LED Datasheet - PLCC-2 Package - 1.6x0.8mm - Ice Blue Color - 650mcd @ 10mA - 3.0V - Automotive Grade - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness, surface-mount Ice Blue LED in a PLCC-2 package. Designed primarily for demanding automotive interior lighting applications, this component combines reliable performance with industry-standard compliance. The LED features a compact 1608 footprint (1.6mm x 0.8mm), making it suitable for space-constrained designs where consistent, vibrant illumination is required.

The core advantages of this LED include its qualification according to the stringent AEC-Q101 standard for automotive components, ensuring reliability under harsh environmental conditions. It is fully compliant with RoHS, REACH, and halogen-free directives, addressing modern environmental and safety regulations. With a typical luminous intensity of 650 millicandelas (mcd) at a standard drive current of 10mA, it offers excellent brightness for its size.

2. Technical Parameters Deep Analysis

2.1 Photometric and Electrical Characteristics

The key operational parameters define the LED's performance under standard conditions (T_s=25°C). The forward current (I_F) has a recommended operating range of 2mA to 20mA, with 10mA as the typical test condition. At this current, the typical forward voltage (V_F) is 3.00V, with minimum and maximum limits of 2.5V and 3.5V respectively, indicating the expected variation in semiconductor characteristics.

The primary photometric output is defined by luminous intensity (I_V), with a typical value of 650 mcd at 10mA. The minimum and maximum bounds are 330 mcd and 970 mcd, which are directly linked to the binning structure detailed later. The light emission pattern is characterized by a wide 120-degree viewing angle (φ), providing broad, even illumination. The color is specified by Chromaticity coordinates on the CIE 1931 diagram, with typical values of x=0.20 and y=0.25, defining the specific shade of Ice Blue.

2.2 Absolute Maximum Ratings and Thermal Management

These ratings define the limits beyond which permanent damage may occur and are not for continuous operation. The absolute maximum forward current is 20mA, and the power dissipation (P_d) must not exceed 70mW. The device can withstand a surge current (I_FM) of 50mA for very short pulses (t≤10μs, duty cycle 0.005).

Thermal management is critical for LED longevity and performance stability. The junction temperature (T_J) must never exceed 125°C. The operating and storage temperature range is specified from -40°C to +110°C, confirming its suitability for automotive environments. Two thermal resistance values are provided: the real thermal resistance (R_{thJS real}) from junction to solder point is 160 K/W, while the electrical method-derived value (R_{thJS el}) is 140 K/W. These values are essential for calculating the temperature rise during operation based on power dissipation.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. This datasheet details a comprehensive luminous intensity binning structure.

3.1 Luminous Intensity Bins

The luminous intensity is categorized into groups labeled from Q to B. Each group is further divided into three sub-bins: X, Y, and Z, representing low, medium, and high intensity within that group, respectively. For example, Group V covers intensities from 710 mcd to 1120 mcd. The sub-bin VX is 710-820 mcd, VY is 820-970 mcd, and VZ is 970-1120 mcd. The typical value of 650 mcd falls within the UY bin (520-610 mcd) or the lower end of the VX bin, indicating the part number likely corresponds to a specific bin code. This system allows designers to select the precise brightness level required for their application, ensuring visual consistency across multiple units.

4. Performance Curve Analysis

4.1 IV Curve and Relative Luminous Intensity

The graph of Forward Current vs. Forward Voltage shows the classic exponential relationship of a diode. The curve allows designers to determine the required driving voltage for a desired current, which is crucial for designing current-limiting circuits. The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output is approximately linear with current in the lower range but may show signs of efficiency droop (sub-linear increase) as current approaches the maximum rating, emphasizing the importance of operating within the recommended range.

4.2 Temperature Dependence and Chromaticity Stability

The Relative Luminous Intensity vs. Junction Temperature graph is critical for thermal design. It shows that light output decreases as the junction temperature increases. For instance, at 100°C, the relative intensity may drop to around 80-90% of its value at 25°C. This must be accounted for in applications with high ambient temperatures or poor heat sinking.

The Chromaticity Coordinates Shift vs. Junction Temperature graph indicates how the perceived color changes with temperature. A stable color over temperature is vital for applications where color consistency is important. Similarly, the Relative Forward Voltage vs. Junction Temperature graph shows a negative temperature coefficient, where V_F decreases as temperature rises, which can be used in some temperature-sensing circuits.

4.3 Spectral Distribution and Radiation Pattern

The Wavelength Characteristics graph plots the relative spectral power distribution. For an Ice Blue LED, this curve will have a dominant peak in the blue-cyan wavelength region (typically around 470-490nm). The shape and width of this peak determine the color purity. The Typical Diagram Characteristics of Radiation shows the spatial distribution of light intensity (the radiation pattern). The provided polar plot with a 120° viewing angle confirms a Lambertian or near-Lambertian emission pattern, where intensity is highest at 0° (perpendicular to the chip) and falls off to 50% at ±60°.

5. Mechanical and Package Information

5.1 Package Dimensions and Polarity

The LED uses a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package with a 1608 metric footprint (1.6mm length x 0.8mm width). The mechanical drawing (referenced in the contents) would provide exact dimensions for body height, lead spacing, and tolerances. The PLCC-2 package typically has two leads on opposite sides. Correct polarity identification is essential. The datasheet should indicate the cathode marker, which is often a green dot, a notch, a cut corner, or a shorter lead on the package body. Connecting the LED in reverse bias can damage it, as it is not designed for reverse operation (V_R rating is not specified).

5.2 Recommended Soldering Pad Layout

A recommended land pattern (solder pad design) for PCB layout is provided to ensure reliable solder joint formation during reflow soldering. This pattern is typically slightly larger than the component's leads to facilitate good solder wetting and fillet formation while preventing solder bridging. Adhering to this recommendation is important for mechanical strength and thermal transfer from the LED to the PCB, which acts as a heat sink.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The component is rated for a maximum soldering temperature of 260°C for 30 seconds. This refers to the peak temperature measured on the package body or leads during a standard reflow process. A typical reflow profile graph would show the temperature ramp-up, preheat, soak, reflow (with peak temperature), and cooling stages. It is crucial to follow this profile to avoid thermal shock, which can crack the epoxy lens or damage the internal die and wire bonds. The Moisture Sensitivity Level (MSL) is rated 2a, meaning the component can be stored for up to 4 weeks at ≤30°C/60% RH before requiring baking prior to reflow.

7. Packaging and Ordering Information

The part number 1608-IB0100M-AM follows a logical structure: 1608 indicates the package size, IB stands for Ice Blue color, 0100M likely relates to the intensity bin or specific performance grade, and AM may denote automotive grade or a specific version. Ordering information would detail available packaging options, such as tape-and-reel quantities (e.g., 4000 pieces per reel), reel dimensions, and orientation within the tape. Proper handling of ESD-sensitive devices (rated up to 2kV HBM) is emphasized during all assembly stages.

8. Application Suggestions

8.1 Primary Application: Automotive Interior Lighting

The explicit application listed is Automotive Interior Lighting. This includes dashboard backlighting, button illumination, footwell lights, door panel lights, and ambient lighting. The AEC-Q101 qualification, wide operating temperature range (-40°C to +110°C), and high reliability make it specifically suited for the rigorous demands of the automotive industry, where components must withstand vibration, thermal cycling, and long operational lifetimes.

8.2 Design Considerations and Circuit Protection

When designing a driver circuit, always use a constant current source or a current-limiting resistor in series with the LED to prevent thermal runaway, as the forward voltage has a negative temperature coefficient. Calculate the resistor value using R = (V_supply - V_F) / I_F. Ensure the power dissipation (V_F * I_F) does not exceed 70mW, considering the maximum V_F and I_F. For thermal management, ensure adequate copper area on the PCB under and around the LED's solder pads to act as a heat sink, keeping the junction temperature as low as possible to maintain brightness and longevity. Consider the forward current derating curve, which shows the maximum permissible continuous current must be reduced as the solder pad temperature increases.

9. Technical Comparison and Differentiation

Compared to standard commercial-grade LEDs, this component's key differentiators are its AEC-Q101 qualification and extended temperature range, which are non-negotiable for automotive applications. Compared to other automotive LEDs, its PLCC-2 package with a 1608 footprint offers a compact yet robust solution. The typical 650mcd output at 10mA provides high efficiency, potentially allowing for lower drive currents to achieve the same brightness as competitors, thereby reducing power consumption and thermal load. The comprehensive binning structure offers designers tighter control over brightness consistency in their products.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the main purpose of the luminous intensity binning?
A: Binning ensures color and brightness consistency in mass production. By selecting LEDs from the same bin, manufacturers can guarantee uniform appearance across all units in a product, which is especially critical in multi-LED arrays for automotive interiors.

Q: Can I drive this LED with a 3.3V supply without a resistor?
A: No. The typical V_F is 3.0V, but it can be as low as 2.5V. Connecting 3.3V directly could force a current exceeding the absolute maximum rating, potentially destroying the LED instantly. Always use a current-limiting mechanism.

Q: Is this LED suitable for exterior automotive applications like tail lights?
A> While robust, the primary listed application is interior lighting. Exterior lights often have different requirements for luminous flux, color coordinates, and encapsulation for weather resistance. Always consult the application notes or manufacturer for exterior use suitability.

Q: How does the 120° viewing angle affect the design?
A: A wide viewing angle is ideal for area illumination and applications where the LED might be viewed from off-axis angles (e.g., dashboard icons). If a more focused beam is needed, secondary optics (lenses) would be required.

11. Practical Design and Usage Case

Case: Designing an Ambient Footwell Light for a Vehicle. A designer needs to illuminate the driver and passenger footwells with a soft Ice Blue glow. They plan to use two LEDs per footwell. Based on the binning table, they select LEDs from bin VY (820-970 mcd) to ensure sufficient but not excessive brightness. They design a circuit powered from the vehicle's 12V system. Using the typical V_F of 3.0V and targeting I_F of 10mA for long life, they calculate a series resistor: R = (12V - 3.0V) / 0.01A = 900 Ohms. A standard 910 Ohm resistor is chosen. They lay out the PCB with generous copper pours connected to the LED pads to dissipate heat, ensuring the solder pad temperature stays below 70°C to allow full 20mA capability if future adjustments are needed. They follow the recommended reflow profile during assembly to ensure reliability.

12. Operating Principle Introduction

This is a semiconductor light-emitting diode (LED). Its core is a chip made of compound semiconductor materials (typically based on InGaN for blue/cyan colors). When a forward voltage exceeding the diode's threshold is applied, electrons and holes are injected into the active region of the semiconductor from opposite sides. When these charge carriers recombine, they release energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The epoxy lens of the PLCC package encapsulates the chip, provides mechanical protection, and shapes the light output beam (achieving the 120° viewing angle). The internal structure includes a reflective cup to direct light upward and a bond wire for electrical connection.

13. Technology Trends and Developments

The trend in automotive LED lighting is towards higher efficiency (more lumens per watt), which reduces electrical load and heat generation. This allows for brighter displays or lower energy consumption. There is also a drive for miniaturization, with packages shrinking further while maintaining or increasing light output. Enhanced reliability and longer lifetimes under high-temperature operation continue to be critical research areas. Furthermore, integration is a key trend, with LED packages incorporating driver ICs, sensors, or multiple color chips (RGB) into single modules for smart lighting systems. The move towards standardized color bins and tighter tolerances ensures consistency for automotive manufacturers using parts from multiple suppliers.