nitride) that emits blue light when electrical current passes through it. This blue light strikes a layer of phosphor material (e.g., yttrium aluminum garnet doped with cerium - YAG:Ce) deposited on or near the chip. The phosphor absorbs a portion of the blue light and re-emits it as a broad spectrum of yellow light. The mixture of the remaining blue light and the converted yellow light appears white to the human eye. The exact ratio of blue to yellow, and the specific phosphor composition, determines the Correlated Color Temperature (CCT) of the emitted white light.

13. Technology Trends

The general trend in LED technology is towards higher efficacy (more lumens per watt), improved color rendering (higher CRI and better R9 values for red saturation), and greater reliability at higher operating temperatures. There is also a move towards more compact packages that can deliver the same or higher flux, as seen in the evolution from 5050 to 3535 and even smaller footprints for high-power applications. Furthermore, tunable white LEDs, which can vary CCT, are becoming more prevalent for human-centric lighting applications. The drive for sustainability continues to push for higher efficiency and longer lifetimes, reducing the total cost of ownership and environmental impact.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.