LED Component Technical Datasheet - Dimensions N/A - Voltage N/A - Power N/A - Color N/A - English Technical Document

1. Product Overview

This technical document provides essential information regarding the lifecycle status and revision history of a specific electronic component. The primary purpose of this datasheet is to inform engineers, procurement specialists, and quality assurance personnel about the current state and historical changes of the product. Understanding the lifecycle phase is crucial for long-term design planning, supply chain management, and ensuring product consistency in manufacturing. The core advantage of maintaining such detailed documentation is traceability and reliability, allowing for informed decision-making throughout the product's application lifecycle.

The target market for components documented in this manner includes industries requiring high reliability and long-term availability, such as automotive electronics, industrial control systems, telecommunications infrastructure, and medical devices. The "Forever" expired period indicated suggests this particular revision is intended for indefinite use, implying stability and no planned obsolescence for this version, which is a significant factor for products with long development and service lives.

2. Technical Parameters Deep Objective Interpretation

While the provided PDF excerpt focuses on administrative data, a complete technical datasheet would typically include several key parameter sections. An objective interpretation of these common categories is provided below based on standard industry documentation practices.

2.1 Photometric and Color Characteristics

For light-emitting components like LEDs, this section is paramount. It would detail metrics such as luminous flux (measured in lumens), which defines the total perceived power of light emitted. Correlated Color Temperature (CCT) for white LEDs, expressed in Kelvin (K), indicates whether the light appears warm, neutral, or cool. Chromaticity coordinates (e.g., CIE x, y) precisely define the color point on a standard diagram. Color Rendering Index (CRI), a scale from 0 to 100, measures the ability of the light source to reveal the true colors of objects compared to a natural reference. Dominant wavelength and peak wavelength are critical for monochromatic LEDs (e.g., red, green, blue). Understanding these parameters allows designers to select the correct component for applications ranging from general illumination and backlighting to signage and indicator lights.

2.2 Electrical Parameters

This section defines the operational boundaries for the component. Key parameters include the forward voltage (Vf) at a specified test current, which is essential for driver circuit design. The reverse voltage (Vr) rating indicates the maximum voltage that can be applied in the non-conducting direction without causing damage. The forward current (If) specifies the nominal operating current, while the maximum forward current (If_max) and peak forward current (Ifp) define absolute limits. Electrostatic Discharge (ESD) sensitivity, often classified per standards like JEDEC JS-001 (HBM), is crucial for handling and assembly procedures to prevent latent failures.

2.3 Thermal Characteristics

Thermal management is critical for performance and longevity. The junction-to-ambient thermal resistance (RθJA) quantifies how effectively heat is transferred from the semiconductor junction to the surrounding environment. A lower RθJA value indicates better heat dissipation. The maximum junction temperature (Tj max) is the absolute highest temperature the semiconductor material can withstand before performance degrades or failure occurs. These parameters directly influence lumen maintenance (the decrease in light output over time) and overall reliability. Designers must ensure the thermal design of the application (e.g., PCB layout, heatsinking) keeps the operating junction temperature well below the maximum rating.

3. Binning System Explanation

Manufacturing variations necessitate sorting components into performance bins to ensure consistency for end-users.

3.1 Wavelength / Color Temperature Binning

LEDs are binned according to their chromaticity coordinates or CCT. A binning structure, often depicted on the CIE chromaticity diagram, groups LEDs with very similar color output. Tighter bins (smaller areas on the diagram) command a premium price and are used in applications where color uniformity is critical, such as video walls or high-end displays.

3.2 Luminous Flux Binning

Components are sorted based on their measured light output at standard test conditions. Bins are defined by a minimum and maximum luminous flux value (e.g., Bin A: 100-105 lm, Bin B: 105-110 lm). This allows designers to select a brightness level for their application and maintain consistency across production runs.

3.3 Forward Voltage Binning

LEDs are also grouped by their forward voltage drop at a specified current. Consistent Vf within a batch simplifies driver design, as it leads to more uniform current distribution when multiple LEDs are connected in parallel.

4. Performance Curve Analysis

Graphical data provides deeper insight than tabular specifications alone.

4.1 Current vs. Voltage (I-V) Curve

This fundamental curve shows the relationship between the forward current through the LED and the voltage across its terminals. It is non-linear, exhibiting a turn-on (or knee) voltage below which very little current flows. The slope of the curve in the operating region relates to the dynamic resistance. This curve is essential for designing constant-current drivers.

4.2 Temperature Characteristics

Graphs typically show how key parameters shift with changes in junction temperature. Forward voltage (Vf) generally decreases as temperature increases. Luminous flux output decreases with rising temperature; this relationship is shown in a relative luminous flux vs. junction temperature graph. Understanding these curves is vital for predicting performance under real-world operating conditions, not just at 25°C.

3.3 Spectral Power Distribution

This graph plots the relative intensity of light emitted across the electromagnetic spectrum. For white LEDs, it shows the broad phosphor-converted spectrum. For monochromatic LEDs, it shows a narrow peak. The SPD is used to calculate CCT, CRI, and chromaticity coordinates and is important for color-sensitive applications.

5. Mechanical and Packaging Information

Precise physical specifications are necessary for PCB design and assembly.

5.1 Dimension Outline Drawing

A detailed mechanical drawing provides all critical dimensions: length, width, height, lead spacing, and component tolerances. It includes top, side, and bottom views. This drawing is the primary reference for creating the PCB footprint.

5.2 Pad Layout Design

The recommended PCB land pattern (pad geometry and size) is provided to ensure proper solder joint formation during reflow. It often includes a solder mask opening recommendation and may suggest thermal relief patterns for pads connected to large copper areas to manage heat during soldering.

5.3 Polarity Identification

The method for identifying the anode and cathode is clearly indicated. Common methods include a marked cathode (often with a green line, dot, or notch on the package), a shorter cathode lead (for through-hole parts), or a specific pad shape on the footprint (e.g., square for anode, round for cathode).

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed temperature vs. time profile is provided, specifying key zones: preheat, soak, reflow (with peak temperature), and cooling. Maximum temperature limits for the component body and leads are stated. Adherence to this profile is critical to prevent thermal damage, such as delamination of the package or degradation of the internal die attach.

6.2 Precautions and Handling

Instructions typically cover ESD protection (wrist straps, conductive foam), moisture sensitivity level (MSL) and baking requirements if the package has been exposed to humidity, and avoidance of mechanical stress on the lens or leads. Cleaning agent compatibility may also be noted.

6.3 Storage Conditions

Recommended long-term storage conditions are specified, usually involving a controlled temperature and humidity environment (e.g., < 30°C, < 60% RH) in sealed, moisture-barrier bags with desiccant for MSL-rated parts.

7. Packaging and Ordering Information

7.1 Packaging Specifications

Details include the carrier tape width and pitch, reel diameter and quantity (e.g., 4000 pieces per 13-inch reel), and embossed tape dimensions for automated pick-and-place machines.

7.2 Label Explanation

The information printed on the reel label is decoded: part number, quantity, lot/batch code, date code, and binning codes for flux, color, and voltage.

7.3 Part Numbering Rule

The structure of the product's model number is explained. Each segment typically represents a key attribute: base product series, color/wavelength, flux bin, voltage bin, packaging type, and sometimes special features. This allows users to decode part numbers and specify their exact requirements.

8. Application Recommendations

8.1 Typical Application Circuits

Schematics for basic driving circuits are often included, such as a simple series resistor circuit for low-current indicators or constant-current driver circuits for higher-power illumination. Design equations for calculating the current-limiting resistor are provided.

8.2 Design Considerations

Key advice includes: using a constant current source rather than a constant voltage source for optimal performance and stability; implementing proper thermal management on the PCB (thermal vias, copper area); ensuring electrical isolation and creepage/clearance distances for safety-rated applications; and considering optical design elements like secondary optics or diffusers.

9. Technical Comparison

While a specific competitor comparison cannot be made without additional data, the differentiation of this component would typically be analyzed against industry alternatives. Potential areas of advantage could include higher luminous efficacy (more lumens per watt), superior color rendering (higher CRI), tighter color consistency (smaller binning areas), lower thermal resistance (better heat dissipation), higher reliability ratings (longer L70/L90 lifetime), or enhanced robustness (higher ESD rating). The "Forever" lifecycle phase for this revision itself is a differentiating factor, indicating long-term stability and support.

10. Frequently Asked Questions

Q: What does "LifecyclePhase: Revision : 2" mean?
A: It indicates the document and the component it describes are in the "Revision" phase of their lifecycle, and this is the second formal revision of this document. It implies the product is mature, and changes are likely corrections or minor improvements, not major redesigns.

Q: What is the implication of "Expired Period: Forever"?
A: This specific revision of the document and the product specifications it contains have no planned expiration date. The data is valid indefinitely, and this version of the component is intended to be available or supported for the foreseeable future, which is important for long-term projects.

Q: How should I drive this LED component?
A: Always use a constant-current driver circuit tailored to the forward current (If) specification. Avoid connecting directly to a voltage source without a current-limiting mechanism, as the LED's negative temperature coefficient can lead to thermal runaway and destruction.

Q: What is the maximum soldering temperature?
A: Refer to the detailed reflow profile in section 6.1. The peak package body temperature must not exceed the specified limit (typically 260°C for a few seconds for Pb-free soldering) to prevent internal damage.

11. Practical Use Cases

Case 1: Architectural Linear Lighting: High-CRI, tightly binned LEDs from a stable revision are selected for a cove lighting installation in a museum. The consistent color temperature across thousands of LEDs ensures a uniform visual field, while the high CRI accurately renders the colors of the artwork. The "Forever" lifecycle assurance allows the lighting designer and museum curators to plan for future maintenance and expansions with confidence in component availability.

Case 2: Automotive Interior Lighting: A cluster of low-power, high-reliability LEDs is used for dashboard backlighting and switch illumination. The detailed thermal characteristics from the datasheet are used to model the junction temperature inside the enclosed dashboard assembly, ensuring the LEDs will meet their lifetime specifications over the vehicle's 15-year service life in extreme ambient temperatures.

12. Principle Introduction

A Light Emitting Diode (LED) is a semiconductor device that emits light when an electric current passes through it. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the light (wavelength) is determined by the energy band gap of the semiconductor material used (e.g., Gallium Nitride for blue, Aluminum Gallium Indium Phosphide for red). White light is commonly produced by using a blue LED chip coated with a yellow phosphor, which converts some of the blue light to yellow; the mixture of blue and yellow light is perceived as white. The efficiency, color, and optical power of an LED are directly influenced by the materials, chip architecture, packaging, and operating conditions such as drive current and temperature.

13. Development Trends

The LED industry continues to evolve along several key trajectories. Increased Efficiency: Research focuses on improving internal quantum efficiency and light extraction to achieve higher lumens per watt, reducing energy consumption for lighting. Improved Color Quality: Developments in phosphor technology and multi-color chip designs (e.g., RGB, violet+phosphor) aim to achieve ultra-high CRI values and more saturated colors for specialized applications. Miniaturization and Integration: The trend towards smaller, more powerful LEDs (micro-LEDs) and integrated driver-on-chip solutions continues for applications in ultra-thin displays, wearables, and biomedical devices. Smart and Connected Lighting: Integration of control circuitry and communication protocols (like DALI or Zhaga) directly into LED modules is becoming more common, enabling IoT-based lighting systems. Reliability and Lifetime: Ongoing improvements in materials and packaging aim to further extend operational lifetimes and lumen maintenance, especially under high-temperature and high-humidity conditions. Sustainable Manufacturing: There is a growing emphasis on reducing the use of critical raw materials and developing more recyclable component structures.