LED Component Technical Datasheet - Revision 2 - Lifecycle Phase Documentation - English Technical Document

1. Product Overview

This technical document provides comprehensive specifications and guidelines for a specific LED component. The primary focus of the provided data is the formal declaration of its lifecycle phase and revision status. The component is confirmed to be in the "Revision" phase, indicating it is an updated version of a previous design, incorporating potential improvements in performance, reliability, or manufacturability. The revision number is specified as 2. The release date for this revision is documented as December 5, 2014. The expired period is marked as "Forever," which typically signifies that this revision has no planned obsolescence date and is intended for long-term availability, barring any major technological shifts or discontinuation decisions. This stability is crucial for designers and manufacturers who require consistent component supply for their products.

2. In-Depth Technical Parameter Analysis

While the core snippet focuses on administrative data, a complete LED datasheet would contain detailed technical parameters. These are critical for circuit design and system integration.

2.1 Photometric and Color Characteristics

A detailed analysis of the LED's light output is essential. This includes the dominant wavelength or correlated color temperature (CCT), which defines the color of the emitted light (e.g., cool white, warm white, specific color). The luminous flux, measured in lumens (lm), indicates the total perceived power of light. The luminous efficacy (lm/W) is a key efficiency metric. Chromaticity coordinates (e.g., on the CIE 1931 diagram) provide a precise color point. Viewing angle, specified in degrees, describes the angular distribution of light intensity. For colored LEDs, peak wavelength and spectral half-width are critical parameters.

2.2 Electrical Parameters

Electrical characteristics define the operating conditions. The forward voltage (Vf) is specified at a given test current (If). Designers must consider the Vf binning or typical range. The reverse voltage (Vr) indicates the maximum allowable voltage in the non-conducting direction. The forward current (If) is the recommended operating current, with an absolute maximum rating also provided. Dynamic resistance can be inferred from the IV curve. Power dissipation is calculated from Vf and If, influencing thermal design.

2.3 Thermal Characteristics

LED performance and lifetime are heavily dependent on temperature. The junction temperature (Tj) is the critical internal temperature. The thermal resistance from junction to ambient (RθJA) or junction to solder point (RθJS) quantifies how easily heat escapes from the chip. The maximum allowable junction temperature (Tj max) must not be exceeded. Understanding these parameters is vital for designing adequate heat sinking to maintain light output, color stability, and long-term reliability.

3. Binning System Explanation

Manufacturing variations lead to slight differences between individual LEDs. Binning is the process of sorting components into groups (bins) based on key parameters to ensure consistency within a production lot.

3.1 Wavelength / Color Temperature Binning

LEDs are binned according to their chromaticity coordinates or CCT. A tighter bin (smaller MacAdam ellipse step, e.g., 2-step or 3-step) ensures minimal visible color difference between LEDs, which is critical for applications like lighting fixtures and displays where color uniformity is paramount.

3.2 Luminous Flux Binning

LEDs are sorted based on their light output at a standard test current. This allows designers to select components that meet specific brightness requirements and helps maintain consistent luminance across an array.

3.3 Forward Voltage Binning

Sorting by forward voltage (Vf) at a specified current helps in designing efficient driver circuits, especially when connecting multiple LEDs in series, as it minimizes current imbalance.

4. Performance Curve Analysis

Graphical data provides deeper insight into component behavior under varying conditions.

4.1 Current-Voltage (I-V) Characteristic Curve

This curve plots the relationship between forward current and forward voltage. It is non-linear, showing a turn-on voltage and a region of approximately exponential rise. The curve's slope in the operating region relates to dynamic resistance. It is fundamental for driver design, determining the required supply voltage for a given current.

4.2 Temperature Dependency Analysis

Key graphs show how parameters change with temperature. Typically, forward voltage (Vf) decreases as junction temperature increases. Luminous flux also decreases with rising temperature. Understanding these relationships is critical for designing systems that maintain performance over the intended operating temperature range.

3.3 Spectral Power Distribution

This graph shows the relative intensity of light emitted at each wavelength. For white LEDs (often blue chip + phosphor), it shows the blue peak and the broader phosphor-converted spectrum. It defines the color rendering index (CRI) and the exact color quality of the light.

5. Mechanical and Packaging Information

Physical specifications ensure proper PCB design and assembly.

5.1 Dimensional Outline Drawing

A detailed diagram showing the component's exact length, width, height, and any critical tolerances. It includes top, side, and bottom views.

5.2 Pad Layout and Solder Pad Design

The recommended PCB land pattern (footprint) is provided, including pad dimensions, spacing, and shape. This is essential for creating the PCB layout to ensure reliable soldering and mechanical stability.

5.3 Polarity Identification

Clear marking of the anode and cathode terminals is shown, often via a diagram indicating a notch, a dot, a beveled edge, or different pad sizes on the component body or in the footprint.

6. Soldering and Assembly Guidelines

Proper handling ensures reliability.

6.1 Reflow Soldering Profile

A detailed temperature vs. time graph defines the recommended reflow profile, including preheat, soak, reflow (peak temperature), and cooling rates. Maximum temperature limits and exposure times are specified to prevent damage to the LED package or internal die.

6.2 Handling Precautions

Instructions typically include warnings against mechanical stress, electrostatic discharge (ESD) protection requirements (as LEDs are often ESD-sensitive devices), and avoidance of contamination on the lens or leads.

6.3 Storage Conditions

Recommended storage environment is specified, usually involving controlled temperature and humidity (e.g., <30°C, <60% RH) to prevent moisture absorption (which can cause "popcorning" during reflow) and lead oxidation.

7. Packaging and Ordering Information

7.1 Packaging Specifications

Describes the form of delivery: tape and reel specifications (carrier tape width, pocket spacing, reel diameter), tube quantities, or bulk packing. Includes orientation within the packaging.

7.2 Labeling Information

Explains the markings on the reel or box label, which typically include part number, quantity, lot/batch code, date code, and binning information.

7.3 Part Numbering System

Decodes the part number structure, showing how different codes within the number represent specific attributes like color, flux bin, voltage bin, packaging type, and revision level (e.g., the "Revision: 2" from the core data).

8. Application Recommendations

8.1 Typical Application Circuits

Schematics for common drive methods: simple series resistor current limiting for low-power applications, constant current driver circuits (linear or switching) for optimal performance and efficiency, and PWM dimming interface circuits.

8.2 Design Considerations

Key points include thermal management design (calculating heatsink requirements using RθJA and power dissipation), optical design (lens selection, beam shaping), driver selection based on forward voltage and current requirements, and ensuring electrical compatibility with the control system.

9. Technical Comparison

While a single datasheet doesn't compare, a designer would use this data to compare against alternatives. Potential differentiators implied by a "Revision 2" could include: higher luminous efficacy compared to the previous revision, improved color consistency (tighter binning), enhanced reliability data (longer L70/L90 lifetime), lower thermal resistance, or a more robust package design. The "Forever" expired period suggests a commitment to long-term supply stability, which is a significant advantage over components with planned obsolescence.

10. Frequently Asked Questions (FAQ)

Q: What does "LifecyclePhase: Revision" mean?
A: It indicates this is not a new product introduction but an updated version (Revision 2) of an existing component. Changes may be minor (process improvements) or major (performance enhancements), but the form, fit, and basic function are typically maintained.

Q: What is the implication of "Expired Period: Forever"?
A: This suggests the manufacturer has no current plan to discontinue this specific revision, offering supply stability for long-term projects. However, it does not guarantee indefinite production, as market forces or technological supersession could eventually lead to an End-of-Life (EOL) notice.

Q: How should I interpret the release date in my design process?
A: The release date (2014-12-05) provides context. For a new design, you might check if a newer revision exists. It also helps trace the component's history. Ensure any reliability or performance data in the full datasheet is still considered valid and representative of current manufacturing.

Q: If I have boards built with Revision 1, can I use Revision 2?
A: Generally, yes, if it is a true form-fit-function revision. However, it is critical to compare the full technical specifications of both revisions to verify no electrical, optical, or thermal parameters have changed in a way that affects your application. Always consult the complete datasheet.

11. Practical Use Case Examples

Case 1: Architectural Linear Lighting
A designer is creating a continuous LED strip for cove lighting. Using the binning information (tight CCT and flux bins), they can ensure seamless color and brightness along the entire run. The thermal resistance data is used to calculate the required aluminum profile size to keep the junction temperature below Tj max, ensuring rated lifetime and maintaining consistent color over time.

Case 2: Industrial Control Panel Indicators
An engineer needs status LEDs for a machine interface. The forward voltage and current specifications are used to select an appropriate series resistor value for a 24V DC supply. The mechanical drawing ensures the chosen LED fits the panel's pre-drilled holes, and the soldering profile is programmed into the assembly line's reflow oven.

12. Operating Principle Introduction

An LED is a semiconductor diode. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the depletion region. This recombination releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; some of the blue light is converted to yellow, and the mixture of blue and yellow light is perceived as white. The efficiency of this electroluminescent process is characterized by the wall-plug efficiency or luminous efficacy.

13. Technology Development Trends

The LED industry continues to evolve. Key trends include: Increased Efficacy: Ongoing research aims to produce more lumens per watt, reducing energy consumption for lighting. Improved Color Quality: Development of phosphors and multi-chip solutions to achieve higher Color Rendering Index (CRI) and more pleasing spectral power distributions. Miniaturization & Integration: Development of smaller, more powerful chips (e.g., micro-LEDs) and integrated packages combining LEDs with drivers and control circuitry. Smart Lighting: Integration of sensors and communication interfaces (Li-Fi, IoT) directly into LED modules. Sustainability: Focus on reducing the use of critical raw materials, improving recyclability, and further extending operational lifetimes to reduce environmental impact. The "Revision 2" status of this component places it within this continuum of incremental improvement.