T1D Series White LED Datasheet - 10.0x10.0mm Package - 36-40V Forward Voltage - 540mA Drive Current - High Luminous Flux - English Technical Document

1. Product Overview

The T1D series represents a high-performance, top-view white LED designed for demanding general lighting applications. This product features a thermally enhanced package design that facilitates efficient heat dissipation, which is critical for maintaining performance and longevity under high drive currents. The compact 10.0x10.0mm footprint allows for flexible integration into various lighting fixtures and systems. A key characteristic of this series is its capability to handle high current, typically up to 540mA for standard operation, enabling high luminous flux output suitable for replacing traditional light sources. The LED emits a wide viewing angle of 120 degrees, providing uniform illumination. It is constructed using Pb-free materials and is compliant with RoHS directives, making it suitable for modern electronic manufacturing processes that utilize reflow soldering.

2. Technical Parameter Analysis

2.1 Electro-Optical Characteristics

The performance of the LED is characterized under specific conditions: a forward current (IF) of 540mA and a junction temperature (Tj) of 25°C. The luminous flux output varies primarily with Correlated Color Temperature (CCT) and Color Rendering Index (CRI). For instance, a 4000K LED with a CRI of Ra70 has a typical luminous flux of 3240 lumens (lm), with a minimum specified value of 3000 lm. As the CRI increases to Ra90 for the same CCT, the typical flux decreases to 2600 lm (min 2400 lm), illustrating the trade-off between color quality and light output. The tolerance for luminous flux measurement is ±7%, and for CRI (Ra) measurement, it is ±2.

2.2 Electrical and Thermal Parameters

The absolute maximum ratings define the operational limits. The maximum continuous forward current (IF) is 600 mA, with a pulsed forward current (IFP) of 900 mA allowed under specific conditions (pulse width ≤100μs, duty cycle ≤1/10). The maximum power dissipation (PD) is 24,000 mW. The device can operate within an ambient temperature range of -40°C to +105°C. The forward voltage (VF) at 540mA typically ranges from 36V to 40V, with a nominal value of 37.5V and a measurement tolerance of ±3%. The thermal resistance from the junction to the solder point (Rth j-sp) is specified as 1°C/W, indicating good thermal management capability of the package. The electrostatic discharge (ESD) withstand level is 1000V (Human Body Model).

3. Binning and Classification System

3.1 Part Numbering System

The part number follows a structured code: T1D***C3R-*****. Key elements include the type code (e.g., '1D' for 10.0x10.0mm), CCT code (e.g., '40' for 4000K), CRI code (e.g., '7' for Ra70), codes for the number of serial and parallel chips, a component code, and a color code defining the ANSI or other standard binning.

3.2 Luminous Flux Binning

LEDs are sorted into luminous flux bins to ensure consistency. For a 4000K, Ra70 LED, bins include codes like 3Y (3000-3100 lm min), 3Z (3100-3200 lm), 4A (3200-3300 lm), and 4B (3300-3400 lm). Different CCT/CRI combinations have their own specific binning tables, allowing designers to select components that meet precise flux requirements for their application.

3.3 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design, particularly for driving multiple LEDs in series. Two bins are defined at IF=540mA: Code 6L (36V - 38V) and Code 6M (38V - 40V).

3.4 Chromaticity Binning

The color consistency is controlled within a 5-step MacAdam ellipse for each CCT. The datasheet provides the center coordinates (x, y) and ellipse parameters (a, b, Φ) for CCTs ranging from 2700K to 6500K. For example, the 4000K (40R5) bin is centered at x=0.3875, y=0.3868. Energy Star binning standards are applied to all white LEDs from 2600K to 7000K.

4. Performance Curves and Graphical Data

The datasheet includes several key performance graphs. The Relative Luminous Flux vs. Forward Current (IF) curve shows how light output increases with current, typically in a sub-linear manner at higher currents due to heating and efficiency droop. The Forward Voltage vs. Forward Current curve illustrates the diode's IV characteristic. The Relative Luminous Flux vs. Solder Point Temperature (Ts) graph is crucial for thermal design, showing the expected light output reduction as the operating temperature rises. The Viewing Angle Distribution plot confirms the 120-degree beam pattern. Color Spectrum graphs for different CRI levels (Ra70, Ra80, Ra90) show the spectral power distribution, which influences the color rendering properties. The graph for Maximum Forward Current vs. Ambient Temperature defines the derating necessary to prevent overheating at high ambient temperatures.

5. Mechanical and Package Information

The LED features a square, top-view package measuring 10.0mm by 10.0mm. A detailed dimensioned drawing is provided, including top, bottom, and side views. The bottom view clearly indicates the anode and cathode polarity markings, which are essential for correct PCB layout and assembly. The recommended soldering pad pattern (land pattern) is also specified to ensure reliable mechanical and electrical connection during the reflow process. All unspecified tolerances are ±0.1mm.

6. Assembly and Handling Guidelines

6.1 Reflow Soldering

The device is suitable for reflow soldering processes. The profile must be controlled to prevent thermal damage. The maximum soldering temperature is specified as 230°C or 260°C, with a time-at-temperature not exceeding 10 seconds. A typical reflow temperature profile graph would show preheat, soak, reflow, and cooling zones, but specific times are not detailed in the provided excerpt. It is critical to adhere to these limits to avoid compromising the internal solder joints or the LED chip itself.

6.2 Storage and Handling

The storage temperature range is -40°C to +85°C. Devices should be kept in moisture-sensitive packaging until use and baked according to standard IPC/JEDEC guidelines if the packaging has been opened and exposure limits exceeded. Standard ESD precautions must be observed during handling to prevent damage from electrostatic discharge.

7. Application Notes and Design Considerations

7.1 Typical Applications

This high-power LED is well-suited for architectural and decorative lighting, retrofit lamps designed to replace existing light sources, general illumination for residential and commercial spaces, and as a backlight for indoor and outdoor signage due to its high brightness and wide viewing angle.

7.2 Design Considerations

Thermal Management: This is the most critical aspect. With a power dissipation up to 24W, an effective heatsink is mandatory. The low thermal resistance (1°C/W) of the package is only effective if mounted properly onto a Metal Core PCB (MCPCB) or another suitable substrate with high thermal conductivity. The junction temperature must be kept below 120°C to ensure reliability and maintain light output (as shown in the Ts vs. flux graph).
Electrical Drive: A constant-current driver is recommended to ensure stable light output and color. The driver must be capable of supplying up to 600mA continuous current and must account for the forward voltage bin (36-40V) when designing for series connections. The reverse voltage rating is only 5V, so protection against reverse bias or voltage spikes is necessary.
Optical Design: The 120-degree viewing angle is inherent to the package. For applications requiring a different beam pattern, secondary optics (lenses or reflectors) must be used. The initial selection of CCT and CRI bin is crucial for meeting the application's color quality and light level requirements.

8. Technical Comparison and Positioning

The T1D series differentiates itself through its combination of a large 10.0x10.0mm package, very high drive current capability (540mA standard, 600mA max), and consequently, very high luminous flux output (exceeding 3000 lm for many bins). Compared to smaller mid-power LEDs (e.g., 2835, 3030), it offers significantly higher flux per device, reducing the number of LEDs needed in a fixture but demanding more robust thermal and electrical design. The wide 120-degree viewing angle is typical for a top-view LED without an integrated lens, providing a Lambertian emission pattern. The detailed binning structure for flux, voltage, and chromaticity allows for precise system design and tight color consistency in multi-LED arrays.

9. Frequently Asked Questions (FAQ)

Q: What is the typical efficacy (lumens per watt) of this LED?
A: At 540mA and 37.5V, the input power is approximately 20.25W. For a 4000K Ra70 LED with 3240 lm, the efficacy is about 160 lm/W. This is a calculated value; actual efficacy depends on the specific bin and operating conditions.
Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. Their forward voltage has a negative temperature coefficient and varies from unit to unit (as shown in the voltage bins). A constant voltage source could lead to thermal runaway and device failure. Always use a constant-current driver.
Q: How does the light output change over the operating temperature range?
A: Light output decreases as temperature increases. Refer to the "Ts—Relative Luminous flux" graph. Proper thermal management is essential to maintain stable light output and long life.
Q: What is the meaning of the 5-step MacAdam ellipse?
A: A MacAdam ellipse defines a region in the chromaticity diagram where color differences are imperceptible to the average human eye under standard viewing conditions. A 5-step ellipse means the color variation is five times the minimum perceptible difference (1-step). Tighter ellipses (e.g., 3-step) indicate better color consistency.

10. Operational Principles and Context

White LEDs in this class typically use a blue LED chip coated with a phosphor layer. The blue light from the chip excites the phosphor, which then emits yellow light. The combination of the remaining blue light and the emitted yellow light produces white light. The exact ratio and type of phosphor determine the CCT (from warm white 2700K to cool white 6500K) and the CRI. The high drive current generates significant heat at the semiconductor junction. The thermally enhanced package, often incorporating a ceramic substrate or other high-conductivity materials, efficiently transfers this heat to the solder point and then to the system heatsink. Managing this heat is fundamental to achieving the specified performance, longevity, and color stability.