LED Lamp 383-2SURC/S530-A3 Datasheet - Hyper Red - 20mA - 2.0V Typ - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 383-2SURC/S530-A3 LED lamp. This component is a surface-mount device (SMD) designed for applications requiring high brightness and reliable performance. The series is based on AlGaInP chip technology, emitting in the hyper red spectrum, and is encapsulated in a water-clear resin.

1.1 Core Features and Advantages

The LED offers several key features that make it suitable for demanding electronic applications:

• High Brightness: Specifically engineered for applications where superior luminous intensity is required.
• Choice of Viewing Angles: Available with various viewing angle options to suit different design needs.
• Robust Packaging: Available on tape and reel for automated assembly, ensuring reliability and ease of handling in high-volume production.
• Environmental Compliance: The product is compliant with key environmental regulations including RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Color and Intensity Options: The LED lamp series is available in different colors and luminous intensity grades.

1.2 Target Applications

This LED is designed for integration into a variety of consumer and industrial electronics where indicator lights or backlighting are required. Typical application areas include:

• Television Sets
• Computer Monitors
• Telephones
• Personal Computers and Peripherals

2. Technical Parameter Analysis

This section provides a detailed, objective analysis of the electrical, optical, and thermal parameters specified for the LED. All ratings are specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (IFP): 160 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Electrostatic Discharge (ESD) Withstand: 2000 V (Human Body Model). Proper ESD handling procedures are mandatory.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause immediate failure.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate.
• Operating Temperature Range (Topr): -40°C to +85°C.
• Storage Temperature Range (Tstg): -40°C to +100°C.
• Soldering Temperature (Tsol): 260°C for 5 seconds maximum during reflow or hand soldering.

2.2 Electro-Optical Characteristics

These parameters define the typical performance of the LED under normal operating conditions (IF=20mA, Ta=25°C).

• Luminous Intensity (Iv): 1000 mcd (Min), 2500 mcd (Typ). This high intensity is characteristic of hyper red AlGaInP LEDs. Measurement uncertainty is ±10%.
• Viewing Angle (2θ1/2): 6° (Typical). This is a very narrow viewing angle, producing a highly directional beam.
• Peak Wavelength (λp): 632 nm (Typical). The wavelength at which the spectral radiant intensity is maximum.
• Dominant Wavelength (λd): 624 nm (Typical). The single wavelength perceived by the human eye. Measurement uncertainty is ±1.0 nm.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typical). The spectral width at half the maximum intensity.
• Forward Voltage (VF): 2.0 V (Typical), 2.4 V (Maximum) at 20mA. Measurement uncertainty is ±0.1V.
• Reverse Current (IR): 10 μA (Maximum) at VR=5V.

2.3 Thermal Characteristics

While not explicitly listed in a separate table, thermal management is critical. The power dissipation (Pd) of 60 mW and the operating temperature range imply that proper PCB layout for heat sinking is necessary, especially when operating at or near the maximum forward current. The performance curves show the relationship between ambient temperature and forward current/intensity.

3. Binning and Selection System

The datasheet indicates that the product is available with different intensities and colors. The packing specification labels refer to ranking systems for key parameters, allowing for selection based on application needs:

• CAT: Ranks of Luminous Intensity. Allows selection of brightness grades.
• HUE: Ranks of Dominant Wavelength. Allows selection within a specific color/wavelength bin.
• REF: Ranks of Forward Voltage. Useful for designs requiring tight voltage matching.

Consult the manufacturer's detailed binning documentation for specific code definitions and available ranges.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves which are essential for circuit design and understanding performance under non-standard conditions.

4.1 Relative Intensity vs. Wavelength

This graph shows the spectral power distribution, peaking at approximately 632 nm with a bandwidth (FWHM) of about 20 nm, confirming the hyper red color.

4.2 Directivity Pattern

The polar plot illustrates the 6° typical viewing angle, showing very high intensity in the forward direction with rapid fall-off.

4.3 Forward Current vs. Forward Voltage (IV Curve)

This curve is non-linear, typical for diodes. It shows the relationship between applied voltage and resulting current. The typical Vf of 2.0V at 20mA is visible. Designers must use a current-limiting resistor or constant current driver.

4.4 Relative Intensity vs. Forward Current

Luminous intensity increases with forward current but not linearly. Operating above the recommended current reduces efficiency and lifespan due to increased heat.

4.5 Temperature Dependence Curves

• Relative Intensity vs. Ambient Temperature: Shows that luminous output decreases as ambient temperature increases. This must be factored into designs for high-temperature environments.
• Forward Current vs. Ambient Temperature: Indicates how the forward voltage characteristic shifts with temperature, which can affect the current if driven by a constant voltage source.

5. Mechanical and Package Information

5.1 Package Dimensions

The datasheet provides a detailed dimensional drawing of the LED package. Key notes include:

• All dimensions are in millimeters.
• The height of the flange must be less than 1.5mm (0.059\").
• The default tolerance is ±0.25mm unless otherwise specified.

The drawing specifies the body size, lead spacing, and overall shape, which are critical for PCB footprint design.

5.2 Polarity Identification

The cathode is typically indicated by a visual marker on the package, such as a notch, green dot, or shortened lead. The dimensional drawing should be consulted for the specific marker used on this model.

6. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. The datasheet provides comprehensive instructions.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misalignment during PCB mounting can cause resin cracking and failure.
• Cut leads at room temperature.

6.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Parameters

Hand Soldering: Iron tip temperature max 300°C (30W max). Soldering time max 3 seconds. Maintain a minimum 3mm distance from the solder joint to the epoxy bulb.
Wave/Dip Soldering: Preheat temperature max 100°C (60 sec max). Solder bath temperature max 260°C for 5 seconds. Maintain 3mm minimum distance from joint to bulb.
General Rules: Do not apply stress to leads at high temperature. Do not solder more than once. Protect from shock until cooled to room temperature. Avoid rapid cooling. Always use the lowest effective temperature.

6.4 Cleaning

• Clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely necessary, pre-qualify the process to ensure no damage occurs.

6.5 Heat Management

The note emphasizes that thermal management must be considered during the design stage. The operating current should be de-rated appropriately based on the actual thermal environment of the application to ensure longevity and stable performance.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent damage during shipping and handling:

• Primary Packing: Anti-electrostatic bags.
• Secondary Packing: Inner cartons.
• Tertiary Packing: Outside cartons for bulk shipment.
• Packing Quantity: Typically 200 to 500 pieces per bag, 6 bags per inner carton, and 10 inner cartons per outside carton.

7.2 Label Explanation

Labels on packaging contain codes for traceability and selection: CPN (Customer PN), P/N (Manufacturer PN), QTY, CAT (Intensity rank), HUE (Wavelength rank), REF (Voltage rank), and LOT No.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

This LED must be driven with a current-limiting mechanism. The simplest method is a series resistor. Calculate the resistor value using R = (Vsupply - Vf) / If. For a 5V supply and typical Vf of 2.0V at 20mA: R = (5 - 2.0) / 0.02 = 150 Ω. A constant current driver is recommended for precision and stability, especially over temperature.

8.2 PCB Layout Considerations

• Ensure the footprint matches the package dimensions exactly.
• Provide adequate copper area around the leads for heat dissipation, especially if operating near maximum ratings.
• Maintain the recommended 3mm clearance between the solder pad and the epoxy bulb to prevent thermal damage during soldering.

8.3 Optical Design

The narrow 6° viewing angle makes this LED suitable for applications requiring a focused beam or where light should not spill into adjacent areas. For wider illumination, secondary optics (lenses or diffusers) would be required.

9. Technical Comparison and Differentiation

Compared to standard red GaAsP LEDs, this AlGaInP-based hyper red LED offers significantly higher luminous efficiency and intensity at the same drive current. The narrow viewing angle is a defining characteristic versus wider-angle LEDs used for area illumination. Its compliance with modern environmental standards (Halogen Free, REACH) is a key advantage for products targeting global markets with strict regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating risks immediate or long-term damage and voids warranty. For higher brightness, select an LED from a bin with higher luminous intensity (CAT rank).

Q: The forward voltage is listed as 2.0V typical. What value should I use for my series resistor calculation?
A: For a robust design, use the maximum forward voltage (2.4V) from the datasheet. This ensures the current does not exceed the desired value even if you receive an LED at the high end of the Vf range. Using the typical value may result in over-current for some units.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range is -40°C to +85°C, which covers most outdoor environments. However, the LED itself is not waterproof or UV-stabilized. For outdoor use, it must be placed behind a protective window or lens that provides environmental sealing.

Q: Why is the storage condition so specific (≤30°C/70% RH for 3 months)?
A> SMD components are susceptible to moisture absorption. Exceeding these limits can lead to \"popcorning\" during reflow soldering, where trapped moisture vaporizes and cracks the package. The guidelines ensure solderability and reliability.

11. Practical Design and Usage Case

Case: Designing a status indicator for a network switch. The LED needs to be bright, reliable, and have a long lifespan. The 383-2SURC/S530-A3 is an excellent choice. A designer would: 1) Select the appropriate CAT/HUE bin for consistent color and brightness across all units. 2) Design a PCB footprint exactly per the dimension drawing. 3) Use a constant current driver set to 20mA (or slightly less for longer life) instead of a simple resistor for stable intensity regardless of supply voltage fluctuations. 4) Ensure the PCB layout provides a small thermal relief pad connected to a ground plane to help dissipate heat. 5) Follow the wave soldering profile precisely during assembly to avoid thermal shock.

12. Technology Principle Introduction

This LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the peak wavelength of the emitted light—in this case, in the hyper red region (~624-632 nm). The water-clear epoxy resin acts as a primary lens, shaping the output beam to the specified 6° viewing angle.

13. Technology Trends

The trend in indicator LEDs like this one continues towards higher efficiency (more lumens per watt), which allows for the same brightness at lower current, reducing power consumption and heat generation. There is also a strong drive for miniaturization while maintaining or improving optical performance. Furthermore, the push for broader environmental compliance (beyond RoHS to include Halogen Free, REACH, and conflict-free minerals) is becoming standard across the industry. The development of more robust packaging materials to withstand higher reflow temperatures and harsher environmental conditions is also an ongoing area of focus.