7070 White LED Datasheet - Size 7.0x7.0x2.8mm - Voltage 49V - Power 7.8W - English Technical Document

1. Product Overview

This document provides comprehensive technical specifications for a high-power white LED in a 7070 package format. The device is designed for demanding lighting applications requiring high luminous output and robust thermal performance. Its thermally enhanced package design allows for efficient heat dissipation, supporting high current operation and contributing to long-term reliability.

The LED is a top-view component, offering a wide viewing angle suitable for applications requiring broad light distribution. It is compatible with lead-free reflow soldering processes and is designed to comply with relevant environmental regulations.

2. Key Features and Applications

2.1 Core Features

• Top view white LED emission.
• Thermally Enhanced Package Design for improved heat management.
• High luminous flux output.
• High current capability (up to 150mA continuous).
• Compact Package Size (7.0mm x 7.0mm).
• Wide viewing angle (typically 120 degrees).
• Suitable for Pb-free Reflow Soldering Application.
• RoHS compliant.

2.2 Target Applications

• Architectural and Decorative lighting.
• Retrofit lighting solutions (replacement for traditional light sources).
• General lighting purposes.
• Indoor & Outdoor sign board backlighting.

3. Technical Parameters: In-Depth Objective Interpretation

3.1 Electro-Optical Characteristics

All measurements are specified at a junction temperature (Tj) of 25°C and a forward current (IF) of 100mA. The device is available in multiple Correlated Color Temperatures (CCT): 2700K, 3000K, 4000K, 5000K, 5700K, and 6500K. All variants offer a minimum Color Rendering Index (Ra) of 80. The typical luminous flux ranges from 590 lm to 650 lm depending on the CCT, with a minimum guaranteed output specified for each bin. A measurement tolerance of ±7% applies to luminous flux, and ±2% for Ra.

3.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation should always be maintained within these boundaries.

• Forward Current (IF): 150 mA (continuous).
• Pulse Forward Current (IFP): 225 mA (Pulse Width ≤100μs, Duty cycle ≤1/10).
• Power Dissipation (PD): 7800 mW.
• Reverse Voltage (VR): 5 V.
• Operating Temperature (Topr): -40°C to +105°C.
• Storage Temperature (Tstg): -40°C to +85°C.
• Junction Temperature (Tj): 120°C (maximum).
• Soldering Temperature (Tsld): Reflow profile with peak of 230°C or 260°C for 10 seconds.

Exceeding these parameters may alter the LED's properties and is not recommended. Care must be taken to ensure power dissipation does not exceed the absolute maximum rating.

3.3 Electrical/Optical Characteristics at Tj=25°C

• Forward Voltage (VF): 46V (Min), 49V (Typ), 52V (Max) at IF=100mA. Tolerance is ±3%.
• Reverse Current (IR): Maximum 10 μA at VR=5V.
• View Angle (2θ1/2): Typically 120 degrees, defined as the off-axis angle where luminous intensity is half the peak intensity.
• Thermal Resistance (Rth j-sp): Typically 3 °C/W from the LED junction to the solder point on an MCPCB, measured with electrical power applied at IF=100mA.
• Electrostatic Discharge (ESD): Withstands a minimum of 1000V (Human Body Model).

4. Binning System Explanation

The product is classified into bins to ensure consistency in key parameters for lighting design.

4.1 Luminous Flux Binning

At IF=100mA and Tj=25°C, LEDs are sorted into luminous flux ranks (e.g., GL, GM, GN, GP) with defined minimum and maximum flux ranges for each CCT. For example, a 4000K LED in the GM bin has a luminous flux between 550 lm and 600 lm.

4.2 Forward Voltage Binning

LEDs are also binned by forward voltage at IF=100mA and Tj=25°C. Codes include 6R (46-48V), 6S (48-50V), and 6T (50-52V), with a measurement tolerance of ±3%.

4.3 Chromaticity Binning

The color coordinates are controlled within a 5-step MacAdam ellipse on the CIE chromaticity diagram. The datasheet provides the center coordinates (at Tj=25°C and 85°C) and ellipse parameters (a, b, Φ) for each CCT code (e.g., 27R5 for 2700K). This tight binning, aligned with standards like Energy Star for 2600K-7000K, ensures minimal visible color variation between LEDs. The tolerance for chromaticity coordinate measurement is ±0.005.

5. Performance Curve Analysis

5.1 Spectral Distribution

The provided color spectrum graph (at Tj=25°C) shows the relative intensity versus wavelength for the white LED. This curve is typical of a phosphor-converted white LED, featuring a blue peak from the primary LED chip and a broader yellow/red emission band from the phosphor. The exact shape determines the CCT and CRI of the light.

5.2 Viewing Angle Distribution

The polar diagram illustrates the spatial radiation pattern. The wide, typically Lambertian-like distribution (120° viewing angle) confirms uniform light output over a broad area, which is ideal for general illumination and backlighting where even coverage is required.

6. Mechanical and Package Information

6.1 Package Dimensions

The LED has a square footprint measuring 7.00mm x 7.00mm. The overall package height is 2.80mm. Key internal features include the anode and cathode pad locations. The dimensional drawing specifies all critical lengths, including pad sizes (2.73mm x 2.73mm) and spacing (6.10mm between pad centers). Unless otherwise noted, the dimensional tolerance is ±0.1mm.

6.2 Polarity Identification and Pad Design

The package features two electrical pads. The polarity is clearly marked in the diagram: one pad is the anode, and the other is the cathode. Correct polarity must be observed during circuit board assembly. The pad design is suitable for standard surface-mount technology (SMT) processes.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Profile

A detailed reflow profile is provided for lead-free soldering:

• Preheat: Ramp from 150°C to 200°C over 60-120 seconds.
• Ramp-up Rate: Maximum 3°C/second from liquidous to peak temperature.
• Liquidous Temperature (TL): 217°C. Time above TL (tL) should be 60-150 seconds.
• Peak Temperature (Tp): Maximum 260°C at the package body.
• Time at Peak (tp): Maximum 30 seconds within 5°C of Tp.
• Ramp-down Rate: Maximum 6°C/second from Tp to TL.
• Total Cycle Time: Maximum 8 minutes from 25°C to peak temperature.

Adhering to this profile is critical to prevent thermal damage to the LED package and internal die attach materials.

7.2 Storage and Handling Notes

While not explicitly detailed in the provided extract, based on standard practice for moisture-sensitive devices, it is recommended to store LEDs in a dry environment (typically <10% relative humidity) and use within a specified shelf life after the sealed bag is opened to avoid popcorn effect during reflow. Always handle with ESD precautions.

8. Packaging and Ordering Information

8.1 Tape and Reel Packaging

The LEDs are supplied on embossed carrier tape for automated assembly. Maximum quantity per reel is 1000 pieces. The cumulative tolerance over 10 pitches of the tape is ±0.2mm. The outer package should be damp-proof and labeled with the part number, manufacturing date code, and quantity.

8.2 Part Numbering System

The part number follows a structured format: T □□ □□ □ □ □ □ – □ □□ □□ □. Key elements include:

• Type Code: Indicates package size (e.g., '7C' for 7070).
• CCT Code: Two digits for color temperature (e.g., '40' for 4000K).
• Color Rendering (Ra): Single digit (e.g., '8' for Ra80).
• Serial/Parallel Chip Count: Codes from 1 to Z.
• Component Code & Color Code: Define internal component variations and application-specific bins (e.g., ANSI standard, high-temperature 85°C/105°C bins, backlighting).

9. Application Suggestions

9.1 Design Considerations

• Thermal Management: The high power dissipation (up to 7.8W) necessitates an effective thermal management system. Use a Metal Core PCB (MCPCB) or other heatsinking methods to keep the junction temperature well below the maximum 120°C rating to ensure longevity and maintain light output.
• Current Drive: Use a constant current driver suitable for the high forward voltage (~49V) and current (up to 150mA). Do not exceed the absolute maximum ratings.
• Optical Design: The wide 120° viewing angle may require secondary optics (lenses, reflectors) if a more focused beam is needed.
• Binning Selection: For applications requiring color consistency (e.g., architectural lighting), specify tight chromaticity and flux bins.

9.2 Typical Circuit Implementation

Multiple LEDs can be connected in series to match the voltage output of a constant current driver. The number in series is limited by the driver's maximum output voltage. Parallel connections are generally not recommended without careful balancing to prevent current hogging.

10. Technical Comparison and Differentiation

Compared to smaller packages (e.g., 2835, 3030), this 7070 LED offers significantly higher luminous flux per package, reducing the number of components needed for a given light output. Its thermally enhanced design supports higher drive currents and power dissipation. The high forward voltage (~49V) is atypical for a single-die LED and suggests a multi-chip series configuration within the package, which can offer advantages in current regulation efficiency when used with certain drivers. The wide 120° viewing angle provides more diffuse light compared to narrower-angle LEDs.

11. Frequently Asked Questions (Based on Technical Parameters)

11.1 What is the actual power consumption?

At the typical operating point of 100mA and 49V, the electrical power input is 4.9W (0.1A * 49V). The absolute maximum power dissipation rating of 7.8W provides headroom for operation at higher currents or voltages.

11.2 How does temperature affect performance?

As junction temperature increases, luminous output typically decreases, and the forward voltage may slightly drop. The chromaticity coordinates also shift, as indicated by the separate center coordinates provided for Tj=85°C. Effective cooling is essential to maintain specified performance.

11.3 Can I drive it with a constant voltage source?

It is strongly discouraged. LEDs are current-driven devices. A constant voltage source could lead to thermal runaway and destruction of the LED due to the negative temperature coefficient of the forward voltage. Always use a constant current driver.

11.4 What does the 'Thermal Resistance' value mean?

A thermal resistance (Rth j-sp) of 3 °C/W means that for every watt of power dissipated in the LED junction, the temperature difference between the junction and the solder point will increase by approximately 3 degrees Celsius. Lower values indicate better thermal paths.

12. Practical Design and Usage Case

Scenario: Designing a high-bay industrial light fixture.

A designer needs a light output of 10,000 lumens with a CCT of 4000K and good color rendering (Ra80). Using this 7070 LED in the GP flux bin (650-700 lm typical), approximately 15-16 LEDs would be required. They would be arranged in a series string on a large MCPCB. A constant current driver with an output voltage range capable of driving 16 LEDs in series (16 * ~49V = ~784V) and a current output of 100mA would be selected. The MCPCB would be attached to a substantial aluminum heatsink to maintain a low junction temperature, ensuring long life and stable light output. The wide viewing angle would help provide even illumination across the factory floor.

13. Principle Introduction

This is a phosphor-converted white LED. It fundamentally consists of a blue-emitting semiconductor chip (typically based on InGaN). This blue light is partially absorbed by a layer of phosphor material (e.g., YAG:Ce) coated on or around the chip. The phosphor re-emits light across a broad spectrum in the yellow and red regions. The combination of the remaining blue light and the phosphor-converted yellow/red light results in the perception of white light. The exact ratio of blue to yellow light, determined by the phosphor composition and thickness, defines the Correlated Color Temperature (CCT). The Color Rendering Index (Ra) is a measure of how accurately the LED's spectrum reveals the colors of objects compared to a natural reference light source of the same CCT.

14. Development Trends

The solid-state lighting industry continues to evolve with several clear trends. There is a constant drive for higher luminous efficacy (more lumens per watt), reducing energy consumption for the same light output. Improvements in phosphor technology and chip design contribute to this. Another trend is the pursuit of higher Color Rendering Index (CRI) values, especially R9 (saturated red), for applications where color quality is critical, such as retail and museum lighting. Enhanced reliability and longer lifetimes under higher operating temperatures and drive currents are also key development areas. Furthermore, there is ongoing miniaturization and integration, with packages becoming more efficient at light extraction and thermal management, allowing for higher power densities in smaller form factors. The standardization of color and flux binning continues to improve, facilitating consistent lighting designs.