Table of Contents
- 1. Product Overview
- 2. Lifecycle and Revision Management
- 2.1 Lifecycle Phase
- 3. Revision History and Validity
- 3.1 Revision Number
- 3.2 Expired Period
- 3.3 Release Date
- 4. Technical Parameters: In-Depth Objective Interpretation
- 4.1 Photometric Characteristics
- 4.2 Electrical Parameters
- 4.3 Thermal Characteristics
- 5. Binning System Explanation
- 5.1 Wavelength/Color Temperature Binning
- 5.2 Luminous Flux Binning
- 5.3 Forward Voltage Binning
- 6. Performance Curve Analysis
- 6.1 Current vs. Voltage (I-V) Curve
- 6.2 Temperature Characteristics
- 6.3 Spectral Power Distribution
- 7. Mechanical and Packaging Information
- 7.1 Dimensional Outline Drawing
- 7.2 Pad Layout Design
- 7.3 Polarity Identification
- 8. Soldering and Assembly Guidelines
- 8.1 Reflow Soldering Profile
- 8.2 Precautions
- 8.3 Storage Conditions
- 9. Packaging and Ordering Information
- 9.1 Packaging Specifications
- 9.2 Labeling Information
- 9.3 Model Number Nomenclature
- 10. Application Recommendations
- 10.1 Typical Application Scenarios
- 10.2 Design Considerations
- 11. Technical Comparison
- 12. Frequently Asked Questions (Based on Technical Parameters)
- 13. Practical Use Case
- 14. Principle of Operation
- 15. Technology Trends
1. Product Overview
This technical document provides comprehensive information regarding the lifecycle management and revision control of a specific electronic component, likely an LED or similar optoelectronic device. The core focus is on establishing a clear and permanent record of the component's approved technical state. The document's primary function is to serve as an authoritative reference for design, procurement, and quality assurance processes, ensuring all stakeholders are aligned on the exact specifications of Revision 2.
The core advantage of this structured documentation is the elimination of ambiguity in component specifications. By freezing the technical parameters under a specific revision number with a "Forever" expired period, it guarantees consistency in manufacturing and performance across all batches produced under this revision. This is crucial for applications requiring long-term reliability and repeatable performance. The target market includes industries such as automotive lighting, consumer electronics, industrial automation, and signage, where precise component specifications are non-negotiable.
2. Lifecycle and Revision Management
The document unequivocally defines the component's status within its product lifecycle and revision history.
2.1 Lifecycle Phase
The component is firmly in the Revision phase. This indicates that the product design is stable, has undergone initial release and likely some field feedback, and has been formally updated to a new, controlled version. It is no longer in a prototype or initial release (Rev 0 or Rev 1) state. Being in a Revision phase implies maturity and suitability for volume production and long-term design-ins.
3. Revision History and Validity
3.1 Revision Number
The document specifies Revision: 2. This is a critical identifier. All technical parameters, mechanical drawings, and performance data contained in or referenced by this document are strictly applicable to components marked as Revision 2. It is essential to verify this revision number on component packaging or markings during incoming inspection to ensure compatibility with the design.
3.2 Expired Period
The expired period is explicitly stated as Forever. This is a significant declaration. It means that the specifications for Revision 2 are considered permanently valid and will not be subject to an automatic obsolescence date. This provides long-term supply security for designs utilizing this component. However, "Forever" in this context typically means for the active production life of this specific revision; it does not preclude the manufacturer from eventually releasing a newer revision (e.g., Revision 3) in the future, at which point Revision 2 may be phased out.
3.3 Release Date
The official release date for Revision 2 is 2014-12-12 15:13:26.0. This timestamp serves as a formal milestone. Any components or documentation pertaining to Revision 2 are tied to this release point. This date can be used to track the age of the specification and to sequence it against other document revisions or product changes.
4. Technical Parameters: In-Depth Objective Interpretation
While the provided text snippet does not list specific photometric, electrical, or thermal parameters, the existence of a formal Revision 2 document implies a comprehensive set of specifications exists in the full datasheet. The following sections detail what a complete analysis would entail.
4.1 Photometric Characteristics
A full datasheet would define key light output parameters. This includes Luminous Flux (measured in lumens, lm), which indicates the total perceived power of light emitted. Luminous Intensity (measured in candelas, cd) or viewing angle data would describe the spatial distribution of light. Color Temperature (for white LEDs, measured in Kelvin, K) defines the hue of white light, ranging from warm white (2700K-3500K) to cool white (5000K-6500K). Color Rendering Index (CRI) is a measure of how accurately the light source reveals the colors of objects compared to a natural light source, with higher values (80+) being desirable for many applications.
4.2 Electrical Parameters
Critical electrical specifications ensure safe and reliable operation. The Forward Voltage (Vf) is the voltage drop across the LED at a specified test current. It is crucial for driver design. The Forward Current (If) is the recommended operating current, directly influencing light output and lifespan. Exceeding the maximum rated forward current can cause catastrophic failure. Reverse Voltage (Vr) specifies the maximum voltage the LED can withstand when biased in the non-conducting direction. Power Dissipation (in Watts) is calculated from Vf and If, and is key for thermal management.
4.3 Thermal Characteristics
LED performance and longevity are intensely thermal-dependent. The Junction-to-Ambient Thermal Resistance (RθJA) indicates how effectively heat is transferred from the semiconductor junction to the surrounding environment. A lower value is better. The Maximum Junction Temperature (Tj max) is the absolute highest temperature the LED chip can withstand without permanent damage. Proper heat sinking is designed to keep the operating junction temperature well below this limit to ensure rated lifetime.
5. Binning System Explanation
Manufacturing variations necessitate sorting components into performance bins.
5.1 Wavelength/Color Temperature Binning
LEDs are binned according to their peak wavelength (for monochromatic LEDs) or correlated color temperature (CCT for white LEDs). This ensures color consistency within a single production batch and across different batches. A datasheet will define the specific bin codes and their corresponding wavelength or CCT ranges.
5.2 Luminous Flux Binning
Due to variances in epitaxial growth and chip processing, light output can vary. Flux binning groups LEDs based on their measured luminous flux at a standard test current. This allows designers to select a bin that meets their minimum brightness requirement while understanding the possible range.
5.3 Forward Voltage Binning
LEDs are also sorted by their forward voltage (Vf) at a specified test current. Grouping LEDs by Vf helps in designing more efficient driver circuits, especially when multiple LEDs are connected in series, as it minimizes current imbalance.
6. Performance Curve Analysis
Graphical data provides deeper insight than tabular specs alone.
6.1 Current vs. Voltage (I-V) Curve
This fundamental curve shows the relationship between the forward current through the LED and the voltage across it. It is non-linear, exhibiting a turn-on (or knee) voltage below which very little current flows. The slope of the curve in the operating region relates to the dynamic resistance. This curve is essential for designing constant-current drivers.
6.2 Temperature Characteristics
Key graphs show how parameters shift with temperature. Typically, forward voltage (Vf) decreases as junction temperature increases. More critically, luminous flux output decreases with rising temperature. A graph of relative flux vs. junction temperature is vital for derating light output in high-temperature environments and for lifetime projections.
6.3 Spectral Power Distribution
For colored or white LEDs, an SPD graph plots the relative intensity of light emitted at each wavelength. It visually defines the color point, shows the width of the emission peak for monochromatic LEDs, and reveals the phosphor conversion spectrum for white LEDs, which directly impacts CRI.
7. Mechanical and Packaging Information
Physical specifications ensure proper fit and function on the PCB.
7.1 Dimensional Outline Drawing
A detailed mechanical drawing provides all critical dimensions: length, width, height, lead spacing, and overall tolerances. This is necessary for PCB footprint design and checking clearance in the final assembly.
7.2 Pad Layout Design
The recommended PCB land pattern (pad size, shape, and spacing) is provided to ensure reliable solder joint formation during reflow soldering. Following this recommendation is crucial for mechanical strength and thermal transfer.
7.3 Polarity Identification
The method for identifying the anode and cathode is clearly indicated, usually via a marking on the component body (a dot, notch, or colored line) or an asymmetric package shape. Incorrect polarity will prevent the LED from illuminating.
8. Soldering and Assembly Guidelines
8.1 Reflow Soldering Profile
A recommended reflow temperature profile is specified, including preheat, soak, reflow peak temperature, and cooling ramp rates. The peak temperature and time above liquidus are critical to avoid damaging the LED package or internal die attach materials while ensuring proper solder reflow.
8.2 Precautions
General handling precautions include avoiding mechanical stress on the lens, preventing electrostatic discharge (ESD) during handling, and not cleaning with certain solvents that may damage the lens material. The use of a vacuum pickup nozzle of appropriate size is often recommended for automated placement.
8.3 Storage Conditions
To maintain solderability and prevent moisture absorption (which can cause "popcorning" during reflow), components should be stored in a dry, controlled environment, typically at temperatures below 30°C and relative humidity below 60%. If the moisture sensitivity level (MSL) is specified, baking may be required before use if exposure limits are exceeded.
9. Packaging and Ordering Information
9.1 Packaging Specifications
The component is supplied in industry-standard packaging, such as tape-and-reel, suitable for automated pick-and-place machines. The reel dimensions, tape width, pocket spacing, and component orientation on the tape are defined.
9.2 Labeling Information
The labels on the reel and box include the part number, revision code (e.g., "Rev 2"), quantity, lot/batch number, and date code. The lot number is essential for traceability.
9.3 Model Number Nomenclature
A part number breakdown explains how the complete ordering code is constructed. It typically encodes key attributes like color, flux bin, voltage bin, packaging type, and revision level, allowing precise selection of the required variant.
10. Application Recommendations
10.1 Typical Application Scenarios
Based on its implied specifications, a component like this could be used in backlighting units for LCD displays, general indicator lights, automotive interior lighting, decorative lighting, and status indicators on consumer appliances.
10.2 Design Considerations
Designers must consider thermal management from the outset. This includes using a PCB with adequate thermal vias or a metal-core board, ensuring proper solder coverage for heat transfer, and possibly adding external heat sinking if operating at high currents or in high ambient temperatures. The driver circuit must be a constant-current type to ensure stable light output and prevent thermal runaway.
11. Technical Comparison
While a direct comparison requires a specific competitor part, the advantages of a well-documented, permanently valid revision like this one include supply chain stability (no unexpected specification changes), design longevity (the product can be manufactured for years without requalification), and quality consistency (tight binning and controlled processes). This contrasts with parts that have frequent, unannounced revisions or short validity periods, which can introduce risk into long-lifecycle products.
12. Frequently Asked Questions (Based on Technical Parameters)
Q: What does "Expired Period: Forever" mean for my design?
A: It means the specifications for Revision 2 are locked and will not change for the production life of this revision. You can design with the confidence that future purchases of "Rev 2" parts will match the datasheet, ensuring long-term manufacturability of your product.
Q: How do I ensure I am receiving Revision 2 components?
A: The revision is typically marked on the component reel label and may be encoded in the part number on the package. Always verify the revision code during your incoming quality inspection against your approved datasheet (this document).
Q: The release date is 2014. Is this component obsolete?
A: Not necessarily. A "Forever" expired period and a mature revision number often indicate a stable, in-production part. However, you should consult the manufacturer's product status or lifetime buy notices to confirm active production status. The 2014 date simply marks when Rev 2 was finalized.
13. Practical Use Case
Scenario: Designing a control panel for industrial equipment. The panel requires durable, consistent status indicators with a guaranteed 10-year product lifecycle. By selecting an LED component with a clear "Revision 2" and "Forever" expired period, the design engineer locks in the photometric and electrical specs. This allows the driver circuit to be precisely optimized. Years later, during a production run, the purchasing department can order the same part number with confidence, and manufacturing will see consistent performance on the assembly line, with no need to re-validate or modify the design due to component changes. The lot traceability provided supports quality audits.
14. Principle of Operation
Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region in the active layer. This recombination process releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used in the active region. White LEDs are typically created by using a blue LED chip coated with a yellow phosphor; the combination of blue and yellow light produces white light. The efficiency of this conversion and the precise composition of the phosphor determine the color temperature and CRI.
15. Technology Trends
The broader LED industry continues to evolve towards higher efficacy (more lumens per watt), improved color rendering, and greater reliability. Miniaturization remains a trend, enabling higher-density lighting arrays. There is also a strong drive towards smarter, connected lighting with integrated control electronics. From a documentation and lifecycle management perspective, the trend is towards digital product passports and cloud-based datasheets that can be updated dynamically while maintaining clear revision histories, though the fundamental need for frozen, controlled specifications for a given revision remains paramount for hardware design and manufacturing.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |