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LTR-X1503 Optical Sensor Datasheet - Integrated ALS & PS - I2C Interface - 3.0-3.6V - English Technical Document

Complete technical datasheet for the LTR-X1503, an integrated ambient light sensor (ALS) and proximity sensor (PS) with I2C interface, low power consumption, and programmable interrupt features.
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PDF Document Cover - LTR-X1503 Optical Sensor Datasheet - Integrated ALS & PS - I2C Interface - 3.0-3.6V - English Technical Document

1. Product Overview

The LTR-X1503 is a highly integrated, low-voltage optical sensor combining an ambient light sensor (ALS) and a proximity sensor (PS) with a built-in infrared emitter into a single, miniature, chipled, lead-free surface-mount package. This integration simplifies design and saves board space in compact electronic devices.

The core advantage of this sensor lies in its dual functionality. The ALS provides a linear photometric response over a wide dynamic range, making it suitable for applications ranging from very dark to extremely bright ambient lighting conditions. Simultaneously, the built-in proximity sensor can detect the presence or absence of an object at a user-configurable distance, enabling features like display blanking during phone calls or touchscreen deactivation.

The device is primarily targeted at mobile, computing, and consumer electronics markets. Its ultra-small form factor, low power consumption with sleep mode capability, and I2C digital interface make it ideal for smartphones, tablets, laptops, wearables, and IoT devices where efficient power management and space are critical constraints.

1.1 Core Features & Advantages

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

Stresses beyond these limits may cause permanent damage to the device.

2.2 Recommended Operating Conditions

For normal device operation.

2.3 Electrical & Optical Specifications

Specifications are typically given at VDD = 1.8V and Ta = 25°C.

2.3.1 Power Characteristics

2.3.2 Ambient Light Sensor (ALS) Characteristics

2.3.3 Proximity Sensor (PS) Characteristics

3. Performance Curve Analysis

3.1 ALS Spectral Response

The sensor's ambient light photodiode is designed with a filter to match the CIE photopic luminosity function, which defines the standard human eye response to light. This ensures that the lux readings reported by the sensor accurately represent the brightness as perceived by a person, rather than just the raw radiant energy. This is crucial for automatic display brightness control that feels natural to the user.

3.2 PS Performance vs. Distance

The proximity sensor's performance is characterized by the reflected signal strength as a function of distance to a standard reflective object (typically 88% reflectance). The relationship is non-linear and follows an inverse square law. The graph shows that with typical settings (e.g., VDD=1.8V, 104mA LED current, 16 pulses), a clear and measurable signal is obtained, allowing reliable detection thresholds to be set for specific application distances (e.g., 5cm for phone ear detection).

3.3 ALS Angular Response

The sensor's angular response graphs (for X and Y axes) show how the measured light intensity varies with the angle of incidence. A perfectly cosine (Lambertian) response is ideal for most ambient light sensing applications. The LTR-X1503 exhibits a response close to this ideal, ensuring accurate readings regardless of the primary light source's direction relative to the sensor. Deviations from the ideal cosine response at extreme angles (> ±60 degrees) are typical for most sensors due to package and optical design constraints.

4. Mechanical & Package Information

The LTR-X1503 is housed in an ultra-small 8-pin chipled surface-mount package. The exact outline dimensions are provided in the datasheet's dimensional drawing, which includes top, side, and bottom views with critical dimensions such as package length, width, height, lead pitch, and pad sizes. This information is essential for PCB footprint design and ensuring proper mechanical fit within the end product.

4.1 Pin Configuration and Function

5. Application Circuit & Design Guidelines

5.1 Recommended Application Circuit

A typical application circuit includes the sensor, necessary decoupling capacitors, and I2C pull-up resistors.

5.2 Power Sequencing

Critical Requirement: Proper power sequencing must be followed to prevent potential latch-up or damage.

6. Soldering & Assembly Guidelines

The component is a surface-mount device (SMD) designed for reflow soldering processes common in high-volume electronics manufacturing.

6.1 Reflow Soldering Profile

While the specific datasheet may not detail a profile, a standard lead-free (RoHS compliant) reflow profile is applicable. This typically involves:

Consult the package's moisture sensitivity level (MSL) and follow appropriate baking and handling procedures if the device has been exposed to ambient humidity beyond its rated threshold.

6.2 Storage Conditions

Devices should be stored in their original moisture-barrier bags with desiccant in a controlled environment (typically <40°C and <90% relative humidity) to prevent oxidation and moisture absorption.

7. Packaging & Ordering Information

The LTR-X1503 is supplied in a tape-and-reel format suitable for automated pick-and-place assembly machines.

8. Application Suggestions

8.1 Typical Application Scenarios

8.2 Design Considerations & Best Practices

9. Technical Comparison & Differentiation

The LTR-X1503 competes in a market with other integrated ALS/PS solutions. Its key differentiators likely include:

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 How do I set the detection distance for the proximity sensor?

The detection distance is not a single fixed parameter but a result of several configurable settings: LED pulse current, pulse width, number of pulses, and the receiver gain. By increasing the LED current, pulse count, or gain, the reflected signal strength increases, allowing detection of objects at a greater distance or with lower reflectivity. The specific threshold for \"detection\" is set by the user in the interrupt threshold registers by characterizing the PS data count at the desired distance in the final product.

10.2 Why is power sequencing between VDD and V_LED important?

Improper sequencing can cause a large inrush current to flow through the internal ESD protection structures or logic circuits, potentially leading to latch-up—a high-current state that can damage the device. Following the specified sequence (VDD then V_LED on; V_LED then VDD off) ensures internal transistors are properly biased before the higher-voltage LED supply is applied or removed.

10.3 What does \"crosstalk cancellation\" mean for the PS?

Crosstalk refers to internal reflection within the device module or its cover where IR light from the emitter directly reaches the PS photodiode without reflecting off an external object. This creates a background offset that can cause false triggers or reduce sensitivity. The LTR-X1503 incorporates algorithms (often involving a baseline measurement with the LED off) to measure and subtract this crosstalk component from the final PS data, improving the accuracy of object detection.

10.4 How does the ALS achieve 50/60Hz flicker rejection?

Incandescent and fluorescent lights powered by AC mains fluctuate in intensity at 100Hz or 120Hz (twice the line frequency). If the sensor's integration time is a multiple of the flicker period (e.g., 10ms, 20ms, 100ms), it averages over complete light cycles, canceling out the variation and providing a stable lux reading. The sensor's integration time is programmable to be a multiple of these periods to enable this rejection.

11. Design and Usage Case Study

11.1 Implementing Power-Saving Display Control in a Smartwatch

Scenario: A smartwatch needs to maximize battery life. The display should be bright outdoors, dim indoors, and turn off completely when not viewed (e.g., when the user's arm is down).

Implementation with LTR-X1503:

  1. ALS Role: The ALS is configured with a 16-bit resolution and a 100ms integration time (for flicker rejection). The host MCU reads the ALS data every second via I2C. A lookup table or algorithm maps the lux value to a corresponding PWM duty cycle for the display backlight, providing smooth automatic brightness adjustment.
  2. PS Role: The PS is configured with an appropriate pulse current and count for the expected watch-to-face distance (e.g., ~30cm). The interrupt thresholds are set: a lower threshold for \"object removed\" (watch not looked at) and an upper threshold for \"object detected\" (watch raised to view). The INT pin is connected to a wake-up-capable GPIO on the MCU.
  3. Power Saving Workflow:
    • When the user lowers their arm, the PS count drops below the lower threshold, triggering an interrupt.
    • The MCU wakes from sleep, reads the interrupt status, and commands the display to enter a low-power off state.
    • The MCU can then put itself and the sensor (except perhaps a low-power PS monitoring mode) back to sleep.
    • When the user raises their arm to view the watch, the PS detects the object, triggers an interrupt, wakes the MCU, which then fully powers the display and ALS, showing the correct time at an appropriate brightness.

This combination significantly reduces average system power compared to a display that is always on or only time-controlled.

12. Operating Principle Introduction

12.1 Ambient Light Sensing Principle

The ALS function is based on a photodiode, a semiconductor device that generates a small current proportional to the intensity of light falling on it. In the LTR-X1503, this photodiode is covered by a filter that mimics the human eye's sensitivity across the visible spectrum. The generated photocurrent is very small (picoamps to nanoamps). An integrated transimpedance amplifier converts this current to a voltage, which is then digitized by a high-resolution Analog-to-Digital Converter (ADC). The digital value is processed and made available via the I2C registers, representing the illuminance in counts that can be converted to lux units using a calibrated formula.

12.2 Proximity Sensing Principle

The PS operates on the principle of active infrared reflection. The integrated infrared LED emits short pulses of 940nm light, which is invisible to the human eye. A separate, dedicated photodiode (different from the ALS diode) acts as the receiver. When an object is within range, some of the emitted IR light reflects off the object and returns to the receiver photodiode. The sensor measures the amount of reflected light received during and after each LED pulse. By comparing this signal to the ambient IR level (measured when the LED is off), and after crosstalk cancellation, the sensor calculates a proximity data count. A higher count indicates a closer or more reflective object. This count is compared to the user-programmed thresholds to trigger interrupts.

13. Technology Trends

The market for integrated optical sensors like the LTR-X1503 is driven by several clear trends in the electronics industry:

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.