T1D Series White LED Datasheet - 10.0x10.0mm Package - 49.5V Typ - 360mA Drive - High CRI - English Technical Document

1. Product Overview

The T1D series represents a high-performance, top-view white LED component designed for demanding general lighting applications. This device utilizes a thermally enhanced package design to manage heat effectively, enabling stable operation at high drive currents. Its primary design goals are to deliver high luminous flux output while maintaining excellent color rendering properties, making it suitable for applications where light quality and intensity are critical.

1.1 Core Advantages

• High Luminous Flux Output: Capable of delivering over 2370 lumens (typical) at 360mA, depending on the correlated color temperature (CCT).
• Excellent Color Quality: Features a high Color Rendering Index (CRI) of Ra90, ensuring accurate and vibrant color reproduction under its illumination.
• Robust Thermal Management: The package is engineered for efficient heat dissipation, supporting high current operation and contributing to long-term reliability.
• Compact Form Factor: The 10.0mm x 10.0mm footprint allows for flexible integration into various lighting fixtures and designs.
• Wide Viewing Angle: A typical viewing angle (2θ1/2) of 120 degrees provides broad and even illumination.
• Reliable Manufacturing: The component is compatible with Pb-free reflow soldering processes and is designed to comply with relevant environmental regulations.

1.2 Target Applications

This LED is engineered for a broad spectrum of lighting solutions, including:

• Architectural and Decorative Lighting: Facade lighting, cove lighting, and other accent lighting where high output and good color are required.
• Retrofit Lamps: Direct replacement for traditional light sources in existing fixtures, offering energy savings and improved light quality.
• General Lighting: Primary illumination for residential, commercial, and industrial spaces.
• Backlighting for Signage: Indoor and outdoor sign boards requiring bright, uniform backlighting.

2. In-Depth Technical Parameter Analysis

This section provides a detailed breakdown of the key electrical, optical, and thermal parameters that define the performance envelope of the T1D series LED.

2.1 Electro-Optical Characteristics

Measured at a forward current (IF) of 360mA and a junction temperature (Tj) of 25°C, the device exhibits the following performance across different color temperatures:

• 2700K (Warm White): Minimum luminous flux of 1900 lm, typical of 2150 lm.
• 3000K (Warm White): Minimum luminous flux of 2000 lm, typical of 2260 lm.
• 4000K-6500K (Neutral to Cool White): Minimum luminous flux of 2100 lm, typical of 2370 lm.

Important Notes: The luminous flux measurement tolerance is ±7%, and the CRI (Ra) measurement tolerance is ±2. The forward voltage (VF) under these conditions is typically 49.5V, with a range from 46V to 52V (tolerance ±3%).

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation should always be maintained within these boundaries.

• Continuous Forward Current (IF): 400 mA
• Pulse Forward Current (IFP): 600 mA (Pulse width ≤100μs, Duty cycle ≤1/10)
• Power Dissipation (PD): 20800 mW
• Reverse Voltage (VR): 5 V
• Operating Temperature (Topr): -40°C to +105°C
• Junction Temperature (Tj): 120°C (maximum)

2.3 Electrical & Thermal Characteristics

• Forward Voltage (VF): 46V (Min), 49.5V (Typ), 52V (Max) at IF=360mA.
• Reverse Current (IR): Maximum 1 μA at VR=5V.
• Viewing Angle (2θ1/2): 120° (Typical).
• Thermal Resistance (Rth j-sp): 1 °C/W (Typical). This low value indicates efficient heat transfer from the semiconductor junction to the solder point on the board.
• Electrostatic Discharge (ESD): Withstands 1000V (Human Body Model).

3. Binning System Explanation

To ensure consistency in lighting projects, LEDs are sorted (binned) according to key parameters. The T1D series uses a multi-dimensional binning system.

3.1 Luminous Flux Binning

LEDs are grouped by their measured light output at 360mA. Each bin has a defined minimum and maximum luminous flux value. For example, for a 4000K CCT LED with Ra90, bin code "3M" covers 2100-2200 lm, "3N" covers 2200-2300 lm, and so on up to "3Q" for 2400-2500 lm. This allows designers to select LEDs with predictable brightness levels.

3.2 Forward Voltage Binning

To aid in driver design and current matching in multi-LED arrays, devices are also binned by forward voltage. Codes include "6R" (46-48V), "6S" (48-50V), and "6T" (50-52V). Selecting LEDs from the same voltage bin can help achieve more uniform performance.

3.3 Chromaticity Binning (Color Consistency)

The LEDs are binned to very tight color consistency standards. The chromaticity coordinates (x, y on the CIE diagram) for each CCT (e.g., 2700K, 4000K, 6500K) are controlled within a 5-step MacAdam ellipse. This means the color variation between LEDs in the same bin is virtually imperceptible to the human eye, which is crucial for applications requiring uniform white light. The standard follows Energy Star binning requirements for the 2600K-7000K range.

4. Performance Curve Analysis

The provided graphs offer critical insights into the LED's behavior under different operating conditions.

4.1 Spectral Distribution

The spectrum graph for Ra≥90 devices shows a broad, continuous emission across the visible range, which is characteristic of high-CRI phosphor-converted white LEDs. The absence of significant gaps in the spectrum is what enables the high color rendering index, allowing objects to appear natural under its light.

4.2 Current vs. Relative Luminous Flux

This curve illustrates the relationship between drive current and light output. Initially, light output increases nearly linearly with current. However, at higher currents, efficiency typically drops due to increased heat and other effects (efficiency droop). Operating at or below the recommended 360mA ensures optimal efficacy and longevity.

4.3 Temperature Dependence

The graphs showing relative luminous flux and forward voltage versus solder point temperature (Ts) are vital for thermal design. Luminous flux generally decreases as temperature rises. Forward voltage also decreases with increasing temperature. Understanding these relationships is essential for designing effective heat sinks and predicting light output in the final application environment.

4.4 Maximum Current vs. Ambient Temperature

This derating curve defines the maximum allowable forward current as a function of the ambient temperature. As ambient temperature increases, the LED's ability to dissipate heat diminishes, so the maximum safe operating current must be reduced to prevent exceeding the maximum junction temperature (Tj max). This graph is critical for ensuring reliability in high-temperature environments.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED features a square surface-mount package with dimensions of 10.0mm x 10.0mm. The dimensional drawing provides top, side, and bottom views with critical measurements. The bottom view clearly shows the solder pad layout and polarity marking. The standard tolerance for unspecified dimensions is ±0.1mm.

5.2 Polarity Identification and Solder Pad Design

The bottom of the package has clearly defined anode (+) and cathode (-) solder pads. The recommended solder pad pattern (land pattern) is provided to ensure a reliable solder joint and proper thermal connection to the printed circuit board (PCB). Following this recommended footprint is essential for mechanical stability and optimal heat transfer.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The component is rated for lead-free (Pb-free) reflow soldering processes. A specific thermal profile must be followed to avoid damage:

• Peak Package Body Temperature (Tp): Maximum 260°C.
• Time above Liquidous (TL=217°C): 60 to 150 seconds.
• Time within 5°C of Peak Temperature: Maximum 30 seconds.
• Ramp-up Rate (to peak): Maximum 3°C/second.
• Ramp-down Rate (from peak): Maximum 6°C/second.
• Total Time from 25°C to Peak: Maximum 8 minutes.

Adhering to this profile prevents thermal shock, solder joint defects, and potential damage to the internal LED die and phosphor.

7. Part Numbering System

The part number (e.g., T1D**9G2R-*****) follows a structured code that conveys key attributes:

• Type Code: "1D" indicates a 10.0mm x 10.0mm package.
• CCT Code: Two digits indicating the correlated color temperature (e.g., 27 for 2700K, 40 for 4000K).
• Color Rendering Code: A single digit for CRI (e.g., 9 for Ra90).
• Chip Configuration Codes: Indicate the number of serial and parallel chips inside the package.
• Color Code: A letter indicating the color standard (e.g., ANSI).

This system allows for precise identification and ordering of the desired LED variant.

8. Application Design Considerations

8.1 Thermal Management

Given the high power dissipation (up to ~17.8W at 360mA, 49.5V), effective thermal management is the single most important design factor. A properly sized metal-core PCB (MCPCB) or other heatsinking solution is mandatory to maintain the solder point temperature (Ts) within safe limits. Exceeding thermal ratings will lead to accelerated lumen depreciation, color shift, and ultimately, device failure.

8.2 Electrical Drive

A constant-current LED driver is required to operate this device. The driver should be selected to provide a stable 360mA (or a derated current based on thermal conditions) and must withstand the typical forward voltage of ~49.5V per LED. For designs using multiple LEDs, they can be connected in series, but the driver's output voltage must accommodate the sum of the forward voltages.

8.3 Optical Integration

The wide 120-degree viewing angle is suitable for applications requiring broad illumination without secondary optics. For applications needing a focused beam, appropriate lenses or reflectors must be used. Designers should account for potential color over-angle variations, although tight binning minimizes this.

9. Technical Comparison & Differentiation

Compared to standard mid-power LEDs (e.g., 2835, 3030 packages), the T1D series offers significantly higher luminous flux per device, reducing the number of components needed in a high-output fixture. Its key differentiators are the combination of very high flux, high CRI (Ra90), and a robust package designed for thermal performance. Compared to other high-power COB (Chip-on-Board) LEDs, it offers a more discrete, point-source-like form factor which can be advantageous for optical control in certain applications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 400mA continuously?
A: The Absolute Maximum Rating for continuous forward current is 400mA. However, for optimal lifetime and reliability, it is recommended to operate at or below the test condition of 360mA, especially after accounting for thermal derating in the actual application.

Q: What heatsink is required?
A: The required heatsink depends entirely on the application's ambient temperature, desired drive current, and acceptable junction temperature. Using the thermal resistance (Rth j-sp = 1°C/W) and the derating curve, a thermal engineer can calculate the necessary thermal impedance from the solder point to ambient.

Q: How does the color shift over time and temperature?
A> All white LEDs experience some degree of color shift. The provided graph (Fig 7. Ts vs. CIE x, y Shift) shows the direction and magnitude of chromaticity coordinate shift with solder point temperature. Long-term lumen maintenance and color shift are influenced by operating temperature and current; operating within specifications minimizes these effects.

11. Design Use Case Example

Scenario: Designing a high-bay industrial light fixture.
A designer needs a light output of approximately 25,000 lumens. Using the T1D-4000K-Ra90 LED from bin "3P" (2300-2400 lm typical), they would require roughly 10-11 LEDs. These would be mounted on a large, actively cooled aluminum heatsink to maintain a low Ts. The LEDs would be arranged in a series string, requiring a constant-current driver with an output voltage capability of over 500V (11 LEDs * 49.5V) and a stable 360mA output. The wide viewing angle would provide good coverage for the high-bay area, and the high CRI would improve visibility and safety in the workspace.

12. Operational Principle

This is a phosphor-converted white LED. The core is a blue-emitting semiconductor chip, typically based on indium gallium nitride (InGaN). When forward current is applied, electrons and holes recombine in the chip's active region, emitting blue light. A portion of this blue light strikes a layer of phosphor material (e.g., YAG:Ce) deposited on or near the chip. The phosphor absorbs some of the blue photons and re-emits light across a broader spectrum, primarily in the yellow and red regions. The mixture of the remaining blue light and the phosphor's broad-spectrum emission results in the perception of white light. The specific blend of phosphors determines the CCT and CRI of the final output.

13. Technology Trends

The development of high-power white LEDs like the T1D series is driven by continuous improvements in several areas: Efficiency (lm/W): Ongoing research into novel semiconductor materials (e.g., on non-polar/semi-polar GaN) and advanced chip designs aims to reduce efficiency droop at high currents. Color Quality: The trend is towards even higher CRI values (Ra95, Ra98) and improved color consistency (tighter MacAdam ellipses, such as 3-step or 2-step). This is achieved through sophisticated multi-phosphor blends. Reliability & Lifetime: Enhanced package materials, better thermal interfaces, and improved phosphor stability under high temperature and flux density are extending LED lifetimes and lumen maintenance. Smart Integration: There is a growing convergence of LED packages with onboard sensors, drivers, and communication interfaces for intelligent, tunable lighting systems.