Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electrical & Optical Characteristics
- 3. Performance Curve Analysis
- 4. Mechanical & Packaging Information
- 4.1 Outline Dimensions
- 4.2 Suggested Soldering Pad Dimensions
- 4.3 Package Dimensions of Tape and Reel
- 5. Soldering & Assembly Guidelines
- 5.1 Storage Conditions
- 5.2 Soldering Parameters
- 5.3 Cleaning
- 6. Application Notes & Design Considerations
- 6.1 Drive Circuit Design
- 6.2 Application Scope and Cautions
- 6.3 Typical Application Scenarios
- 7. Operating Principle
- 8. Packaging and Ordering Information
- 9. FAQs Based on Technical Parameters
- 10. Design and Usage Case Example
1. Product Overview
The LTR-S971-TB is a discrete infrared (IR) phototransistor component designed for sensing applications. It belongs to a broad family of optoelectronic devices intended for use in environments requiring reliable detection of infrared light. The primary function of this component is to convert incident infrared radiation into an electrical signal, specifically a collector current proportional to the received IR power density.
Its core advantages include a side-viewing dome lens housed in a black package, which helps in directing the field of view and potentially reducing interference from ambient light from other angles. The device is packaged for modern assembly processes, being supplied on 8mm tape on 13-inch diameter reels, making it compatible with automatic placement equipment and infrared reflow soldering processes. It is also compliant with RoHS and green product standards.
The target markets and applications for this phototransistor are primarily in consumer electronics and industrial sensing. Key application areas include serving as an infrared receiver in systems like remote controls and enabling PCB-mounted infrared sensing for functions such as proximity detection, object sensing, and basic data transmission links where IR is the medium.
2. In-Depth Technical Parameter Analysis
The performance of the LTR-S971-TB is defined by a set of absolute maximum ratings and detailed electrical/optical characteristics, all specified at an ambient temperature (TA) of 25°C.
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.
- Power Dissipation (Pd): 100 mW. This is the maximum power the device can dissipate as heat.
- Collector-Emitter Voltage (VCE): 30 V. The maximum voltage that can be applied between the collector and emitter terminals.
- Emitter-Collector Voltage (VEC): 5 V. The maximum reverse voltage applicable between emitter and collector.
- Operating Temperature Range (Top): -40°C to +85°C. The ambient temperature range for reliable device operation.
- Storage Temperature Range (Tstg): -55°C to +100°C. The temperature range for non-operational storage.
- Infrared Soldering Condition: Withstands 260°C for a maximum of 10 seconds, defining its reflow soldering capability.
2.2 Electrical & Optical Characteristics
These parameters define the device's performance under specified test conditions, representing typical operational behavior.
- Collector-Emitter Breakdown Voltage (V(BR)CEO): 30 V (Min). Measured with a reverse leakage current (IR) of 100µA and no incident IR illumination (Ee = 0 mW/cm²).
- Emitter-Collector Breakdown Voltage (V(BR)ECO): 5 V (Min). Measured with IE = 100µA and no illumination.
- Collector-Emitter Saturation Voltage (VCE(SAT)): 0.4 V (Max). The voltage across the device when it is fully "on," tested at IC = 100µA under an irradiance of 0.5 mW/cm².
- Rise Time (Tr) & Fall Time (Tf): 15 µs (Typ). These switching speed parameters are measured with VCE=5V, IC=1mA, and RL=1kΩ, indicating its suitability for moderate-speed detection.
- Collector Dark Current (ICEO): 100 nA (Max). The leakage current flowing from collector to emitter when no light is present, at VCE=20V. A lower value is better for signal-to-noise ratio.
- On-State Collector Current (IC(ON)): 4.0 mA (Typ). The output current when the device is illuminated, tested at VCE=5V under an irradiance of 0.5 mW/cm² from a 940nm source. This is a key sensitivity parameter.
3. Performance Curve Analysis
The datasheet references a section for typical electrical/optical characteristic curves. These graphical representations are crucial for design engineers to understand device behavior beyond single-point specifications.
While the specific curves are not detailed in the provided text, typical plots for a phototransistor like the LTR-S971-TB would include:
- Collector Current (IC) vs. Collector-Emitter Voltage (VCE): A family of curves parameterized by different levels of incident infrared irradiance (Ee). This shows the output characteristics and the saturation region.
- Collector Current (IC) vs. Incident Irradiance (Ee): This plot, often at a fixed VCE, demonstrates the linearity (or non-linearity) of the phototransistor's response to light intensity, which is central to its sensitivity.
- Spectral Response: A curve showing the relative sensitivity of the device across different wavelengths of light. While the test condition specifies 940nm, this curve would show the peak response wavelength and the bandwidth of sensitivity, important for filtering out unwanted light sources.
- Temperature Dependence: Graphs showing how key parameters like dark current (ICEO) and collector current (IC) vary with ambient temperature, which is critical for designs operating outside room temperature.
4. Mechanical & Packaging Information
4.1 Outline Dimensions
The device features a side-view package with a dome lens. All dimensions are provided in millimeters with a standard tolerance of ±0.1 mm unless otherwise specified. The exact mechanical drawing defines the body size, lead spacing, lens position, and overall footprint critical for PCB layout.
4.2 Suggested Soldering Pad Dimensions
A recommended land pattern (footprint) for the PCB is provided. Adhering to these dimensions ensures proper solder joint formation, mechanical stability, and thermal relief during the soldering process.
4.3 Package Dimensions of Tape and Reel
Detailed drawings specify the carrier tape dimensions (pocket size, pitch), cover tape, and reel dimensions. This information is essential for automated assembly line setup. Key specifications noted are a 13-inch reel containing 9000 pieces, with a maximum of two consecutive missing components allowed, following ANSI/EIA 481-1-A-1994 standards.
5. Soldering & Assembly Guidelines
5.1 Storage Conditions
The device is moisture-sensitive. In its sealed moisture-proof bag with desiccant, it should be stored at ≤30°C and ≤90% RH and used within one year. Once opened, the storage environment must not exceed 30°C and 60% RH. Components out of their original packaging for more than one week should be baked at approximately 60°C for at least 20 hours before soldering to prevent "popcorning" during reflow.
5.2 Soldering Parameters
Reflow Soldering: A JEDEC-compliant profile is recommended.
- Pre-heat: 150–200°C for a maximum of 120 seconds.
- Peak Temperature: Maximum of 260°C.
- Time above 260°C: Maximum of 10 seconds, with a maximum of two reflow cycles allowed.
- Iron Temperature: Maximum of 300°C.
- Contact Time: Maximum of 3 seconds per joint.
5.3 Cleaning
If cleaning is necessary after soldering, only alcohol-based solvents like isopropyl alcohol should be used.
6. Application Notes & Design Considerations
6.1 Drive Circuit Design
A phototransistor is fundamentally a current-output device. The datasheet provides crucial guidance for driving multiple devices. Circuit Model (A) is the recommended configuration, where each phototransistor has its own series current-limiting resistor connected to the supply voltage. This ensures intensity uniformity by compensating for minor variations in the current-voltage (I-V) characteristics between individual devices. Circuit Model (B), where multiple devices share a single resistor, is discouraged as it can lead to uneven brightness or current sharing due to device mismatches.
6.2 Application Scope and Cautions
The component is intended for standard electronic equipment (office, communications, household). The datasheet includes a specific caution against using it in safety-critical or high-reliability applications—such as aviation, medical life-support, or transportation control systems—without prior consultation and qualification, as failure could jeopardize life or health.
6.3 Typical Application Scenarios
- Infrared Remote Control Receivers: Detecting modulated IR signals from remotes.
- Proximity and Object Detection: Sensing the presence or absence of an object by detecting reflected or blocked IR light.
- Basic IR Data Links: For short-range, low-speed wireless data transmission.
- Security Alarm Sensors: As part of a beam-break or reflection-based intrusion detection system.
7. Operating Principle
A phototransistor operates on the principle of the photoelectric effect within a bipolar junction transistor (BJT) structure. Incident photons with sufficient energy (in the infrared spectrum for this device) are absorbed in the base-collector junction region, generating electron-hole pairs. These photogenerated carriers are effectively amplified by the transistor's current gain (beta, β). The base terminal is often left unconnected or is used with a resistor for bias control. The resulting output is a collector current (IC) that is much larger than the primary photocurrent, providing inherent signal amplification. The side-view lens focuses and directs incoming IR light onto the sensitive semiconductor area, defining the device's field of view.
8. Packaging and Ordering Information
The standard packaging is 9000 pieces per 13-inch reel. The tape and reel specifications comply with ANSI/EIA standards to ensure compatibility with automated pick-and-place machinery. The part number LTR-S971-TB uniquely identifies this specific variant (likely indicating package type 'TB' for side-view).
9. FAQs Based on Technical Parameters
Q: What is the typical response speed of this sensor?
A: The typical rise and fall times are 15 microseconds, making it suitable for detecting modulated IR signals common in remote controls, which typically operate at carrier frequencies like 38 kHz.
Q: How sensitive is the LTR-S971-TB?
A: Under a test condition of 0.5 mW/cm² at 940nm and VCE=5V, it typically provides 4.0 mA of collector current. The lower the irradiance needed to produce a usable output current, the higher the sensitivity.
Q: Can I use it outdoors or in high-temperature environments?
A: Its operating temperature range is -40°C to +85°C, allowing for use in a wide range of environments. However, designers must consider the temperature dependence of its dark current and output current, which can affect signal-to-noise ratio at extremes.
Q: Why is a separate resistor needed for each phototransistor in parallel?
A: Due to natural manufacturing variations, the I-V characteristics of individual phototransistors differ slightly. A shared resistor forces them to have the same voltage, which can cause significant current imbalance. Individual resistors allow each device to self-bias, ensuring more uniform current sharing and performance.
10. Design and Usage Case Example
Scenario: Designing a simple object counter using an IR break-beam sensor.
- Setup: An IR emitter (IRED) is placed on one side of a conveyor belt, and the LTR-S971-TB phototransistor is placed directly opposite.
- Circuit: The phototransistor is configured in a common-emitter setup. A pull-up resistor (e.g., 1kΩ to 10kΩ) is connected from the collector to VCC (e.g., 5V). The emitter is connected to ground. The output signal is taken from the collector node.
- Operation: When the IR beam is uninterrupted, the phototransistor is illuminated, causing it to conduct and pull the collector voltage low (near VCE(SAT)). When an object breaks the beam, the illumination ceases, the phototransistor turns off, and the collector voltage is pulled high by the resistor.
- Signal Processing: This digital voltage transition (low-to-high) can be fed into a microcontroller's digital input pin or a comparator to trigger a counting routine.
- Design Considerations: The value of the pull-up resistor affects the switching speed and current consumption. Ambient IR light (e.g., from sunlight) can cause false triggers, so the system may require optical filtering, housing to shield ambient light, or modulation/demodulation of the IR beam.
Note: Product appearance and specifications are subject to change without notice for improvement.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |