T5C Series 5050 White LED Datasheet - Size 5.0x5.0x1.9mm - Voltage 25V - Power 4W - English Technical Document

1. Product Overview

The T5C series represents a high-performance, top-view white LED designed for demanding general lighting applications. Utilizing a thermally enhanced package, this 5050-sized component delivers high luminous flux output and is capable of handling elevated drive currents. Its compact form factor and wide viewing angle make it suitable for a variety of illumination designs where space and efficiency are critical. The product is compliant with Pb-free reflow soldering processes and adheres to RoHS standards, ensuring environmental responsibility in manufacturing and end-use.

1.1 Target Applications

This LED is engineered for broad applicability in the lighting sector. Primary use cases include interior lighting for residential and commercial spaces, retrofitting existing fixtures to LED technology, general purpose illumination, and architectural or decorative lighting where both performance and aesthetics are important. Its robust design supports reliable operation in these diverse environments.

2. Technical Parameter Analysis

A deep understanding of the device's parameters is essential for optimal system design. The following sections break down the key electrical, optical, and thermal characteristics.

2.1 Electro-Optical Characteristics

Under standard test conditions (Forward Current, IF = 160mA and Junction Temperature, Tj = 25°C), the LED exhibits specific performance metrics correlated with its Correlated Color Temperature (CCT) and Color Rendering Index (Ra). For instance, a 4000K LED with Ra70 has a typical luminous flux of 655 lumens (lm), with a minimum specified value of 600 lm. As CCT decreases (e.g., to 2700K) or color rendering increases (e.g., to Ra90), the typical luminous flux output generally decreases, reflecting the trade-offs in phosphor technology. All luminous flux measurements have a tolerance of ±7%, while Ra measurements have a tolerance of ±2.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. The absolute maximum forward current (IF) is 240 mA, with a pulsed forward current (IFP) of 360 mA under specific conditions (pulse width ≤ 100µs, duty cycle ≤ 1/10). The maximum power dissipation (PD) is 6480 mW. The device can withstand a reverse voltage (VR) of up to 5V. The operating temperature range (Topr) is from -40°C to +105°C, and the storage temperature range (Tstg) is from -40°C to +85°C. The maximum allowable junction temperature (Tj) is 120°C. For assembly, the soldering temperature (Tsld) is specified for reflow processes: 230°C or 260°C for a maximum of 10 seconds.

2.3 Electrical/Optical Characteristics at Tj=25°C

This section details typical operating parameters. The forward voltage (VF) ranges from a minimum of 23V to a maximum of 27V, with a typical value of 25V at IF=160mA (±3% tolerance). The reverse current (IR) is a maximum of 10 µA at VR=5V. The viewing angle (2θ1/2), defined as the off-axis angle where intensity is half the peak value, is typically 120 degrees. A critical parameter for thermal management is the thermal resistance from the LED junction to the solder point on an MCPCB (Rth j-sp), which is typically 2.5 °C/W. The device has an Electrostatic Discharge (ESD) withstand level of 1000V (Human Body Model).

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins. The T5C series uses a multi-dimensional binning system covering luminous flux, forward voltage, and chromaticity.

3.1 Luminous Flux Binning

LEDs are grouped based on their measured luminous flux at 160mA. Each CCT and CRI combination has specific flux bins denoted by two-letter codes (e.g., GL, GM, GN). For example, a 4000K Ra70 LED can be binned as GN (600-650 lm min), GP (650-700 lm), GQ (700-750 lm), or GR (750-800 lm). Higher CRI versions (Ra90) for the same CCT typically have lower flux bins, starting at GK (450-500 lm). This allows designers to select the appropriate brightness grade for their application.

3.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design for current regulation. The bins are coded as 6D (22-24V), 6E (24-26V), and 6F (26-28V), all measured at IF=160mA. Knowing the VF bin helps in calculating power supply requirements and thermal load more accurately.

3.3 Chromaticity Binning (Color Consistency)

The LEDs are binned within a 5-step MacAdam ellipse on the CIE chromaticity diagram, which is a standard for defining perceptible color differences. Each CCT (e.g., 2700K, 3000K) has a defined center coordinate (x, y) and an ellipse defined by parameters (a, b, Φ). For instance, the 4000K bin (40R5) is centered at x=0.3875, y=0.3868. This tight binning ensures that LEDs from the same bin will appear nearly identical in color to the human eye, which is crucial for multi-LED fixtures. The Energy Star binning standard is applied to all products from 2600K to 7000K.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions.

4.1 Spectral Distribution

The datasheet includes color spectra for Ra70, Ra80, and Ra90 versions. These graphs show the relative intensity across wavelengths. Higher CRI LEDs (Ra90) typically exhibit a more filled-in spectrum, especially in the red region, compared to Ra70 LEDs, which accounts for their better color rendering but often slightly lower overall efficacy.

4.2 Viewing Angle and Intensity

The viewing angle distribution plot confirms the wide, typically Lambertian, emission pattern with a 120-degree half-angle. This provides even illumination over a broad area, suitable for general lighting.

4.3 Current vs. Characteristics

The Forward Current vs. Relative Intensity curve shows how light output increases with current, typically in a sub-linear fashion at higher currents due to efficiency droop. The Forward Current vs. Forward Voltage curve illustrates the diode's exponential V-I relationship, which is vital for designing constant-current drivers.

4.4 Temperature Dependence

Key plots illustrate performance changes with ambient temperature (Ta). The Ambient Temperature vs. Relative Luminous Flux curve shows light output decreasing as temperature rises, a critical factor for thermal management. The Ambient Temperature vs. Relative Forward Voltage curve shows VF decreasing with increasing temperature (negative temperature coefficient). The Ta vs. CIE x, y Shift plot demonstrates how the emitted color point can drift with temperature. Finally, the Maximum Forward Current vs. Ambient Temperature graph defines the derating line; as ambient temperature increases, the maximum allowable drive current must be reduced to prevent exceeding the junction temperature limit.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a 5050 footprint, meaning its package dimensions are approximately 5.0mm x 5.0mm. The overall height is 1.9mm. Detailed mechanical drawings show the top and bottom views, including the lens shape and pad layout. Critical dimensions include pad sizes and spacings, which are essential for PCB layout design to ensure proper soldering and thermal conduction.

5.2 Soldering Pad Design and Polarity

The bottom view clearly indicates the anode and cathode pads. The soldering pattern is designed for stability and effective heat transfer away from the LED die. The cathode is typically marked or has a specific pad shape (e.g., a notch or a larger pad) for identification. The datasheet specifies the recommended solder pad dimensions on the PCB to achieve a reliable solder joint and optimal thermal performance.

6. Soldering and Assembly Guidelines

The device is suitable for Pb-free reflow soldering. The maximum soldering temperature profile is specified: peak temperatures of 230°C or 260°C should not be exceeded for more than 10 seconds. It is crucial to follow recommended reflow profiles to avoid thermal shock or damage to the LED package and internal materials. Precautions include avoiding mechanical stress during placement and ensuring the PCB and LED are clean and free of moisture before soldering (consider baking if necessary). Storage should be in a dry, controlled environment within the specified temperature range (-40°C to +85°C).

7. Ordering Information and Model Numbering

The part number follows a structured system: T5C***81C-R****. A detailed breakdown explains each segment (X1 to X10). Key selectable parameters include: Type Code (X1, e.g., '5C' for 5050), CCT Code (X2, e.g., '40' for 4000K), Color Rendering Code (X3, e.g., '8' for Ra80), number of serial and parallel chips (X4, X5), and a Color Code (X7) which indicates performance standards like ANSI or ERP. This system allows precise ordering of the desired performance bin.

8. Application Design Considerations

8.1 Thermal Management

Given the high power (up to 4W typical at 160mA, 25V) and the typical thermal resistance of 2.5 °C/W, effective heat sinking is paramount. The maximum junction temperature of 120°C must not be exceeded. Design calculations must consider the ambient temperature, the thermal path from the junction to the heatsink, and the drive current. Using the derating curve (Max Forward Current vs. Ambient Temperature) is essential for high-temperature environments.

8.2 Electrical Drive

A constant current driver is strongly recommended to ensure stable light output and long lifetime. The driver should be chosen based on the forward voltage bin and the desired operating current (up to the absolute maximum of 240mA DC). Protection against reverse voltage and transient voltage spikes is also advised. The ESD sensitivity (1000V HBM) necessitates standard ESD handling precautions during assembly.

8.3 Optical Integration

The wide 120-degree viewing angle may require secondary optics (lenses or reflectors) to achieve specific beam patterns for applications like spotlights or downlights. The top-view design facilitates direct emission into such optics.

9. Technical Comparison and Differentiation

The T5C series differentiates itself through its combination of high luminous flux output from a compact 5050 package and a high forward voltage characteristic (typical 25V), which can be advantageous for reducing current requirements in series-string configurations. The thermally enhanced package design, evidenced by the specified thermal resistance, aims for better reliability and performance sustainability compared to standard packages. The comprehensive binning across flux, voltage, and tight chromaticity ellipses offers designers a high level of consistency for quality lighting products.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical efficacy of this LED?
A: Efficacy (lumens per watt) can be calculated. For a 4000K Ra70 LED with 655 lm typical at 160mA and 25V (4W input), the typical efficacy is approximately 164 lm/W. Actual system efficacy will be lower due to driver losses and thermal effects.

Q: How do I select the right bin for my project?
A: Choose the CCT (X2) and CRI (X3) based on the application's lighting requirements. Then, select a luminous flux bin (from the binning table) that meets your brightness needs. The voltage bin (6D/E/F) can be selected based on your driver's voltage compliance range.

Q: Can I drive this LED at its absolute maximum current of 240mA continuously?
A: This is possible only if the thermal management is exceptionally effective, keeping the junction temperature well below 120°C. In most practical designs, it is safer to operate at or below the test current of 160mA to ensure longevity and maintain efficiency. Always refer to the derating curve for the specific ambient temperature.

Q: What does \"5-step MacAdam ellipse\" mean for color consistency?
A: It means that all LEDs within this bin have chromaticity coordinates so close that the color difference is imperceptible or barely perceptible to most observers under standard viewing conditions. A 5-step ellipse is a common industry standard for high-quality color mixing.

11. Practical Design Case Study

Consider designing a high-quality 4000K Ra80 LED panel light. The designer selects the T5C series for its high output and consistency. From the binning table, they specify the GN flux bin (600-650 lm min) to achieve the target panel brightness. They choose the 6E voltage bin (24-26V) to match their constant-current driver's output voltage range. A metal-core PCB (MCPCB) is designed with pads matching the datasheet recommendation. The thermal design calculates the required heatsink size based on the number of LEDs, the 2.5 °C/W Rth j-sp, the expected ambient temperature of 45°C, and a chosen drive current of 150mA (slightly below the test current for margin). The driver is selected to provide a stable 150mA output with a voltage compliance covering the total series voltage of all LEDs. This systematic approach, based on the datasheet parameters, ensures a reliable, efficient, and consistent lighting product.

12. Operating Principle

A white LED operates on the principle of electroluminescence in a semiconductor material, typically indium gallium nitride (InGaN) for the blue emission. When a forward voltage is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (blue light). This blue light then strikes a phosphor coating deposited on or near the semiconductor chip. The phosphor absorbs a portion of the blue light and re-emits it as light across a broader spectrum, primarily in the yellow and red regions. The combination of the remaining blue light and the phosphor-converted yellow/red light results in the perception of white light. The exact proportions of blue and phosphor-converted light determine the Correlated Color Temperature (CCT), while the breadth and composition of the phosphor's emission spectrum influence the Color Rendering Index (CRI).

13. Technology Trends

The solid-state lighting industry continues to evolve with several key trends. Efficacy (lumens per watt) is steadily increasing through improvements in internal quantum efficiency, light extraction, and phosphor technology. There is a strong focus on improving color quality, moving beyond Ra (CRI) to metrics like R9 (saturated red rendering) and TM-30 (Rf, Rg) for more accurate color assessment. Miniaturization persists, allowing for higher density and more flexible designs. Smart and connected lighting, integrating sensors and controls, is becoming more prevalent. Furthermore, reliability and lifetime under real-world operating conditions (including high temperature and humidity) remain critical areas of development, as is the push for more sustainable manufacturing processes and materials.