Table of Contents
- 1. Product Overview
- 2. Lifecycle and Revision Management
- 2.1 Lifecycle Phase
- 2.2 Revision Number
- 2.3 Release Date and Validity
- 3. Technical Parameters: In-Depth Objective Interpretation
- 3.1 Photometric and Color Characteristics
- 3.2 Electrical Parameters
- 3.3 Thermal Characteristics
- 4. Binning System Explanation
- 5. Performance Curve Analysis
- 6. Mechanical and Packaging Information
- 7. Soldering and Assembly Guidelines
- 8. Application Recommendations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 11. Practical Use Case Examples
- 12. Operating Principle Introduction
- 13. Technology Trends
1. Product Overview
This technical document provides comprehensive information regarding the lifecycle management and revision history of a specific electronic component, likely an LED or related optoelectronic device. The core focus is on establishing the official status, version control, and temporal validity of the product data contained herein. This document serves as the definitive source for engineers, procurement specialists, and quality assurance personnel to verify the component's specification status at a given point in time.
The primary purpose is to ensure traceability and consistency in design and manufacturing processes. By clearly defining the revision number and release date, it prevents the use of outdated or incorrect specifications, which is critical for maintaining product reliability and performance. The document's structure is centered on administrative and lifecycle metadata, indicating a formalized product data management system.
2. Lifecycle and Revision Management
The document repeatedly and consistently specifies a single, unified set of administrative parameters. This repetition underscores the importance of these fields and ensures the information is unmistakably clear, even if the document is viewed partially.
2.1 Lifecycle Phase
The LifecyclePhase is explicitly stated as "Revision". This indicates the document and the component it describes are not in an initial design ("Prototype") or end-of-life ("Obsolete") phase. The "Revision" phase signifies that the product is in active production, and this document represents a revised version of its specifications. Revisions can occur due to process improvements, minor design tweaks, or updated test methodologies, all while maintaining functional compatibility within defined limits.
2.2 Revision Number
The Revision number is specified as 2. This is a critical identifier. It denotes that this is the second major revision of the product's technical datasheet. Engineers must always reference the latest revision to ensure their designs incorporate the most current performance data, tolerances, and recommended operating conditions. The jump from a hypothetical Revision 1 to Revision 2 suggests substantive updates to the content, which could include changes to electrical parameters, optical characteristics, mechanical drawings, or reliability data.
2.3 Release Date and Validity
The document was officially released on 2014-12-05 at 15:24:37.0. This timestamp provides an exact reference for when this revision became active. The Expired Period is noted as "Forever". This is a significant declaration. It means that this revision of the document does not have a pre-defined expiration or sunset date. It will remain the valid reference until explicitly superseded by a subsequent revision (e.g., Revision 3). This is common for product documentation, where a revision remains valid for the duration of that product version's production lifecycle.
3. Technical Parameters: In-Depth Objective Interpretation
While the provided PDF snippet focuses on administrative data, a complete technical datasheet for an LED component would contain the following sections. The analysis below is based on standard industry content for such a document.
3.1 Photometric and Color Characteristics
This section quantitatively defines the light output and color properties. Key parameters include Luminous Flux (measured in lumens, lm), which indicates the total perceived power of light emitted. Luminous Intensity (candelas, cd) may also be specified for directional LEDs. The Dominant Wavelength (for monochromatic LEDs) or Correlated Color Temperature (CCT) (for white LEDs, measured in Kelvin, K) precisely defines the color point. Color Rendering Index (CRI) is crucial for white LEDs, indicating how naturally colors appear under its light, with higher values (e.g., Ra>80) being desirable for general lighting.
3.2 Electrical Parameters
Electrical specifications ensure safe and optimal operation within the circuit. The Forward Voltage (Vf) is the voltage drop across the LED at a specified test current. It has a typical value and a range (e.g., 3.0V ~ 3.4V @ 20mA). The Forward Current (If) is the recommended continuous operating current, with an absolute maximum rating that must not be exceeded. Reverse Voltage (Vr) specifies the maximum allowable voltage in the reverse-biased direction, typically a low value like 5V, as LEDs are not designed to withstand high reverse voltages.
3.3 Thermal Characteristics
LED performance and lifetime are heavily dependent on junction temperature. The Thermal Resistance (RthJ-A), measured in °C/W, indicates how effectively heat travels from the semiconductor junction to the ambient air. A lower value signifies better heat dissipation. The Maximum Junction Temperature (Tjmax) is the highest allowable temperature at the semiconductor die, often around 125°C. Operating below this limit is essential for long-term reliability.
4. Binning System Explanation
Manufacturing variations necessitate sorting LEDs into performance bins to ensure consistency for the end-user.
Wavelength/Color Temperature Binning: LEDs are grouped based on their dominant wavelength or CCT. A tight bin (e.g., 3-step or 5-step MacAdam ellipse for white LEDs) ensures minimal visible color difference between units in the same application.
Luminous Flux Binning: LEDs are sorted by their light output at a standard test current. This allows designers to select bins that meet specific brightness requirements.
Forward Voltage Binning: Sorting by Vf helps in designing efficient driver circuits, especially when multiple LEDs are connected in series, to ensure uniform current distribution.
5. Performance Curve Analysis
Graphical data provides deeper insight than tabular values alone.
I-V (Current-Voltage) Curve: This graph shows the relationship between forward voltage and current. It is non-linear, exhibiting a turn-on voltage after which current increases rapidly. This curve is vital for designing current-limiting circuitry.
Temperature Characteristics: Graphs typically show how luminous flux and forward voltage change with increasing junction temperature. Flux generally decreases as temperature rises (thermal quenching), while Vf decreases slightly.
Spectral Power Distribution (SPD): For white LEDs, this graph shows the relative intensity across the visible spectrum, revealing the mix of blue pump LED and phosphor emissions. It directly relates to CCT and CRI.
6. Mechanical and Packaging Information
Precise physical specifications are required for PCB design and assembly.
Outline Dimension Drawing: A detailed diagram showing all critical dimensions: length, width, height, lens shape, and any protrusions. Tolerances are always specified.
Pad Layout Design: A recommended footprint pattern for the PCB lands (pads). This includes pad size, shape, and spacing to ensure proper solder joint formation during reflow and good thermal connection.
Polarity Identification: Clear marking of the anode (+) and cathode (-). This is usually indicated by a visual marker on the component itself (like a cut corner, a dot, or a green line) and noted on the dimension drawing.
7. Soldering and Assembly Guidelines
Proper handling ensures reliability and prevents damage.
Reflow Soldering Profile: A detailed temperature-vs-time graph specifying the preheat, soak, reflow, and cooling phases. Key parameters include peak temperature (typically 245-260°C for Pb-free solder) and time above liquidus (TAL). Adherence to this profile prevents thermal shock.
Precautions: Instructions regarding moisture sensitivity level (MSL), baking requirements if the package is exposed to ambient humidity, and avoidance of mechanical stress on the lens.
Storage Conditions: Recommended temperature and humidity ranges for storing components before use, often in a dry, inert environment.
8. Application Recommendations
Typical Application Circuits: Schematic examples showing the LED driven by a constant current source, often using a dedicated LED driver IC or a simple resistor for low-current applications. Protection elements like transient voltage suppressors (TVS) may be suggested for automotive or industrial environments.
Design Considerations: Emphasis on thermal management is paramount. Guidelines for PCB copper area (thermal pad), use of thermal vias, and possibly heatsinking. Optical considerations include viewing angle and the potential need for secondary optics (lenses, diffusers). Electrical design must ensure stable current control, as LED brightness is current-dependent, not voltage-dependent.
9. Technical Comparison and Differentiation
While specific competitor names are omitted, the document may highlight inherent advantages. For an LED, this could include higher luminous efficacy (lumens per watt), superior color consistency (tighter binning), better reliability data (longer L70 lifetime), lower thermal resistance enabling higher drive currents, or a more robust package design resistant to moisture and sulfur. These points are presented as objective, measurable characteristics.
10. Frequently Asked Questions (FAQ)
This section addresses common queries based on the technical parameters.
Q: Can I drive this LED with a voltage source?
A: No. LEDs must be driven by a current-limited source. Connecting directly to a voltage source will cause excessive current flow, damaging the LED. Always use a constant current driver or a series current-limiting resistor.
Q: Why does the luminous flux in my application seem lower than the datasheet value?
A: Datasheet values are typically measured at 25°C junction temperature (Tj) under pulsed conditions. In a real application, higher Tj due to inadequate heat sinking causes flux depreciation. Refer to the relative flux vs. temperature curve.
Q: How do I interpret the "Forever" expired period?
A: It means this specific revision (Rev. 2) has no planned expiration. It is the valid specification for this product version. Always check for newer revisions before finalizing a design.
11. Practical Use Case Examples
Case 1: Architectural Linear Lighting: For a continuous run of LED tape, selecting LEDs from the same flux and color bin is critical to avoid visible brightness or color shifts along the length. The document's binning information guides this selection. Thermal management involves designing the aluminum channel to act as a heatsink, keeping the Tj low to maintain brightness and lifespan.
Case 2: Automotive Signal Lamp: Here, reliability under harsh conditions (temperature cycling, vibration) is key. The datasheet's maximum ratings and thermal characteristics inform the design of the PCB substrate and the drive current level to ensure performance over the vehicle's lifetime. The fast switching capability of LEDs is also leveraged.
12. Operating Principle Introduction
An LED is a semiconductor diode. When a forward voltage is applied, electrons from the n-type material recombine with holes from the p-type material in the active region, releasing energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; the mixture of blue and yellow light appears white to the human eye.
13. Technology Trends
The general trajectory in LED technology focuses on several key areas: Increased Efficacy, achieving more lumens per electrical watt, reducing energy consumption. Improved Color Quality, expanding gamut and achieving higher CRI values with more uniform spectral distribution. Miniaturization, enabling higher density pixelated displays (micro-LEDs) and integration into smaller devices. Enhanced Reliability, with longer operational lifetimes (L90) and better performance under high-temperature and high-humidity conditions. Smart Integration, incorporating drivers, sensors, and communication interfaces directly into the package for intelligent lighting systems.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |