LTE-C216R-14 IR Emitter and Detector Datasheet - 1206 Package - 850nm Wavelength - 60mA Current - English Technical Documentation

1. Product Overview

The LTE-C216R-14 is a surface-mount infrared (IR) emitter and detector component designed for integration into modern electronic assemblies. Its primary function is to emit and detect infrared light at a peak wavelength of 850 nanometers, making it suitable for a variety of sensing, data transmission, and proximity detection applications. The device is housed in a compact 1206 package, which is a standard EIA footprint, ensuring broad compatibility with automated manufacturing processes and existing PCB layouts.

The core advantages of this component include its compatibility with high-volume, automated placement equipment and its robustness in standard infrared reflow soldering processes. This makes it an ideal choice for cost-effective mass production. Furthermore, it is compliant with RoHS (Restriction of Hazardous Substances) directives, classifying it as a green product, which is increasingly important for global market access and environmental compliance.

The target market for this device spans consumer electronics, industrial automation, communication equipment, and office machinery. Its reliability and standardized package make it a versatile building block for designers requiring a dependable IR solution.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

Operating any electronic component beyond its absolute maximum ratings can cause permanent damage. For the LTE-C216R-14, these limits are defined at an ambient temperature (T_A) of 25°C.

• Power Dissipation (P_D): 100 mW. This is the maximum amount of power the device can safely dissipate as heat.
• Peak Forward Current (I_FP): 800 mA. This is the maximum allowable instantaneous current, typically specified under pulsed conditions (300 pulses per second, 10 μs pulse width) to prevent thermal overstress during short bursts.
• Continuous Forward Current (I_F): 60 mA. This is the maximum DC current that can be applied continuously without degrading performance or lifespan.
• Reverse Voltage (V_R): 5 V. Applying a reverse bias voltage higher than this can break down the semiconductor junction.
• Operating Temperature Range: -40°C to +85°C. The device is guaranteed to function within this environmental temperature range.
• Storage Temperature Range: -55°C to +100°C. The component can be stored without degradation within these limits.
• Infrared Soldering Condition: Withstands 260°C for 10 seconds. This defines its tolerance for lead-free (Pb-free) reflow soldering profiles.

2.2 Electrical & Optical Characteristics

The key performance parameters are measured at T_A=25°C under specified test conditions, providing a benchmark for design calculations.

• Radiant Intensity (I_E): 4 (Min) to 13 (Max) mW/sr, with a typical value provided. Measured at a forward current (I_F) of 20 mA. This parameter quantifies the optical power emitted per unit solid angle (steradian).
• Peak Emission Wavelength (λ_Peak): 850 nm (Typical). This is the wavelength at which the emitter outputs its maximum optical power. It is a critical parameter for matching with the spectral sensitivity of photodetectors.
• Spectral Line Half-Width (Δλ): 50 nm (Typical). This indicates the bandwidth of the emitted light, showing how much the wavelength spreads around the peak.
• Forward Voltage (V_F): 1.6 V (Typical), 2.0 V (Maximum) at I_F = 50 mA. This is the voltage drop across the device when conducting. It is essential for designing the current-limiting circuitry.
• Reverse Current (I_R): 10 μA (Maximum) at V_R = 5V. This is the small leakage current that flows when the device is reverse-biased.
• Rise/Fall Time (T_r/T_f): 30 ns (Typical). This specifies how quickly the optical output can switch on and off (measured from 10% to 90% of the output), determining the maximum possible modulation speed for data transmission.
• Viewing Angle (2θ_1/2): 75 degrees (Typical). This is the full angle at which the radiant intensity drops to half of its maximum value (on-axis). A wider angle provides broader spatial coverage but lower intensity at any specific point.

3. Performance Curve Analysis

The datasheet references typical electrical and optical characteristic curves. While the specific graphs are not reproduced in the text, their purpose is to provide visual insight into device behavior under varying conditions.

These curves typically include:

• I-V (Current-Voltage) Curve: Shows the relationship between forward current and forward voltage, which is non-linear for LEDs. This helps in determining the dynamic resistance and the necessary drive voltage for a target current.
• Radiant Intensity vs. Forward Current: Illustrates how the optical output power increases with drive current. It is generally linear within the operating range but may saturate at very high currents.
• Peak Wavelength vs. Temperature: Demonstrates how the emitted wavelength shifts with changes in junction temperature, which is crucial for temperature-sensitive applications.
• Viewing Angle Pattern: A polar plot showing the spatial distribution of the emitted light intensity.

Engineers use these curves to optimize their design, ensuring the device operates in its most efficient and reliable region, and to predict performance under non-standard conditions.

4. Mechanical & Packaging Information

4.1 Package Dimensions

The component uses a standard 1206 package footprint. The datasheet provides detailed mechanical drawings with all critical dimensions in millimeters. Key dimensions include the overall length, width, and height of the component body, as well as the placement and size of the solder pads on the device itself. The tolerance for these dimensions is typically ±0.10 mm unless otherwise specified. Adherence to these dimensions is vital for successful PCB land pattern design and automated assembly.

4.2 Suggested Soldering Pad Layout

A recommended solder pad footprint for the PCB is provided. This layout is engineered to ensure a reliable solder joint formation during reflow, minimizing issues like tombstoning (component standing on end) or insufficient solder. Following these recommended pad dimensions, which are usually slightly larger than the component's terminals to allow for proper solder fillet formation, is a best practice for manufacturability and long-term reliability.

4.3 Tape and Reel Packaging

For automated assembly, the components are supplied in 8mm tape on 7-inch diameter reels. Each reel contains 3000 pieces. The tape and reel specifications comply with ANSI/EIA 481-1-A-1994 standards, ensuring compatibility with standard pick-and-place machines. Notes specify that empty component pockets are sealed with cover tape and that a maximum of two consecutive missing components ("lamps") is allowed per reel, which are standard quality assurances for tape-and-reel packaging.

5. Soldering & Assembly Guidelines

5.1 Reflow Soldering Profile

The device is qualified for infrared (IR) reflow soldering processes, specifically those using lead-free (Pb-free) solder. A suggested reflow profile is provided, with key parameters including a pre-heat stage (150-200°C), a maximum peak temperature of 260°C, and a time above liquidus (typically around 217°C for Pb-free solder) not exceeding 10 seconds. The datasheet emphasizes that the optimal profile depends on the specific PCB design, components, solder paste, and oven, and recommends using JEDEC-standard profiles as a baseline while adhering to solder paste manufacturer specifications.

5.2 Hand Soldering

If hand soldering is necessary, it should be performed with a soldering iron tip temperature not exceeding 300°C, and the contact time should be limited to a maximum of 3 seconds. This should be done only once to prevent thermal damage to the plastic package and the internal semiconductor die.

5.3 Cleaning

If post-solder cleaning is required, only specified cleaning agents should be used. The datasheet explicitly warns against using unspecified chemical liquids, which could damage the package material. Recommended cleaning methods include immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute.

5.4 Storage & Handling

Moisture sensitivity is a critical factor for surface-mount devices. The LEDs are shipped in a moisture-proof barrier bag with desiccant. While sealed, they should be stored at ≤30°C and ≤90% relative humidity (RH) and used within one year. Once the original bag is opened, the storage environment should not exceed 30°C and 60% RH. Components removed from the sealed bag should ideally be reflow-soldered within one week. For longer storage outside the original packaging, they must be stored in a sealed container with desiccant or in a nitrogen ambient. Components stored for more than a week outside the dry bag require a baking procedure (approximately 60°C for at least 20 hours) to remove absorbed moisture before soldering to prevent "popcorning" damage during reflow.

6. Application Suggestions

6.1 Typical Application Scenarios

The LTE-C216R-14 is intended for ordinary electronic equipment. Common applications include:

• Proximity Sensors: Detecting the presence or absence of an object by reflecting its IR light.
• Optical Switches: Interrupting an IR beam to detect motion or position.
• Data Transmission: Simple infrared data links (e.g., remote controls, short-range serial communication) by modulating the drive current.
• Object Counting: In automation lines where objects break a beam.
• Integration into office equipment, communication devices, and household appliances.

The datasheet includes a crucial caution: For applications where failure could jeopardize life or health (aviation, medical devices, safety systems), consultation with the manufacturer is required before design-in.

6.2 Drive Circuit Design

A fundamental principle for using LEDs is highlighted: they are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, the datasheet strongly recommends using a individual current-limiting resistor in series with each LED (Circuit Model A). This compensates for minor variations in the forward voltage (V_F) characteristic from device to device. Connecting LEDs directly in parallel without individual resistors (Circuit Model B) is discouraged, as the LED with the slightly lower V_F will draw disproportionately more current, leading to uneven brightness and potential overstress of that device.

7. Technical Comparison & Differentiation

While a direct side-by-side comparison with other part numbers is not provided in this standalone datasheet, the LTE-C216R-14's key differentiating features can be inferred:

• Standardized Footprint (1206/EIA): Offers easy drop-in replacement and design familiarity compared to proprietary packages.
• Pb-Free & RoHS Compliant: Meets modern environmental regulations, which may not be true for older or niche components.
• Automation-Friendly: Its tape-and-reel packaging and compatibility with pick-and-place and reflow processes make it highly suitable for cost-effective, high-volume manufacturing.
• Balanced Performance: With a 75-degree viewing angle, 850nm wavelength, and 30ns speed, it provides a well-rounded set of characteristics for general-purpose IR applications.

8. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this IR LED directly from a 5V microcontroller pin?
A: No. The typical forward voltage is 1.6V at 50mA. Connecting it directly to a 5V pin would attempt to force a very high, destructive current through it. You must use a series current-limiting resistor. For example, to achieve 20mA from a 5V supply: R = (5V - 1.6V) / 0.02A = 170Ω (use a standard 180Ω or 150Ω resistor).

Q2: What is the maximum data rate possible with this emitter?
A: The rise/fall time of 30 ns suggests a theoretical maximum modulation bandwidth in the tens of MHz range. However, practical data rates for reliable communication are lower, often in the hundreds of kbps to a few Mbps, depending on the driver circuit, detector, and environmental noise.

Q3: Why is the storage condition after opening the bag so strict (≤60% RH)?
A: Surface-mount plastic packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating internal pressure that can crack the package or delaminate internal connections—a failure known as "popcorning." The strict storage conditions and baking requirements are preventive measures against this.

Q4: How do I interpret the Radiant Intensity value (mW/sr)?
A: It measures optical power density. A value of 10 mW/sr means the device emits 10 milliwatts of optical power into a one-steradian cone of space in the direction it's pointing. To find total power, you would integrate this intensity over the entire viewing angle (75 degrees, or ~1.84 sr).

9. Design-in Case Study

Scenario: Designing a paper presence sensor for a printer.
Goal: Detect when paper is in the feed tray.
Implementation: Place the LTE-C216R-14 emitter on one side of the paper path and a matching photodetector (or use the detector part of a similar component) directly opposite. When paper is absent, the IR beam reaches the detector, generating a signal (e.g., logic HIGH). When paper is present, it blocks the beam, causing the detector signal to drop (logic LOW).
Design Considerations:

• Current Setting: Drive the emitter at 20mA using a series resistor for consistent, long-life output.
• Alignment: The 75-degree viewing angle provides some tolerance for mechanical misalignment.
• Ambient Light Immunity: Since it uses modulated 850nm light, the system can be made resistant to ambient light interference by adding a simple modulation/demodulation circuit or using a detector with a daylight filter.
• Soldering: Follow the recommended reflow profile to ensure reliable connections on the PCB without damaging the component.

10. Operating Principle

An Infrared Light Emitting Diode (IR LED) operates on the principle of electroluminescence in a semiconductor material. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, they release energy. In an IR LED, the semiconductor bandgap is engineered so that this released energy corresponds to a photon in the infrared spectrum (around 850nm for this device). The generated photons are emitted as light. The detector function, if applicable in a paired component, works in reverse: incident infrared photons with sufficient energy create electron-hole pairs in the semiconductor of a photodiode, generating a measurable photocurrent when reverse-biased.

11. Technology Trends

The field of optoelectronics continues to evolve. Trends relevant to components like the LTE-C216R-14 include:

• Increased Integration: Moving towards combining the emitter, detector, and control logic (like a modulated driver and signal conditioner) into a single package for simpler system design.
• Higher Efficiency: Development of semiconductor materials and structures that convert more electrical input into optical output, reducing power consumption and heat generation.
• Miniaturization: While the 1206 package is standard, there is a push for even smaller footprints (e.g., 0805, 0603) to save PCB space in increasingly compact devices.
• Enhanced Reliability: Improvements in packaging materials and processes to withstand higher reflow temperatures and harsher environmental conditions, extending product lifespan.
• Smart Sensing: Incorporating basic intelligence at the component level, such as ambient light cancellation or digital output, to simplify interfacing with microcontrollers.

These trends aim to provide designers with more capable, reliable, and easier-to-use building blocks for the next generation of electronic products.