A203B/UY/S530-A3 LED Array Lamp Datasheet - Yellow Diffused - 20mA - 2.0V - English Technical Document

1. Product Overview

The A203B/UY/S530-A3 is a low-power, high-efficiency LED array lamp designed primarily for use as a status or function indicator in electronic instruments and equipment. Its core design philosophy centers on providing reliable visual feedback with minimal power consumption and maximum design flexibility for engineers.

The product is constructed as an array, which combines multiple individual LED lamps within a single plastic holder. This integrated approach simplifies the mounting process onto printed circuit boards (PCBs) or panels, allowing for the creation of multi-point indicator systems from a single component. The array is designed to be stackable both vertically and horizontally, enabling the creation of compact, dense indicator clusters or custom-shaped indicator patterns to suit specific application needs.

Key advantages include its compliance with modern environmental and safety standards. It is a lead-free (Pb-free) product, compliant with the RoHS (Restriction of Hazardous Substances) directive, adheres to EU REACH regulations, and meets halogen-free requirements with strict limits on Bromine (Br) and Chlorine (Cl) content (Br < 900 ppm, Cl < 900 ppm, Br+Cl < 1500 ppm). This makes it suitable for use in a wide range of markets with stringent environmental regulations.

2. Technical Parameters and Specifications

2.1 Device Selection and Identification

The specific part number detailed in this document is 333-2UYD/S530-A3-L. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip material to produce a Brilliant Yellow emitted color. The external resin is Yellow Diffused, which helps to broaden the viewing angle and soften the light output for better visibility.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed and should be avoided for reliable long-term performance. All ratings are specified at an ambient temperature (Ta) of 25°C.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 60 mA (at a duty cycle of 1/10 and 1 kHz frequency)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 60 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for a maximum of 5 seconds

2.3 Electro-Optical Characteristics

These are the typical performance parameters measured under standard test conditions (Ta=25°C, I_F=20mA unless otherwise noted). They represent the expected performance of the device.

• Forward Voltage (V_F): Min. 1.7V, Typ. 2.0V, Max. 2.4V. This is the voltage drop across the LED when operating at the specified current.
• Reverse Current (I_R): Max. 10 µA at V_R=5V. This indicates the very small leakage current when a reverse voltage is applied.
• Luminous Intensity (I_V): Min. 100 mcd, Typ. 200 mcd. This is a measure of the perceived brightness of the LED as seen by the human eye.
• Viewing Angle (2θ_1/2): Typ. 30 degrees. This is the full angle at which the luminous intensity is half of the intensity at 0 degrees (on-axis).
• Peak Wavelength (λ_p): Typ. 591 nm. The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λ_d): Typ. 589 nm. The single wavelength that describes the color perceived by the human eye.
• Spectrum Radiation Bandwidth (Δλ): Typ. 15 nm. The spectral width of the emitted light, measured at half the maximum intensity (FWHM).

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. These are essential for circuit design and thermal management.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral distribution of the emitted light, centered around the typical 591 nm peak wavelength with a 15 nm bandwidth, confirming the yellow color output.

3.2 Directivity Pattern

This plot illustrates the spatial distribution of light, showing the typical 30-degree viewing angle where intensity falls to 50% of its on-axis value.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage for a diode. For this LED, at the typical operating current of 20 mA, the forward voltage is approximately 2.0V. The curve is essential for designing the current-limiting circuitry.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that the light output (luminous intensity) increases with forward current, but the relationship is not perfectly linear, especially at higher currents. It informs decisions on drive current for desired brightness levels.

3.5 Temperature Dependence Curves

Two key curves show the effect of ambient temperature (T_a):
Relative Intensity vs. Ambient Temperature: Shows that luminous intensity typically decreases as ambient temperature increases. This is a critical factor for applications in high-temperature environments.
Forward Current vs. Ambient Temperature: Can be used to understand how the I-V characteristic shifts with temperature, which is important for constant-current driver design.

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the A203B/UY/S530-A3 LED array. Key specifications from the drawing notes include: all dimensions are in millimeters (mm), with a general tolerance of ±0.25 mm unless otherwise specified. The lead spacing is measured at the point where the leads emerge from the package body. Precise dimensions are critical for PCB footprint design and ensuring proper fit during assembly.

5. Soldering and Assembly Guidelines

Proper handling is crucial to maintain device reliability and performance.

5.1 Lead Forming

• Bending must occur at least 3 mm from the base of the epoxy bulb to avoid stress on the package.
• Forming must be done before soldering and at room temperature.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

5.2 Storage

• Recommended storage conditions: ≤30°C and ≤70% Relative Humidity.
• Standard storage life after shipping is 3 months. For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

A minimum distance of 3 mm must be maintained between the solder joint and the epoxy bulb.

Hand Soldering: Iron tip temperature maximum 300°C (for a 30W iron max). Soldering time per lead maximum 3 seconds.
Dip (Wave) Soldering: Preheat temperature maximum 100°C (for max 60 seconds). Solder bath temperature maximum 260°C for a maximum of 5 seconds.
A recommended soldering temperature profile is provided, emphasizing the importance of controlled heating and cooling rates. Avoid rapid cooling. Soldering (dip or hand) should not be performed more than once. Avoid mechanical stress or vibration on the LED until it returns to room temperature after soldering.

5.4 Cleaning

If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, then air dry. Ultrasonic cleaning is not recommended and must be pre-qualified if absolutely necessary, as it can damage the LED depending on power and assembly conditions.

5.5 Heat Management

Proper thermal design is emphasized. The operating current should be de-rated appropriately based on the application's ambient temperature and thermal management capabilities. Designers should refer to de-rating curves (implied, though not explicitly shown in the provided excerpt) to ensure long-term reliability.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage.
Packing Quantity:
1. 200 pieces per anti-static bag.
2. 4 bags per inner carton.
3. 10 inner cartons per master (outside) carton.
This totals 8,000 pieces per master carton.

6.2 Label Explanation

The packaging label includes several codes:
• CPN: Customer's Part Number
• P/N: Manufacturer's Part Number (e.g., 333-2UYD/S530-A3-L)
• QTY: Quantity
• CAT: Performance ranks or categories
• HUE: Dominant Wavelength
• REF: Reference information
• LOT No: Traceable lot number for quality control

7. Application Notes and Design Considerations

7.1 Typical Applications

This LED array is designed as an indicator for displaying status, degree, function mode, or position in various electronic instruments and control panels. Examples include audio equipment, test and measurement devices, industrial control systems, and consumer electronics where multiple, configurable indicator points are needed.

7.2 Circuit Design Considerations

A current-limiting resistor is mandatory when driving the LED from a voltage source. The resistor value can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the typical V_F of 2.0V and a desired I_F of 20 mA from a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. A slightly higher value (e.g., 180 Ω) is often used for margin and to reduce power dissipation. For constant brightness across varying supply voltages or temperature, a constant-current driver circuit is recommended.

7.3 Thermal Design Considerations

While the device has a low power dissipation (60 mW max), effective thermal management in the application is still important for maintaining luminous intensity and longevity, especially when operating near the maximum current or in high ambient temperatures. Ensure the PCB provides adequate thermal relief and consider the effects of adjacent heat-generating components.

7.4 Optical Design Considerations

The yellow diffused resin provides a wide (30-degree) viewing angle. For applications requiring a narrower beam, external lenses or light pipes may be used. The diffused output helps reduce glare and creates a more uniform appearance, which is ideal for front-panel indicators.

8. Technical Comparison and Differentiation

The A203B/UY/S530-A3 differentiates itself through its array format. Compared to using multiple discrete LEDs, this integrated array offers significant advantages:
• Simplified Assembly: One component replaces multiple placements and soldering operations.
• Improved Consistency: LEDs within the array are from the same production batch, ensuring better color and brightness uniformity.
• Design Flexibility: The stackable feature allows for creating custom indicator shapes and patterns without custom tooling.
• Space Efficiency: Can enable denser indicator layouts than might be feasible with discrete components.
Its compliance with RoHS, REACH, and halogen-free standards is a baseline expectation for modern components but remains a critical differentiator for sales into regulated markets.

9. Frequently Asked Questions (FAQ)

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λ_p) is the physical wavelength where the light output is strongest. Dominant wavelength (λ_d) is a calculated value that corresponds to the color perceived by the human eye. For monochromatic LEDs like this yellow one, they are typically very close (591 nm vs. 589 nm here).

Q: Can I drive this LED at its peak current of 60 mA continuously?
A: No. The Peak Forward Current (I_FP) of 60 mA is only rated for pulsed operation at a low duty cycle (1/10). The maximum continuous current (I_F) is 25 mA. Exceeding the continuous rating will cause overheating and rapid degradation or failure.

Q: Why is the storage humidity important?
A>LED packages can absorb moisture. During the high-temperature soldering process, this absorbed moisture can turn to steam rapidly, causing internal delamination or cracking (\"popcorning\"). Proper storage controls moisture absorption.

Q: The forward voltage has a range from 1.7V to 2.4V. How does this affect my design?
A: This variation is normal due to manufacturing tolerances. Your current-limiting circuit should be designed to handle this range. Using a constant-current driver instead of a simple resistor will ensure consistent brightness across all units, regardless of V_F variation.

10. Practical Application Example

Scenario: Designing a multi-level status indicator for a power supply unit.
A designer needs to indicate four statuses: Standby, Normal, Warning, and Fault. They can use two A203B/UY/S530-A3 arrays stacked vertically.
• PCB Layout: The PCB footprint is designed according to the package dimension drawing. Four current-limiting resistors (one for each LED in the array segment) are placed nearby. Resistor values are calculated for a 3.3V logic supply, aiming for 15 mA per LED for adequate brightness and lower power: R = (3.3V - 2.0V) / 0.015A ≈ 87 Ω. A standard 91 Ω resistor is selected.
• Firmware Control: Four GPIO pins from a microcontroller are connected to the cathodes (via the resistors), with the anodes connected to the 3.3V rail. The firmware can illuminate individual LEDs or combinations to represent the four statuses (e.g., single LED for Standby, two for Normal, three for Warning, all four for Fault).
• Assembly: The arrays are placed on the PCB after other SMD components are soldered. During wave soldering, the profile is carefully controlled to not exceed 260°C for 5 seconds, respecting the 3mm distance rule.
This approach yields a clean, uniform, and easily assembled indicator section using minimal board space and component count.