LED Component Technical Datasheet - Lifecycle Phase: Revision 2 - Release Date: 2014-12-05 - English Technical Documentation

1. Product Overview

This technical datasheet pertains to a specific revision of an electronic component, likely an LED or similar optoelectronic device. The primary information provided indicates the component is in a stable, mature phase of its product lifecycle. The document serves as a formal record of this revision, ensuring traceability and consistency in manufacturing and application. The core advantage of this revision is its established reliability and the availability of long-term technical data. It is targeted at markets requiring durable, proven components for industrial, automotive, or high-reliability consumer applications where component consistency over time is critical.

2. Lifecycle and Release Information

The document repeatedly confirms a single, critical piece of administrative and quality control data.

2.1 Lifecycle Phase

The component is definitively in the Revision phase. This signifies that the initial design and development (Prototype, Initial Release) are complete. The product has undergone at least one iteration of changes or improvements, culminating in Revision 2. Being in the Revision phase typically implies the product is in volume production, with specifications frozen and qualified for use in end products. Changes from this point are usually minor and controlled through formal engineering change orders (ECOs).

2.2 Release and Validity

The official Release Date for Revision 2 is recorded as 2014-12-05 at 13:13:38.0. This precise timestamp is crucial for version control and helps identify the specific build or documentation set. The Expired Period is stated as Forever. This indicates that this revision of the component has no planned obsolescence date from the manufacturer's side for this specific document and product version. It is intended for production indefinitely, or until superseded by a new revision. This is common for components that become industry standards.

3. Technical Parameters: In-Depth Objective Interpretation

While the provided text snippet lacks explicit numerical parameters like voltage or luminous flux, the lifecycle data itself is a critical technical and logistical parameter. We can infer and elaborate on typical parameters for such a component.

3.1 Photometric Characteristics

For a component in a stable revision, photometric properties are tightly controlled. Key parameters would include:

• Dominant Wavelength / Correlated Color Temperature (CCT): This defines the color of light emitted. For white LEDs, CCT (e.g., 3000K Warm White, 6500K Cool White) is specified. For colored LEDs, a dominant wavelength (e.g., 525nm Green) is given. The binning structure ensures color consistency within a defined range.
• Luminous Flux: The total perceived light output measured in lumens (lm). A typical binning system groups components based on their flux output at a specified test current.
• Luminous Efficacy: The efficiency, measured in lumens per watt (lm/W), indicating how effectively electrical power is converted into visible light.

3.2 Electrical Parameters

Stable electrical performance is a hallmark of a revision-phase product.

• Forward Voltage (Vf): The voltage across the device when conducting a specified forward current. It is temperature-dependent and is typically binned. A common specification might be Vf = 3.2V ± 0.2V at If = 150mA, Tj=25°C.
• Forward Current (If): The recommended operating current, often 150mA for mid-power LEDs. Maximum absolute ratings would also be defined.
• Reverse Voltage (Vr): The maximum voltage the LED can withstand when biased in the non-conducting direction, typically around 5V.

3.3 Thermal Characteristics

Thermal management is vital for LED performance and lifetime.

• Thermal Resistance, Junction to Case (Rth j-c): Expressed in °C/W, this indicates how easily heat flows from the semiconductor junction to the component's case. A lower value is better.
• Maximum Junction Temperature (Tj max): The highest allowable temperature at the semiconductor junction, often 125°C or 150°C. Operating below this is essential for longevity.

4. Binning System Explanation

A rigorous binning system is implemented to ensure consistency. Components are tested and sorted into groups (bins) based on key parameters.

4.1 Wavelength / Color Temperature Binning

LEDs are sorted into bins based on their chromaticity coordinates on the CIE diagram (for white LEDs) or dominant wavelength (for colored LEDs). This ensures that all LEDs from the same bin will appear visually identical in color. A typical bin structure might have several steps within a MacAdam ellipse to guarantee color uniformity.

4.2 Luminous Flux Binning

Components are categorized by their light output at a standard test condition. For example, bins may be defined in 5% or 10% steps (e.g., Flux Bin L1: 100-105 lm, L2: 105-110 lm). This allows designers to select the appropriate brightness grade for their application.

4.3 Forward Voltage Binning

To simplify driver design and ensure consistent behavior in parallel strings, LEDs are often binned by forward voltage. Common bins might be V1: 2.8V - 3.0V, V2: 3.0V - 3.2V, V3: 3.2V - 3.4V. This helps in matching components for uniform current distribution.

5. Performance Curve Analysis

Graphical data is essential for understanding component behavior under varying conditions.

5.1 Current vs. Voltage (I-V) Curve

The I-V curve shows the exponential relationship between forward current and forward voltage. It is crucial for designing the current-limiting circuitry. The curve will shift with temperature; a higher junction temperature will typically result in a lower forward voltage for the same current.

5.2 Temperature Characteristics

Key graphs include Luminous Flux vs. Junction Temperature and Forward Voltage vs. Junction Temperature. Light output generally decreases as temperature increases. Understanding this derating is critical for thermal design to maintain target brightness.

5.3 Spectral Power Distribution (SPD)

The SPD graph shows the intensity of light emitted at each wavelength. For white LEDs (phosphor-converted), it shows the blue pump LED peak and the broader phosphor emission. This data is used for color quality calculations like Color Rendering Index (CRI).

6. Mechanical and Package Information

The physical package ensures reliable electrical connection and thermal dissipation.

6.1 Dimension Outline Drawing

A detailed mechanical drawing provides all critical dimensions: length, width, height, lens shape, and tolerances. This is necessary for PCB footprint design and ensuring proper fit in the assembly.

6.2 Pad Layout Design

The recommended PCB land pattern (pad geometry and size) is provided to ensure good solderability and mechanical strength. It includes solder mask and solder paste recommendations.

6.3 Polarity Identification

Clear markings indicate the anode (+) and cathode (-). This is typically shown via a diagram noting a cut corner, a green dot, or a marking on the cathode side of the component.

7. Soldering and Assembly Guidelines

Proper handling is required to maintain reliability.

7.1 Reflow Soldering Profile

A recommended reflow profile is provided, including preheat, soak, reflow, and cooling zones with specific temperature limits and time durations. Peak temperature is critical and must not exceed the component's rating (often 260°C for 10 seconds).

7.2 Precautions

Instructions include avoiding mechanical stress, using ESD protection, preventing moisture absorption (MSL rating), and not cleaning with certain solvents that may damage the lens.

7.3 Storage Conditions

Components should be stored in a dry, dark environment at controlled temperature and humidity, typically per the Moisture Sensitivity Level (MSL) defined for the package.

8. Packaging and Ordering Information

Logistical details for procurement and production.

8.1 Packaging Specifications

Components are supplied on tape and reel compatible with standard pick-and-place machines. The reel size, tape width, pocket spacing, and component orientation are specified.

8.2 Label Information

The reel label contains the part number, revision code (e.g., REV 2), quantity, lot number, and date code for full traceability.

8.3 Model Numbering Rules

The part number encodes key attributes. A typical structure might be: Series Code - Color/Flux Bin - Voltage Bin - Package Code - Revision. For example, ABC-W2-L3-V2-2835-REV2.

9. Application Recommendations

9.1 Typical Application Scenarios

This revision-stable component is suitable for applications requiring long-term availability and consistent performance: architectural lighting, commercial signage, automotive interior lighting, backlighting for displays, and general illumination modules.

9.2 Design Considerations

Designers must consider thermal management (using adequate heatsinking), drive current (constant current drive is recommended), optical design (lens selection for beam angle), and electrical protection (against reverse voltage and transients).

10. Technical Comparison

Compared to newer or prototype components, this Revision 2 part offers the key advantage of maturity. Its performance parameters are fully characterized, long-term reliability data is available, supply chains are established, and it carries lower technical risk for the designer. The trade-off may be slightly lower efficacy or color rendering performance compared to the latest-generation products, but it offers proven stability.

11. Frequently Asked Questions (FAQs)

Q: What does \"Lifecycle Phase: Revision\" mean for my design?
A: It means the component is in a stable, mass-production state. The specifications are fixed, ensuring you can source identical parts for years, which is crucial for long product lifecycles and avoiding requalification.

Q: The release date is 2014. Is this component obsolete?
A: Not necessarily. The \"Expired Period: Forever\" note suggests the manufacturer commits to producing this exact revision indefinitely. It is a mature, possibly industry-standard part. Always check with the manufacturer for the latest product status.

Q: How do I interpret the lack of specific technical numbers in this snippet?
A: This snippet appears to be a header or cover page. The full datasheet would contain all detailed electrical, optical, and mechanical specifications on subsequent pages. This header provides the critical revision and validity context for that detailed data.

12. Practical Use Case

Case: Designing a Long-Life Exit Sign. A manufacturer needs an LED for an exit sign that must operate reliably for 10+ years and have consistent color and brightness across all units. Selecting this Revision 2 component is ideal. The designer uses the binned luminous flux and chromaticity data to ensure uniform light output. The established reliability data supports the long-life claim. The stable supply chain guarantees availability for future production runs and spare parts.

13. Principle Introduction

The component operates on the principle of electroluminescence in a semiconductor material. When a forward voltage is applied across the p-n junction, electrons recombine with holes, releasing energy in the form of photons. The wavelength (color) of the light is determined by the bandgap energy of the semiconductor material. For white LEDs, a blue or ultraviolet LED chip is coated with a phosphor layer that absorbs some of the primary light and re-emits it as a broader spectrum of longer wavelengths, combining to produce white light.

14. Development Trends

The solid-state lighting industry continues to evolve. General trends include increasing luminous efficacy (lm/W), improving color rendering quality (higher CRI and R9 values), and achieving higher reliability at higher operating temperatures. There is also a move towards more sophisticated packaging for better light extraction and thermal management. While this Revision 2 part represents a mature technology point, newer revisions or product lines would incorporate advancements in these areas, offering better performance but potentially with a newer, less-proven reliability profile.