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LTR-516AB Infrared Phototransistor Datasheet - Package Dimensions - Reverse Voltage 30V - Wavelength 940nm - English Technical Documentation

Complete technical datasheet for the LTR-516AB silicon NPN phototransistor. Features include high photosensitivity, low junction capacitance, fast switching, and a dark blue package for infrared applications.
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PDF Document Cover - LTR-516AB Infrared Phototransistor Datasheet - Package Dimensions - Reverse Voltage 30V - Wavelength 940nm - English Technical Documentation

1. Product Overview

The LTR-516AB is a silicon NPN phototransistor specifically designed for infrared (IR) detection applications. Its core function is to convert incident infrared light into an electrical current. A key feature is its special dark blue plastic epoxy package, which acts as a visible light filter. This design significantly reduces the sensor's sensitivity to ambient visible light, making it highly suitable for applications that rely purely on infrared signals, such as remote control systems, object detection, and IR data transmission.

The device offers a combination of high photosensitivity and fast response times, enabling reliable detection of modulated IR signals. Its low junction capacitance contributes to a high cut-off frequency, which is beneficial for high-speed switching applications.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. The LTR-516AB can withstand a maximum reverse voltage (VR) of 30V. Its maximum power dissipation is 150 mW at an ambient temperature (TA) of 25°C. The device is rated for operation within a temperature range of -40°C to +85°C and can be stored in environments from -55°C to +100°C. For soldering, the leads can tolerate 260°C for up to 5 seconds when measured 1.6mm from the package body.

2.2 Electro-Optical Characteristics

These parameters are measured under specific test conditions at TA=25°C and define the device's performance.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

3.1 Dark Current vs. Reverse Voltage

Figure 1 shows the relationship between reverse dark current (ID) and applied reverse voltage (VR). The dark current remains very low (in the pA to low nA range) across the specified voltage range, which is essential for maintaining a good signal-to-noise ratio in low-light detection.

3.2 Capacitance vs. Reverse Voltage

Figure 2 depicts how the junction capacitance (Ct) decreases as the reverse bias voltage increases. This is a typical characteristic of PN junctions. Operating at a higher reverse bias can reduce capacitance, thereby improving the high-frequency response.

3.3 Temperature Dependence

Figure 3 shows that the photocurrent (IP) has a positive temperature coefficient; it generally increases with ambient temperature for a constant irradiance level. Figure 4 illustrates that the dark current (ID) increases exponentially with temperature. Designers must account for these variations in applications with wide operating temperature ranges.

3.4 Spectral Response

Figure 5 is a critical graph showing the relative spectral sensitivity versus wavelength. The response peaks around 900 nm and extends from roughly 700 nm to 1100 nm, covering the near-infrared spectrum. The dark blue package effectively attenuates sensitivity below approximately 700 nm (visible light).

3.5 Photocurrent vs. Irradiance

Figure 6 demonstrates the linear relationship between generated photocurrent (IP) and incident infrared irradiance (Ee) at 940 nm. This linearity is important for analog sensing applications.

3.6 Derating Curve

Figure 8 presents the total power dissipation derating curve versus ambient temperature. The maximum allowable power dissipation decreases linearly as the ambient temperature rises above 25°C. This curve is vital for ensuring reliable operation and preventing thermal runaway.

4. Mechanical and Package Information

4.1 Package Dimensions

The LTR-516AB comes in a standard 3mm radial leaded package. Key dimensions include a body diameter, lead spacing, and overall length. The dark blue epoxy resin is molded into a lens shape. A small flange is present on the package body, with a note that protruded resin under this flange has a maximum height of 1.5mm. Lead spacing is measured at the point where the leads emerge from the package. All dimensional tolerances are ±0.25mm unless otherwise specified.

4.2 Polarity Identification

The longer lead is typically the collector, and the shorter lead is the emitter. The flat side on the package rim may also serve as a visual indicator for proper orientation. Always refer to the package diagram for definitive pin identification.

5. Soldering and Assembly Guidelines

The device is suitable for wave soldering or hand soldering processes. The absolute maximum rating specifies that the leads can withstand 260°C for 5 seconds when measured 1.6mm (.063\") from the package body. It is recommended to use a soldering iron with temperature control and to minimize the total heat exposure time to prevent damage to the epoxy package or the internal semiconductor die. Avoid applying mechanical stress to the leads during and after soldering.

6. Application Suggestions

6.1 Typical Application Circuits

The LTR-516AB is commonly used in a simple common-emitter configuration. The collector is connected to a positive supply voltage (VCC) through a load resistor (RL). The emitter is connected to ground. When IR light falls on the phototransistor, it turns on, causing a voltage drop across RL. This voltage signal can be fed into a comparator, microcontroller ADC, or amplifier for further processing. The value of RL affects gain, bandwidth, and output swing; a 1 kΩ resistor is used in the rise/fall time test condition.

6.2 Design Considerations

7. Technical Comparison and Differentiation

The primary differentiating feature of the LTR-516AB is its dark blue package, which is not found on standard clear or water-clear phototransistors. This built-in filter makes it superior for IR-only applications by simplifying optical design. Compared to photodiodes, phototransistors provide internal gain, resulting in higher output current for the same light level, but typically have slower response times. The LTR-516AB's 50 ns rise/fall time positions it well for medium-speed IR communication protocols.

8. Frequently Asked Questions (FAQ)

Q: What is the purpose of the dark blue package?

A: It acts as a filter to block most visible light, allowing primarily infrared light to reach the semiconductor chip. This enhances performance in IR systems by reducing noise from ambient visible light.

Q: Can I use this sensor for detecting visible light?

A: No, its sensitivity in the visible spectrum is severely attenuated by the package filter. It is specifically designed for infrared detection.

Q: How do I choose the value of the load resistor (RL)?

A: The choice involves a trade-off. A higher RL gives more output voltage per unit photocurrent (higher gain) but increases the RC time constant, slowing down the response. Start with the 1 kΩ value from the test condition and adjust based on your required speed and signal level.

Q: What is the difference between short circuit current (IS) and photocurrent in a circuit?

A: IS is a parameter measured under specific short-circuit conditions. In a practical circuit with a load resistor, the output current will be slightly less due to the internal resistance of the transistor and the applied bias.

9. Operational Principle

A phototransistor is a bipolar junction transistor (BJT) where the base-collector junction is exposed to light. Incident photons with energy greater than the semiconductor's bandgap generate electron-hole pairs in the depletion region of this junction. These carriers are swept by the electric field, creating a base current. This photogenerated base current is then amplified by the transistor's current gain (hFE), resulting in a much larger collector current. Thus, a small light signal controls a larger output current.

10. Development Trends

The field of optoelectronics continues to advance towards higher integration, smaller packages (like surface-mount devices), and improved performance. Trends include phototransistors and photodiodes integrated with amplification and signal conditioning circuits on a single chip (opto-ICs), reducing system complexity. There is also ongoing development in materials and packaging to enhance sensitivity, speed, and wavelength selectivity for emerging applications in sensing, LiDAR, and optical communications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.