Select Language

EL220X Series Logic Gate Photocoupler Datasheet - 8-Pin DIP Package - High Speed 5Mbd - Low Input Current 1.6mA - Isolation Voltage 5000Vrms - English Technical Document

Complete technical datasheet for the EL220X series high-speed, low-input-current logic gate photocoupler. Features include 5Mbd signal rate, 1kV/μs CMTI, 4.5-20V supply, and 5000Vrms isolation. Includes electrical specs, truth tables, and application notes.
smdled.org | PDF Size: 0.8 MB
Rating: 4.5/5
Your Rating
You have already rated this document
PDF Document Cover - EL220X Series Logic Gate Photocoupler Datasheet - 8-Pin DIP Package - High Speed 5Mbd - Low Input Current 1.6mA - Isolation Voltage 5000Vrms - English Technical Document

1. Product Overview

The EL220X series represents a family of high-performance, high-speed logic gate photocouplers (opto-isolators) designed for digital signal isolation. The core function is to provide galvanic isolation between input and output circuits while transmitting logic-level signals with high fidelity and speed. The device integrates an infrared emitting diode optically coupled to a high-speed integrated photodetector with a logic gate output stage. It is offered in a standard 8-pin Dual In-line Package (DIP) and is also available in Surface-Mount Device (SMD) variants.

The primary advantage of this series lies in its combination of high speed and low input current requirements. It is engineered to replace pulse transformers and other isolation methods in demanding digital interfaces, offering superior noise immunity, simpler design integration, and reliable performance across a wide temperature range.

1.1 Core Advantages and Target Market

The EL220X photocoupler is distinguished by several key features that define its application space:

The target markets include industrial automation, programmable logic controllers (PLCs), data acquisition systems, isolated bus drivers, medical instrumentation requiring patient isolation, telecommunications equipment, and any application requiring ground loop elimination or high-voltage isolation for digital signals.

2. Technical Parameter Deep-Dive

The electrical and transfer characteristics of the EL220X series are specified under conditions of TA = -40°C to 85°C, VCC = 4.5V to 20V, and specific input/enable conditions, ensuring reliable operation across the entire stated range.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. They are not for continuous operation.

2.2 Electrical Characteristics: Input & Output

Input Characteristics:

Output & Supply Characteristics:

2.3 Transfer Characteristics

These parameters define the signal transfer behavior from input to output.

2.4 Switching Characteristics

These parameters define the timing performance, crucial for high-speed data transmission.

3. Device Variants and Truth Tables

The EL220X series includes specific variants with different output configurations.

3.1 EL2200 (Three-State Output)

The EL2200 features a three-state (tri-state) output. This allows multiple devices to be connected to a common data bus without contention. The output can be in a logic High, logic Low, or a high-impedance (Z) state. The high-impedance state is controlled by an active-low Enable (E) pin.

Truth Table for EL2200:

Input (LED)Enable (E)Output
H (ON)HZ (High-Impedance)
L (OFF)HZ (High-Impedance)
H (ON)LH
L (OFF)LL

When Enable is high, the output is disabled (high-Z) regardless of the input. When Enable is low, the output actively follows the input state (non-inverting).

3.2 EL2201/EL2202 (Standard Output)

The EL2201 and EL2202 have a standard, always-active output with no enable pin. The output directly follows the input state. The difference between EL2201 and EL2202 is typically in-channel-to-channel matching or other parametric selections not detailed in this excerpt.

Truth Table for EL2201/02:

Input (LED)Output
H (ON)H
L (OFF)L

The transfer function is non-inverting.

4. Application Suggestions and Design Considerations

4.1 Typical Application Circuits

1. Microprocessor System Interface / Isolated Bus Driver: The EL2200 is ideal for this. Multiple EL2200s can have their outputs connected to a microprocessor data bus. Each device's Enable pin is controlled by an address decoder. Only the selected device drives the bus, while others remain in high-Z state, preventing bus contention.

2. Ground Loop Elimination in Data Transmission: When sending digital signals (e.g., RS-232, RS-485 control signals) between systems with different ground potentials, the EL220X breaks the galvanic connection, preventing ground loop currents that cause noise and errors. Its high CMTI handles the ground shift.

3. Pulse Transformer Replacement: In switch-mode power supply feedback loops or gate drive circuits, the EL220X can replace small pulse transformers. It offers advantages like simpler design (no concern for transformer saturation, simpler driver), better stability over temperature, and potentially lower cost.

4.2 Critical Design Considerations

5. Mechanical, Packaging, and Assembly

5.1 Package Information

The device is housed in a standard 8-pin DIP package. The exact body dimensions, lead spacing, and seating plane should be obtained from the detailed mechanical drawing (not fully provided in this excerpt). Key points include:

5.2 Soldering and Handling

6. Technical Comparison and FAQs

6.1 Differentiation from Other Photocouplers

The EL220X series differentiates itself in the photocoupler market through its specific combination of attributes:

6.2 Frequently Asked Questions (Based on Parameters)

Q: What is the maximum data rate I can achieve with this device?
A: The typical signal rate is 5 Megabaud. The maximum practical data rate is limited by the propagation delays and rise/fall times. For a non-return-to-zero (NRZ) signal, a conservative estimate for the maximum frequency is 1/(2 * tPLH). Using the typical tPLH of 100ns, this suggests a maximum frequency around 5 MHz, which aligns with the 5 Mbd rating. For reliable operation, design with the maximum specified delays (300ns).

Q: How do I use the three-state function of the EL2200?
A> Connect the Enable (E) pin to your system's control logic. Drive it high (>\u20092.0V) to place the output in a high-impedance state, effectively disconnecting it from the bus or line. Drive it low (<\u20090.8V) to enable the output, allowing it to actively drive High or Low based on the input LED state. Never leave the pin unconnected.

Q: The datasheet mentions "hysteresis." What does this mean for my design?
A: Input current hysteresis means the current required to turn the output ON (IFT) is slightly higher than the current at which it turns OFF. This creates a noise margin. If your input signal has slow edges or noise superimposed on it, the hysteresis prevents the output from oscillating or chattering as the input passes through the switching threshold, ensuring a clean digital transition.

Q: Can I use this device to isolate analog signals?
A: No, the EL220X is specifically a logic gate photocoupler. Its output is a digital logic level (High/Low/Z), not a linear representation of the input LED current. For analog signal isolation, a linear optocoupler (with a phototransistor or photodiode output operating in its linear region) or an isolation amplifier should be used.

7. Operational Principle and Trends

7.1 Basic Operating Principle

The operation is based on optoelectronic conversion. An electrical current applied to the input side causes an Infrared Emitting Diode (IRED) to emit light. This light traverses an optically transparent isolation barrier within the package. On the output side, a silicon photodetector (typically a photodiode integrated with a signal conditioning IC) converts the received light back into an electrical current. This photocurrent is processed by a high-speed comparator or logic circuit with hysteresis to produce a clean, noise-immune digital output signal that replicates the input logic state. The key is that the signal is transmitted by light, providing the galvanic isolation between the two electrical circuits.

7.2 Industry Trends

Photocoupler technology continues to evolve. Trends relevant to devices like the EL220X include:

The EL220X series, with its balanced set of speed, low input current, and robust isolation, occupies a well-established position in this evolving landscape, serving applications where its specific performance envelope is optimal.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.